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Telink Semiconductor (Shanghai) Co., Ltd. Class A

Telink Semiconductor (Shanghai) Co., Ltd. Class A

SSSE:688591
31.24
CNY
+1.67
(+5.65%)
0.61EPS
53.73P/E
8.30BMarket Cap
Oct 28Next Earn
Telink Semiconductor (Shanghai) Co., Ltd. Class A
SSE:688591
(Shanghai Stock Exchange)

Recent

price

31.24

P/E

ratio

53.73

div

yld

- -

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
2.08
2.76
3.62
3.43
3.2
3.55
4.31
4.48
Revenue per Share
0.35
-0.56
0.53
0.28
0.25
0.41
0.54
0.64
Basic EPS, GAAP
-0.08
0.21
-0.1
0.02
0.52
0.33
0.58
- -
Free Cash Flow per Basic Share
0.01
0.3
- -
- -
- -
0.07
0.21
- -
Dividend per Share
2.35
4.3
4.87
5.16
9.76
9.76
10.11
10.44
Book Value per Share
2.26
4.16
4.87
4.98
9.67
9.65
9.97
10.2
Tangible Book Value per Share
154
165
179
178
199
238
236
237
Basic Weighted Avg Shares
320
454
650
609
636
844
1,015
1,063
Sales/Revenue/Turnover
18.06
-16.12
11.69
6.27
5.05
7.79
9.32
6.86
Operating Margin (%)
16
15
4
22
22
30
42
- -
Depreciation Expense
54
-92
95
50
50
97
127
152
Net Income, GAAP
6.22
- -
3.18
- -
0.87
- -
- -
0.03
Effective Tax Rate (%)
16.83
-20.32
14.63
8.17
7.82
11.54
12.54
14.27
Profit Margin (%)
393
715
799
860
2,245
2,145
2,269
2,217
Working Capital
- -
4
1
2
3
23
16
12
LT Debt
423
774
877
928
2,341
2,343
2,435
2,522
Total Equity
- -
- -
11.43
- -
2.97
- -
- -
6.36
Return on Invested Capital (%)
- -
- -
11.47
- -
3.06
- -
- -
6.16
Return on Capital (%)
- -
-15.4
11.51
5.52
3.04
4.16
5.33
6.18
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
11
17
15
LT Borrowings
- -
- -
- -
LT Finance Leases
16
15
12
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
241
241
242
Market Capitalization
10,246
8,513
8,305

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,417
2,311
2,360
Cash, Cash Equivalents & STI
2,003
1,865
1,861
Accounts Receivable, Net
134
130
150
Inventories
170
199
234
Total Current Liabilities
148
113
143
Payables & Accruals
- -
- -
- -
ST Debt
11
17
15
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
35.09%
3.91%
Free Cash Flow
- -
505.52%
77.7%
Net Income, GAAP
- -
-24.86%
30.66%
Sales/Revenue/Turnover
- -
18.86%
20.26%
Total Cash Common Dividend
- -
- -
178.78%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
161
204
222
257
844
2025
230
273
- -
249
1,015
2026
234
307
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.02
0.13
0.16
0.14
0.41
2025
0.15
0.28
- -
-0.05
0.54
2026
0.04
0.38
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.07
2025
- -
- -
- -
- -
0.21
2026
- -
- -
- -
- -
- -
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Business
Telink Semiconductor (Shanghai) Co., Ltd. is a fabless integrated circuit design company engaged in the research, development, design, and sale of low-power wireless Internet of Things (IoT) system-on-chips (SoCs) and radio frequency (RF) integrated circuits. The company offers a broad portfolio of multi-protocol wireless connectivity solutions, including Bluetooth Low Energy (BLE) and Bluetooth Mesh SoCs; multi-standard chips supporting Zigbee, Thread, Apple Find My, and the Matter protocol; proprietary 2.4GHz RF transceivers; high-performance wireless audio SoCs engineered for low-latency gaming headsets, wireless microphones, and hearing augmentation; dual-mode Wi-Fi and Bluetooth combo chips; and application-specific integrated circuits tailored for smart remote controls, PC peripherals, electronic shelf labels (ESL), smart lighting, building automation, wearable medical devices, and automotive digital key systems. In addition to semiconductor hardware, the company provides proprietary protocol stacks, software development kits (SDKs), reference designs, and technical support services across its hardware platforms. Founded in 2010 and headquartered in Shanghai, China, Telink Semiconductor maintains research, development, and sales operations across mainland China, including Shenzhen and Beijing, as well as international subsidiaries and regional offices in Taiwan, the United States, and the United Kingdom. In recent developments, following its initial public offering on the Shanghai Stock Exchange STAR Market, Telink Semiconductor has expanded its product roadmap with the rollout of next-generation RISC-V-based multi-protocol SoCs supporting Bluetooth 5.4, Channel Sounding, and native Matter-over-Thread interoperability; introduced high-throughput Wi-Fi 6 and Bluetooth combo SoCs targeted at smart home hubs and industrial gateways; strengthened strategic collaborations with global retail automation and automotive Tier-1 suppliers to accelerate the deployment of electronic shelf labels and BLE-enabled smart vehicle access; and deepened its commitment to open standards through active working group participation within the Connectivity Standards Alliance (CSA) and the Bluetooth Special Interest Group (SIG).