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Chengdu Screen Microelectronics Co. Ltd. Class A

Chengdu Screen Microelectronics Co. Ltd. Class A

SSSE:688053
36.70
CNY
+0.82
(+2.29%)
-0.09EPS
3.80BMarket Cap
Chengdu Screen Microelectronics Co. Ltd. Class A
SSE:688053
(Shanghai Stock Exchange)

Recent

price

36.70

P/E

ratio

- -

div

yld

0.01%

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.88
1.05
2.24
2.95
2.73
2.02
1.44
1.94
2.26
Revenue per Share
0.3
0.34
1.02
1.29
1.07
0.48
-0.21
-0.21
-0.02
Basic EPS, GAAP
-0.02
0.04
-0.2
0.11
-1.08
-1.14
-1.12
-0.35
- -
Free Cash Flow per Basic Share
0.02
0.01
0.09
0.02
0.01
- -
0.31
- -
- -
Dividend per Share
0.99
1.59
2.94
4.24
16.62
16.8
16.08
15.87
15.98
Book Value per Share
0.91
1.52
2.88
4.12
16.53
16.65
15.95
15.51
15.63
Tangible Book Value per Share
75
100
74
75
85
100
100
99
96
Basic Weighted Avg Shares
66
105
166
222
233
201
144
192
217
Sales/Revenue/Turnover
41.95
43.06
55.22
52.98
44.09
20.13
-21.07
-9.52
-1.5
Operating Margin (%)
5
8
10
17
23
39
54
67
- -
Depreciation Expense
22
34
75
97
91
48
-21
-21
-2
Net Income, GAAP
13.57
13.15
14.59
14.19
8.38
10.48
- -
- -
- -
Effective Tax Rate (%)
33.84
32.39
45.6
43.71
39.26
23.82
-14.6
-10.83
-0.95
Profit Margin (%)
17
44
118
173
1,413
1,282
1,046
1,025
974
Working Capital
- -
- -
7
5
6
42
45
38
27
LT Debt
79
125
221
318
1,662
1,726
1,651
1,625
1,632
Total Equity
- -
30.47
38.5
31.28
9.03
2.62
- -
- -
- -
Return on Invested Capital (%)
- -
29.59
38.55
32.63
9.17
2.93
- -
- -
- -
Return on Capital (%)
- -
34.9
44.36
36.04
9.24
2.86
-1.28
-1.3
-0.13
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
13
16
16
LT Borrowings
7
- -
- -
LT Finance Leases
32
31
27
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
100
100
100
Market Capitalization
3,675
3,711
3,801

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,132
1,100
1,073
Cash, Cash Equivalents & STI
402
357
560
Accounts Receivable, Net
184
200
228
Inventories
23
19
19
Total Current Liabilities
107
81
100
Payables & Accruals
- -
- -
- -
ST Debt
13
16
16
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
92.96%
-1.58%
Free Cash Flow
- -
-290.22%
-69.17%
Net Income, GAAP
- -
-33.97%
-1.06%
Sales/Revenue/Turnover
- -
6.04%
33.39%
Total Cash Common Dividend
- -
- -
-99.4%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
29
27
44
45
144
2025
39
62
- -
45
192
2026
45
64
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.05
-0.07
0.04
-0.23
-0.21
2025
-0.05
0.09
- -
-0.22
-0.21
2026
-0.04
0.14
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.31
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Chengdu Screen Microelectronics Co., Ltd. is a China-based third-party semiconductor testing and reliability assurance service provider specializing in integrated circuit screening, reliability assessment, and failure analysis. Founded in 2014 and headquartered in Chengdu, Sichuan Province, China, the company provides technical testing and engineering validation services primarily to high-reliability industries including aerospace, aviation, defense electronics, satellite communications, naval systems, rail transit, and advanced industrial automation. The company operates through specialized technical service segments, offering an integrated portfolio of testing solutions; electronic component screening and reliability testing, encompassing static and dynamic electrical parameter testing, functional verification, high- and low-temperature operating life tests, burn-in screening, thermal shock, temperature cycling, mechanical vibration, acceleration, and environmental stress screening; destructive physical analysis (DPA) and failure analysis, comprising scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), X-ray radiography and computed tomography, acoustic microscopy (C-SAM), internal visual inspection, microsectioning, and hermeticity leak testing; secondary screening and up-screening services for commercial-off-the-shelf (COTS) and industrial-grade electronic components to satisfy high-reliability specifications; and radiation hardness and environmental adaptability evaluation, including total ionizing dose (TID) and single-event effect (SEE) testing for space-grade semiconductor devices. The company delivers its services nationwide through accredited testing facilities and regional subsidiaries, including Wuxi Screen Microelectronics Co., Ltd. in Eastern China and testing laboratories in Xi'an and Chengdu. In recent developments, Chengdu Screen Microelectronics has executed a strategic expansion into commercial aerospace and automotive electronics, establishing testing and qualification capabilities compliant with AEC-Q100, AEC-Q101, and AEC-Q200 standards. The company has also expanded capital investment in advanced automated test equipment (ATE), high-precision physical analysis instrumentation, and testing platforms designed for high-density system-on-chips (SoCs), ultra-large-scale field-programmable gate arrays (FPGAs), wide bandgap semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), and advanced multi-chip packaging architectures.