Shanghai New Vision Microelectronics Co., Ltd. Class A
SSSE:68859327.60
CNY
-1.07
(-3.73%)
ISIN
CNE100006QH3
Return %
Stock
S&P 500
1Y
41.32
14.20
3Y
94.50
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
CNY
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
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CNY
•
in mil. unless spec.Company Description
- CEO
- Hong Xiao
- Full Time Employees
- 210
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Shanghai China
- IPO Date
- Jun 1, 2023
- Website
- newvisionu.com.cn
- Similar Companies
- Business
- Shanghai New Vision Microelectronics Co., Ltd. is a fabless semiconductor design company that specializes in the research, development, design, and sale of display driver integrated circuits and display-related power management solutions. Founded in 2005 and headquartered in Shanghai, China, the company operates design and engineering facilities across mainland China, including core research and development activities through its wholly owned subsidiary Hefei Hongxinda Microelectronics Co., Ltd. Shanghai New Vision Microelectronics offers a specialized portfolio of semiconductor products, including integrated display driver ICs (DDICs) supporting high-resolution TFT-LCD and AMOLED display panels; separated display driver ICs; power management ICs comprising AC-DC converters, DC-DC regulators, and multi-channel display power supply chips; timing controller (TCON) integrated circuits; capacitive touch controller ICs; micro-display chips engineered for augmented reality (AR) eyewear; and optical driver ICs for emerging display technologies. Its solutions serve major display panel manufacturers, such as BOE Technology Group, Tianma Microelectronics, and HKC Corporation, and are integrated into consumer, automotive, and industrial end products for brands including Huawei, Xiaomi, Lenovo, HP, Dell, and Changhong across smart wearables, mobile phones, tablet computers, laptops, desktop monitors, automotive infotainment systems, and commercial televisions. In recent developments, the company has advanced its strategic focus on high-margin AMOLED and next-generation display technologies, expanding commercial volume for its 40nm and 28nm high-voltage process AMOLED driver ICs and shipping AR micro-display ICs. Furthermore, the company initiated a strategic partnership with BOE HC SemiTek to co-develop solutions for the MicroLED optical interconnect sector, optimized its operational asset structure by reallocating capital expenditure from its previously planned Hefei testing facility directly into advanced chip design, and explored strategic asset reorganizations to broaden its display IC portfolio.