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Malaysian Pacific Industries Bhd.

Malaysian Pacific Industries Bhd.

MMYX:MPI
40.30
MYR
+0.10
(+0.25%)
52.52P/E
Nov 25Next Earn
Malaysian Pacific Industries Bhd.
MYX:MPI
(Bursa Malaysia)

Recent

price

40.30

P/E

ratio

52.52

div

yld

- -

ROIC.AI

2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
TTM
MYR
7.29
6.15
6.37
6.83
7.32
7.7
8.13
8.12
7.83
8.22
10.05
12.17
10.28
10.53
10.7
- -
13.32
Revenue per Share
0.39
-0.1
0.06
0.24
0.57
0.83
0.94
0.75
0.68
0.8
1.37
1.66
0.31
0.83
0.77
- -
0.95
Basic EPS, GAAP
0.14
0.04
0.27
1.01
0.69
1.52
1.2
1.07
1.1
0.91
0.37
-0.19
0.68
1.54
0.5
- -
-0.67
Free Cash Flow per Basic Share
0.2
0.1
0.09
0.15
0.2
0.23
0.27
0.29
0.27
0.27
0.3
0.35
0.35
0.35
0.35
- -
0.3
Dividend per Share
3.56
3.46
3.78
3.87
4.52
5.16
5.9
6.25
6.68
7.24
8.56
10.06
10.13
10.51
10.48
11.09
11.09
Book Value per Share
3.51
3.4
3.78
3.87
4.52
5.16
5.9
6.25
6.68
7.24
8.56
10.06
10.13
10.51
10.48
11.09
11.09
Tangible Book Value per Share
194
194
193
189
190
190
190
190
190
190
198
199
199
199
199
- -
199
Basic Weighted Avg Shares
1,415
1,192
1,226
1,292
1,390
1,463
1,545
1,542
1,488
1,565
1,988
2,416
2,045
2,095
2,131
2,650
2,650
Sales/Revenue/Turnover
6.24
-1.87
2.14
5.26
11.1
13.5
16.29
13.49
12.69
13.4
18.04
18.3
5.24
10.67
8.22
9.26
9.26
Operating Margin (%)
194
194
194
205
204
209
193
182
174
179
199
293
330
324
287
309
309
Depreciation Expense
75
-20
11
45
108
158
178
142
128
153
272
329
61
164
154
188
188
Net Income, GAAP
10.35
- -
31.98
17.24
19.86
- -
12.85
16.68
15.69
15.47
8.98
12.39
13.01
8.13
5.32
9.65
9.65
Effective Tax Rate (%)
5.3
-1.66
0.89
3.49
7.8
10.76
11.52
9.24
8.62
9.78
13.67
13.61
3
7.85
7.22
7.1
7.1
Profit Margin (%)
-30
-107
-8
113
217
421
656
727
807
854
903
936
978
1,127
1,270
989
989
Working Capital
12
- -
15
- -
- -
- -
29
- -
- -
24
37
204
101
28
119
220
220
LT Debt
969
934
916
907
1,028
1,170
1,329
1,405
1,499
1,619
1,985
2,322
2,360
2,466
2,476
2,637
2,637
Total Equity
6.72
- -
1.6
5.37
11.67
- -
16.78
11.99
10.68
11.16
17.26
16.58
3.58
7.85
6.37
8.05
8.05
Return on Invested Capital (%)
8.24
- -
1.04
3.8
9.06
- -
10.61
7.94
6.49
8.14
11.7
11.82
0.61
3.94
4.26
4.79
4.79
Return on Capital (%)
10.08
-2.68
1.52
6.23
13.63
17.13
16.95
12.35
10.45
11.55
17.66
17.79
3.06
8.01
7.37
8.78
8.78
Return on Common Equity (%)

Capital Structure

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
ST Debt
4
3
10
LT Borrowings
154
205
208
LT Finance Leases
13
12
12
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
199
199
199
Market Capitalization
6,429
5,725
9,878

Working Capital

MYR

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
Total Current Assets
1,856
1,707
1,584
Cash, Cash Equivalents & STI
1,202
944
745
Accounts Receivable, Net
411
463
532
Inventories
217
274
279
Total Current Liabilities
511
640
595
Payables & Accruals
- -
- -
- -
ST Debt
4
3
10
Deferred Revenue
- -
- -
- -

Growth Rates

MYR

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
8.66%
6%
6.49%
Free Cash Flow
-88.45%
-156%
-233.81%
Net Income, GAAP
20.35%
24.7%
22.28%
Sales/Revenue/Turnover
6.88%
6.93%
24.34%
Total Cash Common Dividend
6.52%
6.27%
14.39%

Quarterly Revenue

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
513
523
526
533
2,095
2025
517
530
520
564
2,131
2026
635
627
652
737
2,650

Quarterly Earnings Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.08
0.16
0.16
0.42
0.83
2025
0.15
0.2
0.2
0.22
0.77
2026
0.27
0.29
0.17
0.22
- -

Quarterly Dividends Per Share

MYR

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
0.25
0.35
2025
- -
- -
- -
0.25
0.35
2026
- -
- -
- -
0.3
- -
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Business
Malaysian Pacific Industries Berhad (Ticker: 3867.KL) is a leading integrated semiconductor manufacturer specializing in the design, assembly, and testing of semiconductor devices. It produces a comprehensive range of products and services including semiconductor packaging, testing services, integrated circuit assembly, and electronic manufacturing services. The company serves various technology sectors, providing advanced packaging and testing solutions for semiconductors used in communications, consumer electronics, computing, automotive, and industrial applications. Founded in 1974 and headquartered in Penang, Malaysia, Malaysian Pacific Industries operates manufacturing facilities primarily in Malaysia with a focus on serving global markets. In the recent 1-2 years, Malaysian Pacific Industries has pursued strategic expansions and operational enhancements to boost its manufacturing capabilities and service offerings. Among these recent developments are investments in new advanced packaging technologies and partnerships to improve its service portfolio in semiconductor assembly and testing. The company has also enhanced its production capacity to meet increasing global demand for semiconductor components amid industry-wide growth. These strategic moves reflect Malaysian Pacific Industries' commitment to expanding its footprint in the semiconductor industry, aligning with the latest market needs and technological advancements. Operating mainly in the semiconductor sector, Malaysian Pacific Industries targets leading semiconductor and electronics manufacturers worldwide, focusing on high-technology integrated circuit solutions. Its product portfolio includes wafer bumping, flip chip packaging, molded packaging, lead frame packaging, and testing services, addressing the needs of leading chipset designers and semiconductor manufacturers. The company’s geographic focus spans Asia with operations based in Malaysia, supporting customers worldwide through its high-quality manufacturing and testing infrastructure. Malaysian Pacific Industries is listed on the Bursa Malaysia Stock Exchange, and over the years it has developed a reputation for reliability and technological excellence in electronic manufacturing services, particularly for semiconductor companies seeking sophisticated packaging and testing capabilities. The company’s continued investments in technology and strategic alliances aim to maintain its competitive edge in the rapidly evolving semiconductor market. As of the latest updates, there have been no significant rebranding or name changes, but the company remains actively engaged in enhancing its technological capabilities and expanding its operational scale to capture emerging opportunities in semiconductor manufacturing and testing. This positions Malaysian Pacific Industries as a key player in the semiconductor supply chain, maintaining a balanced focus on innovation, quality, and service expansion.