Shanghai Fudan Microelectronics Group Co., Ltd. Class A
51.30
CNY
-1.13
(-2.16%)
ISIN
CNE100004PL2
Return %
Stock
S&P 500
1Y
-15.57
14.20
3Y
21.62
81.12
5Y
20.11
68.34
Capital Structure
CNY
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in mil. unless spec.Working Capital
CNY
•
in mil. unless spec.Growth Rates
CNY
•
in mil. unless spec.Quarterly Revenue
CNY
•
in mil. unless spec.Quarterly Earnings Per Share
CNY
•
in mil. unless spec.Quarterly Dividends Per Share
CNY
•
in mil. unless spec.Company Description
- CEO
- Wei Zhang
- Full Time Employees
- 1,958
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Building 4 Shanghai SH China 200433
- IPO Date
- Aug 4, 2000
- Website
- fmsh.com
- Similar Companies
- Business
- Shanghai Fudan Microelectronics Group Company Limited (688385.SS) engages in the design, development, testing, and sale of application-specific integrated circuits (ASICs) and related system solutions. The company offers a comprehensive portfolio of products including security and identification chips such as contact and contactless memory ICs, HF RFID and NFC tag ICs, NFC channel ICs, contactless CPU cards, dual-interface CPU card chips, secured encryption chips, and HF reader chips; smart meter ASIC chips, automotive and ultra-low-power general-purpose MCUs, and ePLC solutions; non-volatile memory (NVM) products encompassing EEPROM, SPI NOR flash, SPI and parallel NAND flash, and AS-NVM; field-programmable gate arrays (FPGAs), reconfigurable SoCs, and PSoC chips; and specific analog circuits. It also provides integrated circuit testing services and solutions for applications in bank cards, social security cards, smart transportation, finance, anti-counterfeiting traceability, smart homes, industrial control, automotive electronics, IoT, mobile payments, and surveillance. Founded in 1998 and headquartered in Shanghai, China, with offices in Beijing, Shenzhen, Hong Kong, Taiwan, North America, and Singapore, the company serves markets in over 30 countries and regions. In recent developments, the company has advanced multiple R&D projects including the New Generation FPGA Platform Development and Industrialization Project, Intelligent and Reconfigurable SoC Platform Development, New Technical Platform Storage Development, New High-end Security Controller Development, and Passive IoT Basic Chip Development, supported by significant R&D investments exceeding RMB 1.1 billion in 2024. It launched new products such as the SPD5 Hub for DDR5 module interfaces, TS5 products, low-power ultra-wide voltage FM24LNXXX series I2C serial EEPROM, SLC NAND 28nm products for security monitoring and smart wearables, and progressed 12-inch process platforms for MCUs in smart meters, alongside RFSoC series using advanced FinFET processes. Additionally, Shanghai Fudan Microelectronics entered a major share transfer agreement enabling Shanghai Guosheng Group to acquire a 12.99% stake, pledged up to RMB 358.7 million in wafer and materials purchases from Shanghai Huahong Group to scale production, and scheduled its 2025 second extraordinary general meeting to approve A-share offering fund utilization, governance changes including abolition of the Supervisory Committee, and related party transaction policies. These initiatives underscore strategic expansions in advanced semiconductors, supply chain collaboration, and operational enhancements.