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Shanghai New Vision Microelectronics Co., Ltd. Class A

Shanghai New Vision Microelectronics Co., Ltd. Class A

SSSE:688593
28.30
CNY
+0.70
(+2.54%)
0.01EPS
1,754.53P/E
17.88BMarket Cap
Shanghai New Vision Microelectronics Co., Ltd. Class A
SSE:688593
(Shanghai Stock Exchange)

Recent

price

28.30

P/E

ratio

1,754.53

div

yld

0.02%

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.34
0.48
1.31
1.16
1.13
1.08
1.35
1.38
Revenue per Share
-0.02
0.06
0.44
0.29
0.07
0.02
0.02
0.02
Basic EPS, GAAP
0.04
0.1
-0.16
-0.19
-0.23
-0.24
0.07
- -
Free Cash Flow per Basic Share
- -
0.02
- -
0.04
- -
0.04
- -
- -
Dividend per Share
0.05
0.17
1.49
1.77
3.47
3.42
3.36
3.35
Book Value per Share
0.05
0.17
1.49
1.77
3.47
3.38
3.32
3.31
Tangible Book Value per Share
460
460
345
367
424
468
454
454
Basic Weighted Avg Shares
158
219
452
427
480
507
613
624
Sales/Revenue/Turnover
-4.36
7.77
42.2
23.9
3.11
-5.68
-2.77
-2.51
Operating Margin (%)
- -
- -
3
4
5
8
13
- -
Depreciation Expense
-9
25
153
108
28
8
9
10
Net Income, GAAP
- -
- -
15.41
11.29
- -
- -
- -
- -
Effective Tax Rate (%)
-5.58
11.62
33.81
25.36
5.73
1.66
1.48
1.61
Profit Margin (%)
14
42
355
474
1,258
1,218
1,104
1,091
Working Capital
- -
5
2
- -
2
1
34
34
LT Debt
17
63
554
655
1,602
1,588
1,556
1,547
Total Equity
- -
- -
47.17
17.4
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
47.76
17.56
- -
- -
- -
- -
Return on Capital (%)
- -
63.5
49.96
18.09
2.45
0.53
0.58
0.65
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
120
95
22
LT Borrowings
33
33
33
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
460
460
460
Market Capitalization
9,273
13,602
17,885

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,388
1,322
1,253
Cash, Cash Equivalents & STI
866
860
830
Accounts Receivable, Net
140
122
133
Inventories
229
203
185
Total Current Liabilities
284
212
163
Payables & Accruals
- -
- -
- -
ST Debt
120
95
22
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
187.22%
-2.01%
Free Cash Flow
- -
-54.47%
-128.36%
Net Income, GAAP
- -
67.12%
7.76%
Sales/Revenue/Turnover
- -
28%
20.86%
Total Cash Common Dividend
- -
12,689.26%
-91.52%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
100
131
112
164
507
2025
150
135
- -
177
613
2026
151
161
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.02
0.02
0.01
0.01
0.02
2025
- -
0.01
- -
- -
0.02
2026
0.01
- -
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
0.04
- -
0.04
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Shanghai New Vision Microelectronics Co., Ltd. is a fabless semiconductor design company that specializes in the research, development, design, and sale of display driver integrated circuits and display-related power management solutions. Founded in 2005 and headquartered in Shanghai, China, the company operates design and engineering facilities across mainland China, including core research and development activities through its wholly owned subsidiary Hefei Hongxinda Microelectronics Co., Ltd. Shanghai New Vision Microelectronics offers a specialized portfolio of semiconductor products, including integrated display driver ICs (DDICs) supporting high-resolution TFT-LCD and AMOLED display panels; separated display driver ICs; power management ICs comprising AC-DC converters, DC-DC regulators, and multi-channel display power supply chips; timing controller (TCON) integrated circuits; capacitive touch controller ICs; micro-display chips engineered for augmented reality (AR) eyewear; and optical driver ICs for emerging display technologies. Its solutions serve major display panel manufacturers, such as BOE Technology Group, Tianma Microelectronics, and HKC Corporation, and are integrated into consumer, automotive, and industrial end products for brands including Huawei, Xiaomi, Lenovo, HP, Dell, and Changhong across smart wearables, mobile phones, tablet computers, laptops, desktop monitors, automotive infotainment systems, and commercial televisions. In recent developments, the company has advanced its strategic focus on high-margin AMOLED and next-generation display technologies, expanding commercial volume for its 40nm and 28nm high-voltage process AMOLED driver ICs and shipping AR micro-display ICs. Furthermore, the company initiated a strategic partnership with BOE HC SemiTek to co-develop solutions for the MicroLED optical interconnect sector, optimized its operational asset structure by reallocating capital expenditure from its previously planned Hefei testing facility directly into advanced chip design, and explored strategic asset reorganizations to broaden its display IC portfolio.