Hua Hong Semiconductor Limited

Hua Hong Semiconductor Limited

HHUSF
Hua Hong Semiconductor LimitedUS flagOther OTC
21.30
USD
- -
- -
41.31BMarket Cap
Hua Hong Semiconductor Limited
HHUSF
(Other OTC)

Recent

price

21.30

P/E

ratio

- -

div

yld

- -

ROIC.AI

2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
0.57
0.78
0.63
0.7
0.78
0.87
0.73
0.74
1.25
1.9
1.55
1.17
1.38
- -
Revenue per Share
0.06
0.11
0.11
0.12
0.14
0.17
0.13
0.08
0.2
0.35
0.19
0.03
0.03
- -
Basic EPS, GAAP
0.14
0.17
- -
0.04
0.11
0.04
-0.59
-0.63
-1.05
-0.95
-0.18
-1.35
-0.67
- -
Free Cash Flow per Basic Share
- -
- -
- -
0.03
0.04
0.04
0.04
- -
- -
- -
- -
0.02
- -
- -
Dividend per Share
-1.13
0.53
0.54
0.62
0.71
1.18
1.06
1.53
1.53
1.61
3.34
3.07
3.09
3.08
Book Value per Share
0.98
1.67
1.41
1.41
1.61
2.46
2.34
2.52
2.76
3.1
5.35
5.17
5.25
5.14
Tangible Book Value per Share
1,034
853
1,034
1,034
1,034
1,071
1,286
1,293
1,300
1,303
1,478
1,717
1,738
1,721
Basic Weighted Avg Shares
585
665
650
721
808
930
933
961
1,631
2,475
2,286
2,004
2,402
- -
Sales/Revenue/Turnover
8.76
16.21
15.4
17.35
19.32
19.96
12.6
-2.35
15.32
23.98
9.65
-5.91
-3.35
- -
Operating Margin (%)
106
84
78
84
104
119
129
206
318
457
500
556
742
- -
Depreciation Expense
62
93
113
129
145
183
162
99
261
450
280
58
55
- -
Net Income, GAAP
12.66
22.95
10.14
16.06
15.78
16.04
14.64
27.7
22.05
18.04
27.17
- -
- -
- -
Effective Tax Rate (%)
10.58
14.01
17.31
17.86
17.97
19.69
17.4
10.34
16.03
18.17
12.25
2.9
2.28
- -
Profit Margin (%)
280
571
520
477
517
1,445
1,021
741
1,311
1,693
5,597
4,270
4,750
3,934
Working Capital
265
183
138
91
32
26
38
536
1,411
1,496
1,926
1,935
2,803
1,949
LT Debt
1,056
1,465
1,491
1,489
1,695
2,704
3,083
3,354
3,685
4,135
8,015
8,907
9,164
8,874
Total Equity
- -
5.21
5.23
6.38
7.7
6.81
3.39
-0.46
4.18
8.47
1.97
- -
- -
- -
Return on Invested Capital (%)
- -
-253.36
16.37
17.98
18.91
13.7
8.36
5.95
7.75
11.03
7.29
- -
- -
- -
Return on Capital (%)
- -
- -
22.19
21.55
21.2
18.38
12.39
5.96
13.19
22.03
7.97
1.14
1.03
4.97
Return on Common Equity (%)

Capital Structure

FRC

in mil. unless spec.
Mar'25
Jun'25
ST Debt
- -
347
LT Borrowings
- -
1,934
LT Finance Leases
- -
15
Preferred Equity and Hybrid Capital
- -
- -
Shares Outstanding
- -
1,727
Market Capitalization
8,078
6,230

Working Capital

FRC

in mil. unless spec.
Mar'25
Jun'25
Total Current Assets
- -
5,345
Cash, Cash Equivalents & STI
- -
3,847
Accounts Receivable, Net
- -
213
Inventories
- -
735
Total Current Liabilities
- -
1,411
Payables & Accruals
- -
- -
ST Debt
- -
347
Deferred Revenue
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
22.6%
25.98%
2.89%
Free Cash Flow
-21.6%
140.98%
-49.84%
Net Income, GAAP
11.56%
22.49%
-5.55%
Sales/Revenue/Turnover
16.27%
24.26%
19.86%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2,004
2025
- -
- -
- -
- -
2,402
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.03
2025
- -
- -
- -
- -
0.03
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.02
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
Business
Hua Hong Semiconductor Limited (HHUSF) is a pure-play semiconductor foundry that manufactures and sells integrated circuits, embedded non-volatile memory including NOR flash and EEPROM, power discrete devices, analog and power management platforms, specialty logic RF processes, and image sensors; it also provides foundry services, ASIC design, multi-project wafer services, mask making, and backend testing and assembly. The company serves markets in consumer electronics, automotive, industrial control, Internet of Things, communications, computing, and power management applications across China, North America, Asia, Europe, and Japan. Founded in 1996 and headquartered at 288 Halei Road, Zhangjiang Hi-Tech Park, Shanghai, China, it operates multiple wafer fabrication facilities including three 200mm fabs in Shanghai with approximately 180,000 wafers monthly capacity, two 300mm fabs through subsidiary Shanghai Huali Microelectronics (HLMC) supporting 28/22-nm processes, and a new 300mm fab in Wuxi. In August 2025, Hua Hong announced plans to acquire a controlling 97.50% stake in its sister company Shanghai Huali Microelectronics (HLMC) from parent Hua Hong Group via share issuance and cash, aiming to consolidate production capacity, diversify process platforms, resolve intra-group competition, and create synergies with its Wuxi 12-inch line; the transaction, progressing smoothly as of late 2025 and pending shareholder and regulatory approvals including a whitewash waiver, targets HLMC's Fab 5 (65nm-28nm) and supports advanced node expansion. The company reported record Q3 2025 revenue of US$635.2 million, up 20.7% year-over-year, with fab utilization at 109.5% and Q4 guidance of US$650-660 million. In October 2025, the U.S. Department of Defense listed Hua Hong as linked to China's military amid ongoing U.S. export restrictions.

Company News

APIChatGPT
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  • Hua Hong Semiconductor Limited (HHUSF) Q4 2025 Earnings Call Transcript

  • Hua Hong Semiconductor (OTCMKTS:HHUSF) Shares Down 13.3% – Here’s Why

  • Hua Hong Semiconductor (OTCMKTS:HHUSF) Trading 0.7% Higher – Should You Buy?

  • Hua Hong Semiconductor Limited (HHUSF) Q3 2025 Earnings Call Transcript