- CEO
- Hao An Lu
- Full Time Employees
- 1,270
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Beijing China
- IPO Date
- Jul 8, 2025
- Business
- Beijing E-Town Semiconductor Technology Co., Ltd. engages in the research, development, design, manufacturing, and marketing of integrated circuit wafer processing equipment and related technological services worldwide. The company operates through Semiconductor Equipment, Equipment Components and Spare Parts, and Technical Maintenance and Support Services segments. Its primary product offerings encompass dry strip and ashing equipment, including advanced inductively coupled plasma (ICP) and microwave downstream photoresist strippers for bulk strip, residue removal, and post-implant wafer cleaning; rapid thermal processing (RTP) and millisecond anneal systems, featuring high-uniformity lamp-heated thermal processing tools used for ultra-shallow junction formation, contact silicidation, and oxide growth; dry etch equipment, comprising capacitively coupled plasma (CCP) and ICP dielectric and conductor plasma etchers for patterning critical features in logic and memory fabrication; and chemical downstream isotropic etch systems for selective material removal. In addition, the company provides wafer handling subsystems, chamber upgrade kits, precision consumable replacement parts, tool refurbishment, and on-site engineering and technical support services. The company caters to leading integrated device manufacturers (IDMs), pure-play foundries, and memory producers producing advanced logic devices, DRAM, 3D NAND flash, power semiconductors, and advanced packaging architectures. Founded in 2015, Beijing E-Town Semiconductor Technology Co., Ltd. is headquartered in Beijing, China, with operational centers, manufacturing facilities, and application laboratories located across China, the United States, South Korea, Taiwan, Japan, Singapore, and Germany, operating major international assets through its subsidiary Mattson Technology, Inc. In recent developments, the company has pursued its Class A share listing on the Science and Technology Innovation Board of the Shanghai Stock Exchange (SSE:688729), expanded cleanroom manufacturing capacities at its advanced semiconductor equipment industrial base in Beijing, and rolled out next-generation high-temperature millisecond annealing and sub-10nm dry strip tool platforms to meet advanced node IC process requirements. Furthermore, the company has deepened strategic technology partnerships with tier-one domestic and international foundries for collaborative process development and accelerated its expansion into compound semiconductor and specialized advanced packaging applications.