Telink Semiconductor (Shanghai) Co., Ltd. Class A
SSSE:68859129.57
CNY
+0.03
(+0.10%)
ISIN
CNE100006ZN2
Return %
Stock
S&P 500
1Y
-40.06
14.20
3Y
-1.14
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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CNY
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in mil. unless spec.Company Description
- CEO
- Wen Jun Sheng
- Full Time Employees
- 425
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Shanghai China
- IPO Date
- Aug 25, 2023
- Website
- telink-semi.cn
- Similar Companies
- Business
- Telink Semiconductor (Shanghai) Co., Ltd. is a fabless integrated circuit design company engaged in the research, development, design, and sale of low-power wireless Internet of Things (IoT) system-on-chips (SoCs) and radio frequency (RF) integrated circuits. The company offers a broad portfolio of multi-protocol wireless connectivity solutions, including Bluetooth Low Energy (BLE) and Bluetooth Mesh SoCs; multi-standard chips supporting Zigbee, Thread, Apple Find My, and the Matter protocol; proprietary 2.4GHz RF transceivers; high-performance wireless audio SoCs engineered for low-latency gaming headsets, wireless microphones, and hearing augmentation; dual-mode Wi-Fi and Bluetooth combo chips; and application-specific integrated circuits tailored for smart remote controls, PC peripherals, electronic shelf labels (ESL), smart lighting, building automation, wearable medical devices, and automotive digital key systems. In addition to semiconductor hardware, the company provides proprietary protocol stacks, software development kits (SDKs), reference designs, and technical support services across its hardware platforms. Founded in 2010 and headquartered in Shanghai, China, Telink Semiconductor maintains research, development, and sales operations across mainland China, including Shenzhen and Beijing, as well as international subsidiaries and regional offices in Taiwan, the United States, and the United Kingdom. In recent developments, following its initial public offering on the Shanghai Stock Exchange STAR Market, Telink Semiconductor has expanded its product roadmap with the rollout of next-generation RISC-V-based multi-protocol SoCs supporting Bluetooth 5.4, Channel Sounding, and native Matter-over-Thread interoperability; introduced high-throughput Wi-Fi 6 and Bluetooth combo SoCs targeted at smart home hubs and industrial gateways; strengthened strategic collaborations with global retail automation and automotive Tier-1 suppliers to accelerate the deployment of electronic shelf labels and BLE-enabled smart vehicle access; and deepened its commitment to open standards through active working group participation within the Connectivity Standards Alliance (CSA) and the Bluetooth Special Interest Group (SIG).