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Hua Hong Grace Semiconductor Limited Class A

Hua Hong Grace Semiconductor Limited Class A

4.06
THB
-0.44
(-9.78%)
1.45TMarket Cap
Nov 05Next Earn
Hua Hong Grace Semiconductor Limited Class A
SET:HUAHONG23
(Stock Exchange of Thailand)

Recent

price

4.06

P/E

ratio

- -

div

yld

- -

ROIC.AI

2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
USD
- -
- -
- -
- -
- -
- -
- -
- -
0.01
0.01
0.01
0.01
0.01
- -
Revenue per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Basic EPS, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
-0.01
-0.01
- -
-0.01
- -
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.02
0.02
- -
Book Value per Share
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.02
0.02
- -
Tangible Book Value per Share
196,526
162,224
196,525
196,525
196,632
203,526
244,373
245,826
247,145
247,759
280,944
326,445
330,298
330,304
Basic Weighted Avg Shares
585
665
650
721
808
930
933
961
1,631
2,475
2,286
2,004
2,402
- -
Sales/Revenue/Turnover
8.76
16.21
15.4
17.35
19.32
19.96
12.6
-2.35
15.32
23.98
9.65
-5.91
-3.35
- -
Operating Margin (%)
106
84
78
84
104
119
129
206
318
457
500
556
742
- -
Depreciation Expense
62
93
113
129
145
183
162
99
261
450
280
58
55
- -
Net Income, GAAP
12.66
22.95
10.14
16.06
15.78
16.04
14.64
27.7
22.05
18.04
27.17
- -
- -
- -
Effective Tax Rate (%)
10.58
14.01
17.31
17.86
17.97
19.69
17.4
10.34
16.03
18.17
12.25
2.9
2.28
- -
Profit Margin (%)
280
571
520
477
517
1,445
1,021
741
1,311
1,693
5,597
4,270
4,750
- -
Working Capital
265
183
138
91
32
26
38
536
1,411
1,496
1,926
1,935
2,803
- -
LT Debt
1,056
1,465
1,491
1,489
1,695
2,704
3,083
3,354
3,685
4,135
8,015
8,907
9,164
- -
Total Equity
- -
6.26
6.89
7.69
7.69
6.81
3.41
-0.46
4.18
8.47
1.96
- -
- -
- -
Return on Invested Capital (%)
- -
6.5
7.03
8.12
8.73
8.07
5.82
4.75
6.55
9.27
6.26
- -
- -
- -
Return on Capital (%)
- -
7.38
7.61
8.65
9.12
9.51
7.37
4.17
9.69
15.25
6
0.93
0.85
- -
Return on Common Equity (%)

Capital Structure

USD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
407
- -
- -
LT Borrowings
2,787
- -
- -
LT Finance Leases
16
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
330,298
1,330
1,330
Market Capitalization
46,126
- -
- -

Working Capital

USD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
6,607
- -
- -
Cash, Cash Equivalents & STI
4,894
- -
- -
Accounts Receivable, Net
237
- -
- -
Inventories
760
- -
- -
Total Current Liabilities
1,856
- -
- -
Payables & Accruals
- -
- -
- -
ST Debt
407
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

USD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
22.6%
25.98%
2.89%
Free Cash Flow
-21.6%
140.98%
-49.84%
Net Income, GAAP
11.56%
22.49%
-5.55%
Sales/Revenue/Turnover
16.27%
24.26%
19.86%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2,004
2025
- -
- -
- -
- -
2,402
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Hua Hong Semiconductor Limited conducts wafer foundry manufacturing and related services, focusing on diversified specialty process platforms including embedded/standalone non-volatile memory, logic and mixed-signal, radio frequency, power management, and automotive solutions; it also provides design services such as IP development, full-custom layout design, and customer-specific integrated solutions, along with tape-out and production-support services; in addition, the company engages in related backend testing and mass production activities, multi-project wafer services, and mask marking services. The company operates a foundry services business with capacity expansion and process development across advanced nodes; it markets to consumer electronics, industrial and automotive electronics, communications, and computer end markets, with applications spanning embedded memory, power management, analog and RF, as well as digital logic. Hua Hong Semiconductor Limited is headquartered in Shanghai, China, and is listed on public markets; it maintains manufacturing and service operations in mainland China and internationally, serving clients globally. The company was founded in 2001 and maintains strategic manufacturing footprints intended to support scalable capacity and technology leadership; it also pursues partnerships and collaborations to advance process technology platforms such as 12-inch diffusion processes and related device platforms. Recent major developments include capacity expansions and advancements in 12-inch wafer technology, enhancements to MOSFET and IGBT platforms, and collaborations or strategic alignments aimed at reinforcing its position as a leading foundry for specialty processes in the Asia-Pacific region. Hua Hong Semiconductor Limited’s comprehensive suite of products and services encompasses wafer fabrication, mature and advanced process technologies, foundry services, IP and design support, tape-out and turnkey solutions, backend testing, packaging assistance, and related engineering services, all targeted at diversified end-markets across consumer, industrial, automotive, telecom, and computing sectors.

Company News

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