Nextool Technology Co., Ltd. Class A
SSSE:68841938.80
CNY
-2.04
(-5.00%)
ISIN
CNE100005V09
Return %
Stock
S&P 500
1Y
34.58
14.20
3Y
52.24
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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CNY
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in mil. unless spec.Company Description
- CEO
- Tian Qin Zheng
- Full Time Employees
- 521
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Tongling China
- IPO Date
- Nov 7, 2022
- Website
- nextooling.com
- Similar Companies
- Business
- Nextool Technology Co., Ltd. is a China-based intelligent manufacturing equipment provider primarily engaged in the research, development, design, manufacture, and distribution of semiconductor packaging equipment and precision plastic extrusion tooling systems. The company operates through two principal business divisions: Semiconductor Packaging Equipment and Plastic Extrusion Equipment. Its semiconductor product portfolio includes fully automated semiconductor encapsulation and transfer molding systems; automated trim, form, and singulation (TFS) systems; high-precision semiconductor packaging molds for discrete devices and integrated circuits; wafer-level packaging (WLP) and panel-level packaging (PLP) compression molding equipment; film-assisted molding (FAM) units for advanced flip-chip chip scale packaging (FCCSP) and flip-chip ball grid array (FCBGA) architectures; and proprietary host computer control and motion automation software. Its plastic extrusion product line comprises precision extrusion dies for PVC and composite window and door profiles; high-speed pipe and sheet co-extrusion molds; wood-plastic composite extrusion tooling; downstream automated calibration tables; haul-off and cutting units; and complete automated extrusion processing lines. In addition, the company provides customized tooling design, equipment maintenance, technical consulting, and spare parts supply services. Founded in 2005 and headquartered in Tongling, Anhui Province, China, Nextool Technology Co., Ltd. is listed on the Shanghai Stock Exchange STAR Market (SSE: 688419) and serves outsourced semiconductor assembly and test (OSAT) providers, integrated device manufacturers (IDMs), and industrial plastics fabricators across domestic China, Europe, North America, and Southeast Asia. In recent operational developments, the company has commissioned and ramped up production at its new semiconductor packaging equipment manufacturing base to expand manufacturing capacity. Nextool has also accelerated the development and customer sampling of next-generation compression molding systems for wafer-level and panel-level advanced packaging, introduced proprietary film-assisted molding modules to address artificial intelligence and automotive semiconductor applications, and obtained official software product certifications for its internally developed IC trimming and encapsulation supervisory control systems to strengthen its domestic and international market competitiveness.