Silex Microsystems AB

Silex Microsystems AB

143.85
SEK
-15.60
(-9.78%)
0.93EPS
22.09BMarket Cap
Nov 04Next Earn
2023 Y
2024 Y
2025 Y
Revenue per Share
9.16
10.25
11.58
Basic EPS, GAAP
1.79
2.28
2.25
Free Cash Flow per Basic Share
2.02
2.5
1.32
Dividend per Share
2.32
3.2
2.09
Book Value per Share
12.19
11.65
11.98
Tangible Book Value per Share
12.18
11.65
11.98
Basic Weighted Avg Shares
120
120
120
Sales/Revenue/Turnover
1,095
1,226
1,385
Operating Margin (%)
22.19
22.27
26.43
Depreciation Expense
108
117
125
Net Income, GAAP
214
273
269
Effective Tax Rate (%)
21.61
21.33
21.8
Profit Margin (%)
19.54
22.27
19.42
Working Capital
414
589
500
LT Debt
396
351
285
Total Equity
1,458
1,393
1,432
Return on Invested Capital (%)
- -
13.92
15.73
Return on Capital (%)
- -
15.29
15.51
Return on Common Equity (%)
- -
19.15
19.04

Capital Structure

SEK

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Working Capital

SEK

•

in mil. unless spec.
No data availableFinancial data will appear here once available

Growth Rates

SEK

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
2.8%
Free Cash Flow
- -
- -
-47.16%
Net Income, GAAP
- -
- -
-1.47%
Sales/Revenue/Turnover
- -
- -
12.97%
Total Cash Common Dividend
- -
- -
-34.73%

Quarterly Revenue

SEK

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1,226
2025
334
309
- -
- -
1,385
2026
375
393
- -
- -
- -

Quarterly Earnings Per Share

SEK

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.28
2025
0.51
0.31
- -
- -
2.25
2026
0.86
1
- -
- -
- -

Quarterly Dividends Per Share

SEK

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3.2
2025
- -
- -
- -
- -
2.09
2026
- -
- -
- -
- -
- -

Company Description

CEO
Johan Edvard Sören Kälvesten
Full Time Employees
456
Sector
Electronic technology
Industry
Semiconductors
Address
Järfälla Sweden
IPO Date
May 7, 2026
Business
Silex Microsystems AB is a Sweden-based pure-play Micro-Electro-Mechanical Systems (MEMS) foundry specializing in the development, industrialization, and high-volume wafer fabrication of custom micro-scale devices and advanced heterogeneous packaging solutions. Founded in 2000 and headquartered in Järfälla, Sweden, the company operates as an independent contract manufacturer serving fabless and fab-lite semiconductor companies, original equipment manufacturers (OEMs), and research institutions across the telecommunications, data communications, medical and life sciences, automotive, industrial, consumer electronics, and aerospace sectors. The company provides end-to-end MEMS foundry and process development services, leveraging proprietary manufacturing platforms and advanced modular process capabilities. Its core technology and service offerings include Through-Silicon Via (TSV) integration architectures, featuring Sil-Via for high-aspect-ratio, low-loss via-in-silicon interconnections and Met-Via for high-density metal vertical interconnects; hermetic wafer-level packaging and capping solutions, comprising Sil-Cap silicon capping with integrated feedthroughs and Met-Cap metallic encapsulation; wafer bonding and integration services utilizing SmartBlock platforms, supporting fusion bonding, anodic bonding, glass frit bonding, and eutectic wafer-to-wafer bonding; and specialized materials deposition and processing, such as thin-film lead zirconate titanate (PZT) sol-gel and sputtering processes for piezoelectric micro-actuators and energy harvesting devices. Through these platforms, Silex Microsystems manufactures diverse customer-designed components, including optical MEMS and photonic switches for optical networks and cloud data center infrastructure; microfluidic channels, bio-MEMS, lab-on-a-chip architectures, and drug delivery micropumps for biomedical diagnostic systems; inertial sensors, such as high-performance accelerometers, gyroscopes, and multi-axis inertial measurement units (IMUs); capacitive and piezoelectric micromachined ultrasonic transducers (CMUTs and PMUTs) for medical imaging and gesture recognition; pressure sensors and micro-actuators for industrial automation and automotive applications; and silicon microphones, RF MEMS, and environmental sensors for smart consumer devices. In recent corporate and strategic developments, Silex Microsystems completed a major ownership transition and restructuring, where a Nordic institutional investor consortium led by Bure Equity and Creades AB acquired controlling ownership from Beijing Sai MicroElectronics Inc., reinforcing the company’s status as an independent European semiconductor manufacturer. In May 2026, Silex Microsystems completed its Initial Public Offering (IPO) and listed its shares on Nasdaq Stockholm under the ticker STO:SILEX, securing approximately SEK 1.99 billion in gross proceeds to accelerate global capacity expansions and strategic initiatives. In July 2026, the company entered into an agreement to acquire a 200 mm wafer fabrication plant in Pennsylvania, United States, from onsemi for $40 million, establishing its first North American manufacturing base to provide localized production, shorten customer lead times, and mitigate supply chain risks. Concurrently, the company is executing a SEK 500 million cleanroom expansion at its primary Järfälla manufacturing campus, expanding cleanroom space from 4,000 to 5,500 square meters to meet surging demand for high-volume optical MEMS and sensor manufacturing. Silex Microsystems serves an international customer base across Europe, North America, and Asia.