Malaysian Pacific Industries Bhd.
MMYX:MPI40.30
MYR
+0.10
(+0.25%)
ISIN
MYL3867OO008
Return %
Stock
S&P 500
1Y
34.87
14.20
3Y
50.15
81.12
5Y
-13.63
68.34
Capital Structure
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in mil. unless spec.Working Capital
MYR
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in mil. unless spec.Growth Rates
MYR
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in mil. unless spec.Quarterly Revenue
MYR
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in mil. unless spec.Quarterly Earnings Per Share
MYR
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in mil. unless spec.Quarterly Dividends Per Share
MYR
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in mil. unless spec.Company Description
- CEO
- Manuel Zarauza Brandulas
- Full Time Employees
- 9,183
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Jalan Lapangan Terbang Kuala Lumpur WP Malaysia 31350
- IPO Date
- Jan 3, 1984
- Website
- mpind.my
- Similar Companies
- Business
- Malaysian Pacific Industries Berhad (Ticker: 3867.KL) is a leading integrated semiconductor manufacturer specializing in the design, assembly, and testing of semiconductor devices. It produces a comprehensive range of products and services including semiconductor packaging, testing services, integrated circuit assembly, and electronic manufacturing services. The company serves various technology sectors, providing advanced packaging and testing solutions for semiconductors used in communications, consumer electronics, computing, automotive, and industrial applications. Founded in 1974 and headquartered in Penang, Malaysia, Malaysian Pacific Industries operates manufacturing facilities primarily in Malaysia with a focus on serving global markets. In the recent 1-2 years, Malaysian Pacific Industries has pursued strategic expansions and operational enhancements to boost its manufacturing capabilities and service offerings. Among these recent developments are investments in new advanced packaging technologies and partnerships to improve its service portfolio in semiconductor assembly and testing. The company has also enhanced its production capacity to meet increasing global demand for semiconductor components amid industry-wide growth. These strategic moves reflect Malaysian Pacific Industries' commitment to expanding its footprint in the semiconductor industry, aligning with the latest market needs and technological advancements. Operating mainly in the semiconductor sector, Malaysian Pacific Industries targets leading semiconductor and electronics manufacturers worldwide, focusing on high-technology integrated circuit solutions. Its product portfolio includes wafer bumping, flip chip packaging, molded packaging, lead frame packaging, and testing services, addressing the needs of leading chipset designers and semiconductor manufacturers. The company’s geographic focus spans Asia with operations based in Malaysia, supporting customers worldwide through its high-quality manufacturing and testing infrastructure. Malaysian Pacific Industries is listed on the Bursa Malaysia Stock Exchange, and over the years it has developed a reputation for reliability and technological excellence in electronic manufacturing services, particularly for semiconductor companies seeking sophisticated packaging and testing capabilities. The company’s continued investments in technology and strategic alliances aim to maintain its competitive edge in the rapidly evolving semiconductor market. As of the latest updates, there have been no significant rebranding or name changes, but the company remains actively engaged in enhancing its technological capabilities and expanding its operational scale to capture emerging opportunities in semiconductor manufacturing and testing. This positions Malaysian Pacific Industries as a key player in the semiconductor supply chain, maintaining a balanced focus on innovation, quality, and service expansion.