Kulicke and Soffa Industries, Inc.
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- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) designs, manufactures and sells capital equipment, consumable tools and related services used in the assembly of semiconductor devices, including integrated circuits, power discretes, light-emitting diodes (LEDs), sensors and advanced displays; core offerings encompass ball bonding equipment such as high-speed systems for wafer-level bonding, wedge bonding equipment, advanced solutions including flip-chip and thermocompression bonding (TCB) platforms like the APTURA series with fluxless Cu-to-Cu bonding capabilities, advanced dispensing solutions, die-attach systems, placement systems and process solutions; aftermarket products and services provide spares, repairs, upgrades, software including KNeXt fleet management and MES/NPI tools. Founded in 1951 and headquartered in Singapore with primary operational facilities at 1 Tuas Avenue 4, the company serves semiconductor device manufacturers, outsourced assembly and test providers, foundry service providers, automotive electronics suppliers and other electronics manufacturers primarily in the Asia-Pacific region, with approximately 90% of revenue derived from international shipments and additional operations across North America, Europe, China, Taiwan, South Korea, Malaysia and the Philippines. Recent developments include the appointment of Lester Wong as Interim CEO effective December 1, 2025 following Dr. Fusen Chen's retirement for health reasons, alongside the retirement of Executive Vice President Chan Pin Chong and realignment of segment leadership under Ivy Qin and John Molnar; the company launched ATPremier MEM PLUS for high-volume memory and Asterion-PW for power devices in March 2025, formed a strategic AI manufacturing partnership with Lavorro in July 2025 integrating APTURA and KNeXt with FabAssist.ai, collaborated with ROHM on CuFirst hybrid bonding process and secured foundry orders for fluxless TCB in November 2024, initiated a $300 million share repurchase program in December 2024 after deploying $900 million cumulatively, joined the Resonac-led US-JOINT consortium in July 2024 and raised its quarterly dividend to $0.205 per share in June and March 2025.
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