GRINM Semiconductor Materials Co., Ltd. Class A
SSSE:68843236.09
CNY
+1.05
(+3.00%)
GRINM Semiconductor Materials Co., Ltd. Class A
SSE:688432
(Shanghai Stock Exchange)
Recent
price
36.09
P/E
ratio
- -
div
yld
0.15%
ROIC.AI
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- Business
- GRINM Semiconductor Materials Co., Ltd. is a China-based enterprise primarily engaged in the research, development, manufacturing, and sale of advanced semiconductor silicon materials and related components for the global microelectronics industry. The company offers a comprehensive portfolio of semiconductor materials organized across distinct product lines, including semiconductor silicon polished wafers; silicon materials and components for semiconductor etching equipment; zone-melting float-zone (FZ) silicon single crystals; and precision equipment parts. Its core offerings comprise 6-inch, 8-inch, and 12-inch monocrystalline silicon polished wafers and dummy wafers utilized in integrated circuit (IC) fabrication and discrete semiconductor devices; large-diameter monocrystalline silicon ingots, high-purity silicon electrodes, rings, and showerheads designed for plasma etching chambers in wafer processing equipment; high-resistivity float-zone silicon ingots and polished wafers engineered for high-power devices, automotive electronics, and sensors; and specialized cleanroom pipe and valve components as well as precision quartz and silicon consumables. Founded in 2001 and headquartered in Beijing, China, the company operates major production and research bases in Beijing, Shandong, and Inner Mongolia, distributing its products to semiconductor foundries, integrated device manufacturers (IDMs), and semiconductor equipment makers across China, Japan, South Korea, Europe, and the United States. Listed on the Shanghai Stock Exchange Science and Technology Innovation Board (SSE: 688432), the company operates with backing from Japanese wafer reclamation leader RS Technologies Co., Ltd. and the General Research Institute for Nonferrous Metals (GRINM Group). In recent corporate developments, the company has undertaken significant strategic expansions and asset restructurings, including initiating acquisitions to achieve full ownership of Shandong Youyan AIS Technology Co., Ltd. and Shandong Youyan Semiconductor Materials Co., Ltd. to accelerate 12-inch (300 mm) silicon wafer mass production toward 300,000 wafers per month; acquiring a 70% controlling interest in Japan-based DG Technologies Co., Ltd. from RS Technologies to broaden its silicon and quartz component capabilities for etching equipment; completing its capacity expansion program for 8-inch (200 mm) integrated circuit silicon wafers to reach 250,000 wafers per month; and establishing Guojing Semiconductor Materials (Baotou) Co., Ltd. in Inner Mongolia to optimize upstream single-crystal silicon ingot production and reduce manufacturing energy costs.