Darbond Technology Co., Ltd. Class A
SSSE:68803555.31
CNY
-2.20
(-3.83%)
ISIN
CNE100005P72
Return %
Stock
S&P 500
1Y
7.52
14.20
3Y
9.85
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Tian An Chen
- Full Time Employees
- 980
- Sector
- Process industries
- Industry
- Industrial specialties
- Address
- Yantai China
- IPO Date
- Sep 19, 2022
- Website
- darbond.com
- Similar Companies
- Business
- Darbond Technology Co., Ltd. is a China-based materials science company primarily engaged in the research, development, manufacture, and commercialization of high-performance polymer packaging materials, electronic bonding adhesives, and thermal management solutions. Founded in 2003 and headquartered in Yantai, Shandong Province, the company operates across four primary business segments: Semiconductor Packaging Materials, Smart Terminal Materials, New Energy Application Materials, and High-End Equipment Materials. Its core product portfolio comprises integrated circuit packaging solutions, including conductive and non-conductive die attach pastes, die attach films, flip-chip and board-level underfill encapsulants, wafer-level packaging materials, lid attach adhesives, and thermal interface materials; smart terminal and consumer electronics adhesives, including reactive polyurethane hot melt adhesives, ultraviolet curable adhesives, moisture-curing adhesives, acoustic component sealants, camera module adhesives, and display structural bonding agents; new energy vehicle and power battery materials, including battery pack structural adhesives, cell-to-pack and cell-to-chassis elastic bonding agents, thermally conductive potting sealants, and photovoltaic conductive pastes; and industrial assembly materials, including engineered epoxy adhesives, anaerobic locking compounds, silicone elastomeric sealants, and protective conformal coatings. Darbond Technology markets its products to semiconductor outsourced assembly and test providers, consumer electronics original equipment manufacturers, electric vehicle battery manufacturers, and clean technology enterprises across China and select overseas markets. In recent developments, the company has expanded its manufacturing footprint with advanced production lines in Yantai and East China, accelerated the commercial qualification and volume deployment of proprietary flip-chip underfill and wafer-level packaging formulations for advanced artificial intelligence computing hardware, broadened strategic supply arrangements with tier-one electric vehicle battery producers, and executed targeted investments and technical partnerships in upstream electronic-grade resins to bolster raw material supply chain security.