GRINM Semiconductor Materials Co., Ltd. Class A

GRINM Semiconductor Materials Co., Ltd. Class A

SSSE:688432
35.04
CNY
-2.10
(-5.65%)
49.97BMarket Cap
Oct 29Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.66
0.5
0.45
0.88
1.07
0.77
0.8
0.81
- -
Basic EPS, GAAP
0.14
0.1
0.09
0.15
0.32
0.2
0.19
0.17
- -
Free Cash Flow per Basic Share
0.03
0.05
-0.21
0.02
0.23
0.13
0.01
0.1
- -
Dividend per Share
- -
- -
- -
- -
- -
0.06
0.01
0.06
0.06
Book Value per Share
0.48
0.76
1.13
1.85
3.19
3.32
3.48
3.62
3.65
Tangible Book Value per Share
0.48
0.68
1.05
1.77
3.12
3.26
3.42
3.55
3.58
Basic Weighted Avg Shares
1,060
1,248
1,248
989
1,098
1,248
1,245
1,244
1,247
Sales/Revenue/Turnover
696
625
557
869
1,175
960
996
1,005
- -
Operating Margin (%)
20.89
18.31
21.3
19.15
30.38
27.91
28.87
29.6
- -
Depreciation Expense
31
31
21
75
84
85
89
100
- -
Net Income, GAAP
148
125
114
148
351
254
233
209
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
11.14
15.42
14.34
- -
Profit Margin (%)
21.28
19.98
20.41
17.07
29.89
26.47
23.39
20.82
- -
Working Capital
378
752
558
1,242
3,211
3,141
3,210
2,961
2,913
LT Debt
- -
- -
3
1
1
7
2
1
24
Total Equity
610
1,107
1,501
2,307
4,400
4,581
4,797
5,007
5,059
Return on Invested Capital (%)
- -
14.54
8.74
8.76
12.79
6.4
5.72
4.99
- -
Return on Capital (%)
- -
14.39
8.67
5.78
8.15
4.9
4.19
3.52
- -
Return on Common Equity (%)
- -
18.96
11.32
9.38
11.81
6.25
5.49
4.72
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
4
11
8
LT Borrowings
- -
8
7
LT Finance Leases
1
14
17
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,250
1,250
1,250
Market Capitalization
15,516
16,792
49,975

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,311
3,384
3,366
Cash, Cash Equivalents & STI
2,577
2,595
2,543
Accounts Receivable, Net
292
331
334
Inventories
218
255
276
Total Current Liabilities
350
468
453
Payables & Accruals
- -
- -
- -
ST Debt
4
11
8
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
31.52%
4.38%
Free Cash Flow
- -
493.2%
1,118.95%
Net Income, GAAP
- -
24.25%
-10.14%
Sales/Revenue/Turnover
- -
15.55%
0.93%
Total Cash Common Dividend
- -
- -
500%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
235
272
266
223
996
2025
266
260
- -
259
1,005
2026
314
351
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.05
0.06
0.05
0.03
0.19
2025
0.04
0.05
- -
0.04
0.17
2026
0.04
0.07
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.01
2025
- -
- -
- -
- -
0.06
2026
- -
0.06
- -
- -
- -

Company Description

CEO
Guo Hu Zhang
Full Time Employees
902
Sector
Electronic technology
Industry
Semiconductors
Address
Beijing China
IPO Date
Nov 10, 2022
Website
gritek.com
Business
GRINM Semiconductor Materials Co., Ltd. is a China-based enterprise primarily engaged in the research, development, manufacturing, and sale of advanced semiconductor silicon materials and related components for the global microelectronics industry. The company offers a comprehensive portfolio of semiconductor materials organized across distinct product lines, including semiconductor silicon polished wafers; silicon materials and components for semiconductor etching equipment; zone-melting float-zone (FZ) silicon single crystals; and precision equipment parts. Its core offerings comprise 6-inch, 8-inch, and 12-inch monocrystalline silicon polished wafers and dummy wafers utilized in integrated circuit (IC) fabrication and discrete semiconductor devices; large-diameter monocrystalline silicon ingots, high-purity silicon electrodes, rings, and showerheads designed for plasma etching chambers in wafer processing equipment; high-resistivity float-zone silicon ingots and polished wafers engineered for high-power devices, automotive electronics, and sensors; and specialized cleanroom pipe and valve components as well as precision quartz and silicon consumables. Founded in 2001 and headquartered in Beijing, China, the company operates major production and research bases in Beijing, Shandong, and Inner Mongolia, distributing its products to semiconductor foundries, integrated device manufacturers (IDMs), and semiconductor equipment makers across China, Japan, South Korea, Europe, and the United States. Listed on the Shanghai Stock Exchange Science and Technology Innovation Board (SSE: 688432), the company operates with backing from Japanese wafer reclamation leader RS Technologies Co., Ltd. and the General Research Institute for Nonferrous Metals (GRINM Group). In recent corporate developments, the company has undertaken significant strategic expansions and asset restructurings, including initiating acquisitions to achieve full ownership of Shandong Youyan AIS Technology Co., Ltd. and Shandong Youyan Semiconductor Materials Co., Ltd. to accelerate 12-inch (300 mm) silicon wafer mass production toward 300,000 wafers per month; acquiring a 70% controlling interest in Japan-based DG Technologies Co., Ltd. from RS Technologies to broaden its silicon and quartz component capabilities for etching equipment; completing its capacity expansion program for 8-inch (200 mm) integrated circuit silicon wafers to reach 250,000 wafers per month; and establishing Guojing Semiconductor Materials (Baotou) Co., Ltd. in Inner Mongolia to optimize upstream single-crystal silicon ingot production and reduce manufacturing energy costs.