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Darbond Technology Co., Ltd. Class A

Darbond Technology Co., Ltd. Class A

SSSE:688035
57.80
CNY
+2.49
(+4.50%)
0.91EPS
104.49P/E
13.06BMarket Cap
Oct 24Next Earn
Darbond Technology Co., Ltd. Class A
SSE:688035
(Shanghai Stock Exchange)

Recent

price

57.80

P/E

ratio

104.49

div

yld

0.73%

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
1.97
2.3
4.17
5.56
8
6.52
8.26
10.93
12.09
Revenue per Share
-0.02
0.25
0.5
0.72
1.06
0.72
0.69
0.76
0.88
Basic EPS, GAAP
-0.25
-0.07
0.06
-1.5
-1.86
-1.42
1.29
-1.71
- -
Free Cash Flow per Basic Share
0.04
0.02
0.02
- -
0.04
0.32
0.27
0.36
0.42
Dividend per Share
3.13
3.48
3.99
5.57
15.5
15.96
16.13
16.34
16.88
Book Value per Share
2.84
3.2
3.7
4.61
14.72
14.97
15.15
13.92
14.47
Tangible Book Value per Share
100
142
100
105
116
143
141
142
142
Basic Weighted Avg Shares
197
327
417
584
929
932
1,167
1,547
1,711
Sales/Revenue/Turnover
1.51
14.66
12.47
14.68
14.46
10.66
7.88
8.71
9.24
Operating Margin (%)
11
13
16
19
25
32
55
71
- -
Depreciation Expense
-2
36
50
76
123
103
97
108
124
Net Income, GAAP
- -
13.97
12.26
10.9
10.56
14.43
11.92
6.29
- -
Effective Tax Rate (%)
-0.86
10.92
12.02
12.99
13.25
11.05
8.35
6.95
7.27
Profit Margin (%)
125
144
185
242
1,719
1,029
1,279
1,058
1,070
Working Capital
- -
- -
6
42
32
21
4
164
154
LT Debt
314
347
396
592
2,201
2,287
2,310
2,350
2,431
Total Equity
- -
9.06
12.03
13.78
7.64
4.34
3.79
4.25
- -
Return on Invested Capital (%)
- -
11.04
13.71
14.65
8.77
4.73
4.38
4.45
- -
Return on Capital (%)
- -
10.81
13.43
15.28
8.79
4.6
4.27
4.66
5.26
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
163
136
71
LT Borrowings
161
156
152
LT Finance Leases
4
3
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
142
142
142
Market Capitalization
6,863
7,684
13,058

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,882
1,843
1,807
Cash, Cash Equivalents & STI
849
882
850
Accounts Receivable, Net
420
412
444
Inventories
219
279
272
Total Current Liabilities
824
755
738
Payables & Accruals
- -
- -
- -
ST Debt
163
136
71
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
65.58%
1.71%
Free Cash Flow
- -
-642.9%
-232.93%
Net Income, GAAP
- -
20.44%
10.45%
Sales/Revenue/Turnover
- -
31.43%
32.61%
Total Cash Common Dividend
- -
335.62%
34.03%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
203
260
321
383
1,167
2025
316
374
- -
457
1,547
2026
406
474
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.1
0.14
0.19
0.26
0.69
2025
0.19
0.13
- -
0.27
0.76
2026
0.24
0.24
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.01
0.25
0.01
- -
0.27
2025
- -
0.25
- -
0.01
0.36
2026
0.01
0.16
- -
- -
- -
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Business
Darbond Technology Co., Ltd. is a China-based materials science company primarily engaged in the research, development, manufacture, and commercialization of high-performance polymer packaging materials, electronic bonding adhesives, and thermal management solutions. Founded in 2003 and headquartered in Yantai, Shandong Province, the company operates across four primary business segments: Semiconductor Packaging Materials, Smart Terminal Materials, New Energy Application Materials, and High-End Equipment Materials. Its core product portfolio comprises integrated circuit packaging solutions, including conductive and non-conductive die attach pastes, die attach films, flip-chip and board-level underfill encapsulants, wafer-level packaging materials, lid attach adhesives, and thermal interface materials; smart terminal and consumer electronics adhesives, including reactive polyurethane hot melt adhesives, ultraviolet curable adhesives, moisture-curing adhesives, acoustic component sealants, camera module adhesives, and display structural bonding agents; new energy vehicle and power battery materials, including battery pack structural adhesives, cell-to-pack and cell-to-chassis elastic bonding agents, thermally conductive potting sealants, and photovoltaic conductive pastes; and industrial assembly materials, including engineered epoxy adhesives, anaerobic locking compounds, silicone elastomeric sealants, and protective conformal coatings. Darbond Technology markets its products to semiconductor outsourced assembly and test providers, consumer electronics original equipment manufacturers, electric vehicle battery manufacturers, and clean technology enterprises across China and select overseas markets. In recent developments, the company has expanded its manufacturing footprint with advanced production lines in Yantai and East China, accelerated the commercial qualification and volume deployment of proprietary flip-chip underfill and wafer-level packaging formulations for advanced artificial intelligence computing hardware, broadened strategic supply arrangements with tier-one electric vehicle battery producers, and executed targeted investments and technical partnerships in upstream electronic-grade resins to bolster raw material supply chain security.