Hana Micron Inc.
KKRX:06731035,850.00
KRW
-1,050.00
(-2.85%)
ISIN
KR7067310003
Return %
Stock
S&P 500
1Y
38.42
14.39
3Y
72.43
81.42
5Y
179.52
68.62
Capital Structure
KRW
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in mil. unless spec.Working Capital
KRW
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in mil. unless spec.Growth Rates
KRW
•
in mil. unless spec.Quarterly Revenue
KRW
•
in mil. unless spec.Quarterly Earnings Per Share
KRW
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- CEO
- Dong-Chul Lee
- Full Time Employees
- 771
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- 77 Yeonamyulgeum‑ro, Eumbong‑myeon, Asan, 31413, South Korea Asan-si SC South Korea 31413
- IPO Date
- Oct 11, 2005
- Website
- hanamicron.com
- Similar Companies
- Business
- HANA Micron Inc. HANA Micron Inc. (067310.KQ) engages in the semiconductor back-end process, providing outsourced semiconductor assembly and test (OSAT) solutions including packaging, testing, bumping, and engineering services. The company offers flip chip ball grid array (FCBGA), wafer level chip scale packaging (WLCSP), system in package (SiP), multi-chip packaging, quad flat no lead (QFN), lead frame packages, laminate packages, and wafer level packages; test solutions encompassing wafer test, package test, module test, and platforms for SOC, RF, PMIC, and sensors; bumping solutions such as WLCSP, flip chip, SiP, and FCQFN; test IT systems for production management, real-time monitoring, data analysis, and web reports; as well as electrical and visual inspection services. These products serve applications in communication equipment, mobile phones, PDAs, cameras, DVDs, MP3 players, digital televisions, automotive, IoT, consumer electronics, and AI-driven devices; the company operates production facilities in South Korea, Vietnam, and Brazil, with sales networks in Korea, the USA, Vietnam, and Brazil, targeting memory, system-on-chip, mobile, home appliances, and fabless semiconductor firms. Founded in 2001 and headquartered in Asan-si, South Korea, HANA Micron Inc. employs over 4,000 people globally and listed on KOSDAQ in 2005. Recent developments include expanded collaboration with Samsung on packaging tests for AI phones like Galaxy 24 and partnerships with SK Hynix for memory production in Vietnam; a memorandum of understanding with LB Semicon for flip chip package promotion amid AI semiconductor demand; ongoing Phase 1 and planned Phase 2 expansions at its Vietnam Bac Giang plant for system semiconductors with capacity targeting 300 million units annually; presentation of advanced 2.xD packaging solutions (HICTM) using bridge die and copper posts at ECTC 2025, earning top paper recognition alongside Intel and TSMC; and an approved spin-off of its investment business sector effective August 2025, transitioning to HANA Semiconductor Holdings Co. as the surviving entity while establishing a new HANA Micron for core operations.