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Shanghai Fudan Microelectronics Group Co., Ltd. Class A

Shanghai Fudan Microelectronics Group Co., Ltd. Class A

54.04
CNY
+2.74
(+5.34%)
0.75EPS
41.37P/E
25.70BMarket Cap
Oct 28Next Earn
Shanghai Fudan Microelectronics Group Co., Ltd. Class A
SSE:688385
(Shanghai Stock Exchange)

Recent

price

54.04

P/E

ratio

41.37

div

yld

0.49%

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.79
0.99
1.14
1.32
1.37
1.68
1.92
2.23
2.13
2.09
2.43
3.46
4.34
4.33
4.38
4.83
4.34
Revenue per Share
0.19
0.17
0.23
0.26
0.27
0.26
0.34
0.34
0.16
-0.23
0.19
0.69
1.32
0.88
0.7
0.28
0.76
Basic EPS, GAAP
0.07
0.02
0.22
0.06
-0.01
0.05
0.2
-0.11
-0.22
-0.31
-0.15
0.05
-0.57
-1.91
- -
- -
- -
Free Cash Flow per Basic Share
0.05
0.05
0.08
0.08
0.08
- -
- -
- -
- -
- -
- -
- -
0.07
0.17
0.16
0.12
0.26
Dividend per Share
0.71
0.83
0.98
1.16
1.36
1.62
1.98
2.45
2.8
2.57
2.78
3.86
5.55
6.47
7.18
7.45
6.84
Book Value per Share
0.67
0.79
0.92
1.07
1.15
1.36
1.75
2.21
2.52
2.32
2.46
3.55
5.06
5.74
6.32
6.82
6.04
Tangible Book Value per Share
617
617
617
617
617
617
617
626
661
695
695
745
815
817
819
824
815
Basic Weighted Avg Shares
489
610
704
817
844
1,040
1,187
1,398
1,410
1,455
1,691
2,577
3,539
3,536
3,590
3,982
3,534
Sales/Revenue/Turnover
34.07
40.22
48.45
44.72
42.07
17.83
21.11
43.72
39.69
-12.11
10.78
24.82
35.99
25.73
22.26
17.83
21.69
Operating Margin (%)
14
18
29
33
36
67
112
97
111
150
15
213
17
19
26
28
- -
Depreciation Expense
117
106
140
159
168
159
212
212
107
-162
133
514
1,077
719
573
232
618
Net Income, GAAP
8.02
12.02
11.71
2.81
3.62
7.93
7.61
7.11
19
- -
5.74
2.46
0.38
0.4
- -
0.34
0.77
Effective Tax Rate (%)
23.93
17.45
19.89
19.51
19.9
15.28
17.87
15.17
7.62
-11.13
7.86
19.96
30.43
20.35
15.95
5.83
17.5
Profit Margin (%)
349
384
475
486
483
588
895
1,222
1,495
1,281
1,388
2,329
3,423
4,058
4,257
5,153
4,089
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
33
41
57
33
552
248
669
372
LT Debt
474
550
642
757
935
1,114
1,374
1,771
2,107
1,938
2,112
3,367
5,153
5,962
6,544
6,754
6,241
Total Equity
27.06
41.33
23.7
23.14
20.77
43.82
47.02
36.1
23.52
- -
7.78
19.88
25.55
11.74
- -
2.47
8.61
Return on Invested Capital (%)
28.1
20.57
22.9
22.08
18.78
13.65
14.83
12.47
4.41
- -
5.18
16.84
23.86
11.28
- -
3.65
9.03
Return on Capital (%)
29.46
22.26
24.98
24.12
21.56
17.23
19.09
14.94
6.04
-8.69
7.15
20.29
28.07
14.63
10.23
3.86
11.74
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'23
Mar'24
Jun'24
ST Debt
966
916
1,169
LT Borrowings
530
462
357
LT Finance Leases
22
18
15
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
819
819
819
Market Capitalization
31,640
25,907
25,702

Working Capital

CNY

•

in mil. unless spec.
Dec'23
Mar'24
Jun'24
Total Current Assets
5,937
5,897
6,117
Cash, Cash Equivalents & STI
1,034
886
953
Accounts Receivable, Net
930
1,189
1,403
Inventories
3,177
3,214
3,232
Total Current Liabilities
1,879
1,856
2,027
Payables & Accruals
- -
- -
- -
ST Debt
966
916
1,169
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
21.33%
28.23%
3.21%
Free Cash Flow
- -
- -
- -
Net Income, GAAP
-16.5%
56.7%
-59.42%
Sales/Revenue/Turnover
15.43%
20.42%
10.92%
Total Cash Common Dividend
- -
1,083.5%
-22.23%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
809
987
942
798
3,536
2024
893
901
- -
- -
3,590
2025
- -
- -
- -
- -
3,982

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
0.23
0.32
0.25
0.08
0.88
2024
0.2
0.23
- -
- -
0.7
2025
- -
- -
- -
- -
0.28

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
0.01
0.15
0.01
0.17
2024
0.02
0.09
- -
- -
0.16
2025
- -
- -
- -
- -
0.12
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Business
Shanghai Fudan Microelectronics Group Company Limited (688385.SS) engages in the design, development, testing, and sale of application-specific integrated circuits (ASICs) and related system solutions. The company offers a comprehensive portfolio of products including security and identification chips such as contact and contactless memory ICs, HF RFID and NFC tag ICs, NFC channel ICs, contactless CPU cards, dual-interface CPU card chips, secured encryption chips, and HF reader chips; smart meter ASIC chips, automotive and ultra-low-power general-purpose MCUs, and ePLC solutions; non-volatile memory (NVM) products encompassing EEPROM, SPI NOR flash, SPI and parallel NAND flash, and AS-NVM; field-programmable gate arrays (FPGAs), reconfigurable SoCs, and PSoC chips; and specific analog circuits. It also provides integrated circuit testing services and solutions for applications in bank cards, social security cards, smart transportation, finance, anti-counterfeiting traceability, smart homes, industrial control, automotive electronics, IoT, mobile payments, and surveillance. Founded in 1998 and headquartered in Shanghai, China, with offices in Beijing, Shenzhen, Hong Kong, Taiwan, North America, and Singapore, the company serves markets in over 30 countries and regions. In recent developments, the company has advanced multiple R&D projects including the New Generation FPGA Platform Development and Industrialization Project, Intelligent and Reconfigurable SoC Platform Development, New Technical Platform Storage Development, New High-end Security Controller Development, and Passive IoT Basic Chip Development, supported by significant R&D investments exceeding RMB 1.1 billion in 2024. It launched new products such as the SPD5 Hub for DDR5 module interfaces, TS5 products, low-power ultra-wide voltage FM24LNXXX series I2C serial EEPROM, SLC NAND 28nm products for security monitoring and smart wearables, and progressed 12-inch process platforms for MCUs in smart meters, alongside RFSoC series using advanced FinFET processes. Additionally, Shanghai Fudan Microelectronics entered a major share transfer agreement enabling Shanghai Guosheng Group to acquire a 12.99% stake, pledged up to RMB 358.7 million in wafer and materials purchases from Shanghai Huahong Group to scale production, and scheduled its 2025 second extraordinary general meeting to approve A-share offering fund utilization, governance changes including abolition of the Supervisory Committee, and related party transaction policies. These initiatives underscore strategic expansions in advanced semiconductors, supply chain collaboration, and operational enhancements.