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Beijing E-Town Semiconductor Technology Co., Ltd. Class A

Beijing E-Town Semiconductor Technology Co., Ltd. Class A

SSSE:688729
18.25
CNY
+0.53
(+2.99%)
0.23EPS
190.26P/E
127.09BMarket Cap
Oct 30Next Earn
Beijing E-Town Semiconductor Technology Co., Ltd. Class A
SSE:688729
(Shanghai Stock Exchange)

Recent

price

18.25

P/E

ratio

190.26

div

yld

0.20%

ROIC.AI

2018
2019
2020
2021
2022
2023
2024
2025
TTM
CNY
0.57
0.59
0.93
1.25
1.74
1.52
1.71
1.82
1.57
Revenue per Share
0.01
-0.03
0.01
0.07
0.14
0.12
0.2
0.24
0.23
Basic EPS, GAAP
-0.02
-0.04
-0.05
0.02
-0.33
0.07
0.14
-0.21
- -
Free Cash Flow per Basic Share
0.01
0.01
0.01
- -
- -
0.01
0.02
0.02
0.04
Dividend per Share
0.74
0.73
1.58
1.64
1.87
2.01
2.22
3.02
3.09
Book Value per Share
0.35
0.33
1.21
1.29
1.48
1.62
1.83
2.67
2.73
Tangible Book Value per Share
2,660
2,660
2,476
2,589
2,732
2,578
2,704
2,795
3,013
Basic Weighted Avg Shares
1,518
1,574
2,313
3,241
4,763
3,931
4,633
5,076
4,733
Sales/Revenue/Turnover
4.47
-2.09
3.39
6.87
8.39
7.29
11.03
14.36
13.34
Operating Margin (%)
41
55
57
81
106
136
162
192
- -
Depreciation Expense
24
-88
25
181
383
309
541
671
681
Net Income, GAAP
48.5
- -
50.31
12.09
4.4
- -
- -
1.42
2.85
Effective Tax Rate (%)
1.58
-5.6
1.07
5.59
8.03
7.87
11.67
13.21
14.39
Profit Margin (%)
412
666
2,854
2,999
3,514
3,695
4,762
6,312
6,276
Working Capital
12
272
32
70
466
709
1,361
571
521
LT Debt
1,979
1,938
4,206
4,366
4,981
5,343
5,915
8,916
9,134
Total Equity
- -
- -
0.71
4.1
7.29
- -
- -
7.65
7.6
Return on Invested Capital (%)
- -
- -
1.07
4.16
7.58
- -
- -
8.23
8.01
Return on Capital (%)
- -
-4.5
0.81
4.23
8.19
5.99
9.61
9.05
8.92
Return on Common Equity (%)

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
409
51
52
LT Borrowings
395
350
350
LT Finance Leases
175
177
171
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
2,956
2,956
2,956
Market Capitalization
72,352
64,756
127,089

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
8,071
7,496
7,549
Cash, Cash Equivalents & STI
3,592
3,269
3,475
Accounts Receivable, Net
488
548
469
Inventories
3,436
3,287
3,225
Total Current Liabilities
1,759
1,213
1,273
Payables & Accruals
- -
- -
- -
ST Debt
409
51
52
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
17.32%
50.75%
Free Cash Flow
- -
-447.97%
-263%
Net Income, GAAP
- -
164.54%
24.03%
Sales/Revenue/Turnover
- -
19.41%
9.57%
Total Cash Common Dividend
- -
28.45%
-4.01%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,012
1,078
1,240
1,303
4,633
2025
1,160
1,322
- -
1,280
5,076
2026
1,037
1,094
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.04
0.05
0.06
0.05
0.2
2025
0.08
0.04
- -
0.05
0.24
2026
0.05
0.08
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.02
2025
- -
- -
- -
- -
0.02
2026
- -
0.03
- -
- -
- -
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Business
Beijing E-Town Semiconductor Technology Co., Ltd. engages in the research, development, design, manufacturing, and marketing of integrated circuit wafer processing equipment and related technological services worldwide. The company operates through Semiconductor Equipment, Equipment Components and Spare Parts, and Technical Maintenance and Support Services segments. Its primary product offerings encompass dry strip and ashing equipment, including advanced inductively coupled plasma (ICP) and microwave downstream photoresist strippers for bulk strip, residue removal, and post-implant wafer cleaning; rapid thermal processing (RTP) and millisecond anneal systems, featuring high-uniformity lamp-heated thermal processing tools used for ultra-shallow junction formation, contact silicidation, and oxide growth; dry etch equipment, comprising capacitively coupled plasma (CCP) and ICP dielectric and conductor plasma etchers for patterning critical features in logic and memory fabrication; and chemical downstream isotropic etch systems for selective material removal. In addition, the company provides wafer handling subsystems, chamber upgrade kits, precision consumable replacement parts, tool refurbishment, and on-site engineering and technical support services. The company caters to leading integrated device manufacturers (IDMs), pure-play foundries, and memory producers producing advanced logic devices, DRAM, 3D NAND flash, power semiconductors, and advanced packaging architectures. Founded in 2015, Beijing E-Town Semiconductor Technology Co., Ltd. is headquartered in Beijing, China, with operational centers, manufacturing facilities, and application laboratories located across China, the United States, South Korea, Taiwan, Japan, Singapore, and Germany, operating major international assets through its subsidiary Mattson Technology, Inc. In recent developments, the company has pursued its Class A share listing on the Science and Technology Innovation Board of the Shanghai Stock Exchange (SSE:688729), expanded cleanroom manufacturing capacities at its advanced semiconductor equipment industrial base in Beijing, and rolled out next-generation high-temperature millisecond annealing and sub-10nm dry strip tool platforms to meet advanced node IC process requirements. Furthermore, the company has deepened strategic technology partnerships with tier-one domestic and international foundries for collaborative process development and accelerated its expansion into compound semiconductor and specialized advanced packaging applications.