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    Electronic technology

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    Semiconductors
Hana Micron Inc.

Hana Micron Inc.

KKRX:067310
36,900.00
KRW
-1,900.00
(-4.90%)
2,248.04EPS
16.61P/E
1.85TMarket Cap
Nov 18Next Earn
Hana Micron Inc.
KRX:067310
(Korea Stock Exchange)

Recent

price

36,900.00

P/E

ratio

16.61

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
KRW
13,478.11
10,666.98
8,197.29
8,663.92
9,222
8,682.56
7,803.06
11,333.43
14,623.16
13,933.93
11,061.85
15,189.06
17,670.35
16,505.53
22,227.34
25,646.61
28,224.63
Revenue per Share
1,093.19
317.1
-316.11
-628.84
263.99
81.9
-865.08
199.01
42.64
-66.34
-342.51
582.02
55.91
-230.44
-423
637
1,674.13
Basic EPS, GAAP
-2,763.82
-647.43
-1,341.97
-816.3
566.02
-883.77
31.82
-1,529.57
-2,414.09
-1,551.08
-644.96
-798.34
-4,021.88
-4,226.6
-1,988.34
405.98
830.93
Free Cash Flow per Basic Share
- -
118.46
65.77
- -
- -
65.39
34.13
- -
47.69
126.65
81.17
177.36
155.17
103.78
84.95
124.49
- -
Dividend per Share
4,082.21
4,879.56
4,307.65
3,650.58
4,131.41
4,218.94
3,737.82
4,080.61
4,086.33
3,616.3
3,098.4
4,859.32
4,669.08
5,457.09
5,607.43
5,999.68
7,090.03
Book Value per Share
3,928.64
4,783.42
4,166.83
3,481.96
3,990.64
4,109.11
3,606.84
3,682.9
3,648.56
3,168.72
2,712.49
4,524.95
4,298.91
4,823.23
5,075.26
5,509.1
6,573.24
Tangible Book Value per Share
21
28
32
32
32
33
32
32
33
36
49
44
51
59
56
60
61
Basic Weighted Avg Shares
289,479
294,560
258,807
278,115
294,532
286,239
252,294
365,814
479,949
498,198
539,460
669,512
894,396
967,971
1,250,693
1,534,419
1,730,322
Sales/Revenue/Turnover
11.4
4.62
-2.84
-1.97
8.09
5.73
-7.12
11.22
11.13
9.08
9.46
15.67
11.58
5.98
8.54
8.32
10.86
Operating Margin (%)
26,333
30,581
33,049
36,757
28,635
29,730
29,499
31,614
41,113
50,620
58,862
77,517
91,477
122,229
138,074
157,836
162,753
Depreciation Expense
23,479
8,756
-9,980
-20,186
8,431
2,700
-27,970
6,423
1,400
-2,372
-16,703
25,655
2,830
-13,514
-23,801
38,111
102,633
Net Income, GAAP
3.65
- -
- -
- -
45.8
53.64
- -
31.4
36.68
38.2
67.8
26.46
35.77
93.11
- -
18.05
13.3
Effective Tax Rate (%)
8.11
2.97
-3.86
-7.26
2.86
0.94
-11.09
1.76
0.29
-0.48
-3.1
3.83
0.32
-1.4
-1.9
2.48
5.93
Profit Margin (%)
-79,181
-43,455
-22,728
-82,706
-119,492
-116,562
-152,774
-142,345
-183,019
-82,193
-80,984
-9,106
-57,509
-206,312
-3,598
-125,497
-135,805
Working Capital
51,124
41,533
93,474
68,074
23,599
34,228
18,084
44,560
61,009
195,973
200,365
210,252
419,767
503,753
691,916
507,923
443,503
LT Debt
100,718
149,682
138,317
125,603
139,746
147,389
140,301
181,738
206,250
236,460
246,739
448,412
488,216
544,387
605,829
652,676
732,690
Total Equity
14.2
- -
- -
- -
3.98
2.23
- -
7.66
7.23
5.02
2.6
10.03
6.5
0.3
- -
5.99
9.06
Return on Invested Capital (%)
14.1
- -
- -
- -
4.01
1.31
- -
0.25
-2.38
-1.78
-5.03
-0.38
-3.66
-1.84
- -
3.71
3.76
Return on Capital (%)
30.14
7.05
-6.93
-15.8
6.78
2.01
-21.67
5.09
1.05
-1.7
-11.81
12.43
1.05
-4.72
-6.99
9.89
24.52
Return on Common Equity (%)

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
594,915
568,978
666,025
LT Borrowings
532,104
507,335
439,008
LT Finance Leases
698
588
4,495
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
66
66
66
Market Capitalization
1,467,924
1,711,454
1,847,705

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
729,533
701,653
815,397
Cash, Cash Equivalents & STI
120,834
97,266
156,971
Accounts Receivable, Net
240,021
259,163
229,328
Inventories
265,102
247,059
286,132
Total Current Liabilities
858,089
827,150
951,202
Payables & Accruals
- -
- -
- -
ST Debt
594,915
568,978
666,025
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
17.84%
24.23%
7.73%
Free Cash Flow
-467.93%
67.11%
-121.71%
Net Income, GAAP
-210.63%
-220.81%
-260.12%
Sales/Revenue/Turnover
19.42%
23.57%
22.69%
Total Cash Common Dividend
- -
21.96%
55.81%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
268,961
285,938
312,111
383,683
1,250,693
2025
311,773
340,179
432,396
450,071
1,534,419
2026
507,676
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-265.17
-178.26
-9
93.04
-423
2025
-58
54
262
344.1
637
2026
1,019
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
84.95
2025
- -
- -
- -
- -
124.49
2026
- -
- -
- -
- -
- -
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Business
HANA Micron Inc. HANA Micron Inc. (067310.KQ) engages in the semiconductor back-end process, providing outsourced semiconductor assembly and test (OSAT) solutions including packaging, testing, bumping, and engineering services. The company offers flip chip ball grid array (FCBGA), wafer level chip scale packaging (WLCSP), system in package (SiP), multi-chip packaging, quad flat no lead (QFN), lead frame packages, laminate packages, and wafer level packages; test solutions encompassing wafer test, package test, module test, and platforms for SOC, RF, PMIC, and sensors; bumping solutions such as WLCSP, flip chip, SiP, and FCQFN; test IT systems for production management, real-time monitoring, data analysis, and web reports; as well as electrical and visual inspection services. These products serve applications in communication equipment, mobile phones, PDAs, cameras, DVDs, MP3 players, digital televisions, automotive, IoT, consumer electronics, and AI-driven devices; the company operates production facilities in South Korea, Vietnam, and Brazil, with sales networks in Korea, the USA, Vietnam, and Brazil, targeting memory, system-on-chip, mobile, home appliances, and fabless semiconductor firms. Founded in 2001 and headquartered in Asan-si, South Korea, HANA Micron Inc. employs over 4,000 people globally and listed on KOSDAQ in 2005. Recent developments include expanded collaboration with Samsung on packaging tests for AI phones like Galaxy 24 and partnerships with SK Hynix for memory production in Vietnam; a memorandum of understanding with LB Semicon for flip chip package promotion amid AI semiconductor demand; ongoing Phase 1 and planned Phase 2 expansions at its Vietnam Bac Giang plant for system semiconductors with capacity targeting 300 million units annually; presentation of advanced 2.xD packaging solutions (HICTM) using bridge die and copper posts at ECTC 2025, earning top paper recognition alongside Intel and TSMC; and an approved spin-off of its investment business sector effective August 2025, transitioning to HANA Semiconductor Holdings Co. as the surviving entity while establishing a new HANA Micron for core operations.