Kostek Systems, Inc.
KKRX:1696705,400.00
KRW
-200.00
(-3.57%)
ISIN
KR7169670007
Return %
Stock
S&P 500
1Y
-11.76
14.39
3Y
-44.50
81.42
5Y
- -
68.62
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
KRW
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
KRW
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in mil. unless spec.Company Description
- Full Time Employees
- 67
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Pyeongtaek-si South Korea
- IPO Date
- Jan 21, 2022
- Website
- kosteks.com
- Similar Companies
- Business
- Kostek Systems, Inc. is a South Korea-based technology company specializing in the design, development, and manufacturing of advanced semiconductor manufacturing equipment and display processing systems. The company operates through core segments encompassing wafer transfer automation, advanced packaging bonding systems, and next-generation display production equipment. Its semiconductor product portfolio includes wafer transfer systems such as Equipment Front End Modules (EFEM), nitrogen purge EFEM units, vacuum pod transfer systems, and localized vacuum cluster platforms; wafer handling components including vacuum transfer robots, atmospheric robots, pre-aligners, and load port modules; and advanced wafer bonding solutions including temporary wafer bonding systems, wafer de-bonding systems, collective die-to-wafer bonding systems, and thermal and laser-assisted bonding machinery utilized in Through-Silicon Via (TSV) stacking and fan-out wafer-level packaging. For the display sector, Kostek Systems offers Micro LED and Micro OLEDoS chip transfer systems; thermal and laser eutectic bonders for augmented reality (AR) and virtual reality (VR) devices; optically clear adhesive (OCA) and optically clear resin (OCR) bonding systems; and polarizer lamination and autoclave equipment. In addition, the company provides equipment customization, system integration, retrofitting, and technical support services. Kostek Systems primarily serves semiconductor fabrication facilities, outsourced semiconductor assembly and test (OSAT) vendors, and display panel manufacturers across South Korea and greater Asia, with key clients including leading integrated device manufacturers such as Samsung Electronics and SK Hynix. Founded in 2000, Kostek Systems is headquartered in Pyeongtaek-si, Gyeonggi-do, South Korea. In recent developments, Kostek Systems has strategically expanded its high-bandwidth memory (HBM) and artificial intelligence (AI) semiconductor equipment portfolio by developing proprietary TSV peel-off de-bonding systems and advancing joint qualification evaluations with major memory chipmakers. The company has also broadened its technological scope into processing equipment for high-bandwidth memory processing-in-memory (HBM-PIM) architectures, power semiconductor sinter bonders, and ultra-high-resolution Micro LED mass-transfer bonders. In 2026, Kostek Systems completed a leadership reorganization with the appointment of Chief Executive Officer Gun-Woo Bae to drive operational execution and commercial expansion for next-generation packaging lines, while advancing strategic initiatives to transition its public listing from the KONEX market to the KOSDAQ exchange.