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Nextool Technology Co., Ltd. Class A

Nextool Technology Co., Ltd. Class A

SSSE:688419
40.65
CNY
+1.85
(+4.77%)
0.73EPS
108.33P/E
9.01BMarket Cap
Nextool Technology Co., Ltd. Class A
SSE:688419
(Shanghai Stock Exchange)

Recent

price

40.65

P/E

ratio

108.33

div

yld

- -

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.79
1.02
2.02
2.87
3.06
1.73
2.35
2.57
2.95
Revenue per Share
0.11
0.16
0.49
0.61
0.65
0.46
0.56
0.7
0.73
Basic EPS, GAAP
0.08
0.08
0.38
0.56
-0.25
0.27
0.26
-0.1
- -
Free Cash Flow per Basic Share
0.11
0.05
- -
- -
- -
0.21
0.22
0.28
- -
Dividend per Share
1.47
1.64
1.52
2.14
8.21
8.46
8.8
9.06
9.09
Book Value per Share
1.15
1.34
1.35
1.96
8.07
8.32
8.66
8.93
8.96
Tangible Book Value per Share
80
85
83
86
88
115
114
115
113
Basic Weighted Avg Shares
63
87
169
249
269
198
268
295
334
Sales/Revenue/Turnover
17.37
11.8
26.84
22.6
23.44
21.34
22.08
26.11
24.64
Operating Margin (%)
6
6
7
7
7
8
9
11
- -
Depreciation Expense
9
13
41
53
57
52
64
80
82
Net Income, GAAP
4.05
6.45
12.1
11.21
9.49
10.74
10.85
11.01
11.21
Effective Tax Rate (%)
14.5
15.44
24.4
21.37
21.27
26.48
23.87
27.24
24.62
Profit Margin (%)
14
20
72
123
873
883
885
876
885
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
- -
LT Debt
74
83
131
184
943
971
1,010
1,038
1,042
Total Equity
- -
12.23
33.96
29.41
9.92
5.23
6.26
7.94
7.92
Return on Invested Capital (%)
- -
17.05
38.45
33.66
10.15
5.48
6.46
7.84
7.98
Return on Capital (%)
- -
17.05
38.45
33.66
10.15
5.48
6.46
7.84
7.98
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
115
115
115
Market Capitalization
3,206
4,681
9,009

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,059
1,064
1,095
Cash, Cash Equivalents & STI
782
773
762
Accounts Receivable, Net
117
115
143
Inventories
135
147
162
Total Current Liabilities
183
170
210
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
92.31%
2.75%
Free Cash Flow
- -
-95.66%
-139.98%
Net Income, GAAP
- -
15.2%
25.49%
Sales/Revenue/Turnover
- -
14.93%
9.96%
Total Cash Common Dividend
- -
- -
32.32%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
55
54
89
71
268
2025
68
72
- -
75
295
2026
69
118
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.16
0.13
0.21
0.05
0.56
2025
0.2
0.16
- -
0.12
0.7
2026
0.13
0.31
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.22
2025
- -
- -
- -
- -
0.28
2026
- -
- -
- -
- -
- -
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Business
Nextool Technology Co., Ltd. is a China-based intelligent manufacturing equipment provider primarily engaged in the research, development, design, manufacture, and distribution of semiconductor packaging equipment and precision plastic extrusion tooling systems. The company operates through two principal business divisions: Semiconductor Packaging Equipment and Plastic Extrusion Equipment. Its semiconductor product portfolio includes fully automated semiconductor encapsulation and transfer molding systems; automated trim, form, and singulation (TFS) systems; high-precision semiconductor packaging molds for discrete devices and integrated circuits; wafer-level packaging (WLP) and panel-level packaging (PLP) compression molding equipment; film-assisted molding (FAM) units for advanced flip-chip chip scale packaging (FCCSP) and flip-chip ball grid array (FCBGA) architectures; and proprietary host computer control and motion automation software. Its plastic extrusion product line comprises precision extrusion dies for PVC and composite window and door profiles; high-speed pipe and sheet co-extrusion molds; wood-plastic composite extrusion tooling; downstream automated calibration tables; haul-off and cutting units; and complete automated extrusion processing lines. In addition, the company provides customized tooling design, equipment maintenance, technical consulting, and spare parts supply services. Founded in 2005 and headquartered in Tongling, Anhui Province, China, Nextool Technology Co., Ltd. is listed on the Shanghai Stock Exchange STAR Market (SSE: 688419) and serves outsourced semiconductor assembly and test (OSAT) providers, integrated device manufacturers (IDMs), and industrial plastics fabricators across domestic China, Europe, North America, and Southeast Asia. In recent operational developments, the company has commissioned and ramped up production at its new semiconductor packaging equipment manufacturing base to expand manufacturing capacity. Nextool has also accelerated the development and customer sampling of next-generation compression molding systems for wafer-level and panel-level advanced packaging, introduced proprietary film-assisted molding modules to address artificial intelligence and automotive semiconductor applications, and obtained official software product certifications for its internally developed IC trimming and encapsulation supervisory control systems to strengthen its domestic and international market competitiveness.