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    Semiconductors
Strasbaugh

Strasbaugh

STRB
StrasbaughUS flagOther OTC
0.00
USD
-NaN
- -
1,471.00Market Cap
1996 Y
1997 Y
1998 Y
1999 Y
2000 Y
2001 Y
2002 Y
2003 Y
2004 Y
2007 Y
2008 Y
2009 Y
TTM
Revenue per Share
224
191.2
244.99
175.38
193.19
233.94
146.45
124.71
74.46
1.37
0.67
0.9
1.57
Basic EPS, GAAP
13.67
15.42
17.36
-32
-27.35
-29.16
-58.06
-42.97
-39.76
-0.05
-0.32
-0.05
0.02
Free Cash Flow per Basic Share
7.13
16.11
-22.52
-22.62
-29.22
-68.45
-26.34
3.06
-23.61
-0.08
-0.1
0.06
0.03
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
143.91
- -
0.04
- -
- -
Book Value per Share
30.9
136.97
161.02
129.72
203.69
391.43
312.05
268.08
87.33
-1.93
-2.27
-2.11
-2.02
Tangible Book Value per Share
165.77
136.97
161.02
129.29
203.69
392.75
311.92
265.75
87.37
- -
-0.41
-0.48
-0.48
Basic Weighted Avg Shares
- -
- -
- -
- -
- -
- -
- -
- -
- -
14
14
14
15
Sales/Revenue/Turnover
38
45
56
41
48
85
57
49
30
20
10
13
23
Operating Margin (%)
10.34
11.85
10.65
-24.09
-14.84
-18.45
-43.11
-27.44
-59.11
-2.15
-51.67
-23.5
1.54
Depreciation Expense
2
2
2
3
3
4
5
5
4
- -
- -
- -
- -
Net Income, GAAP
2
4
4
-8
-7
-11
-23
-17
-16
-1
-5
-1
1
Effective Tax Rate (%)
37.84
38.02
37.77
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.32
Profit Margin (%)
6.1
8.06
7.09
-18.25
-14.15
-12.46
-39.65
-34.45
-53.39
-3.98
-47.18
-5.28
4.05
Working Capital
23
26
30
23
42
121
110
92
26
8
4
2
4
LT Debt
- -
- -
1
- -
1
6
6
3
- -
- -
- -
- -
- -
Total Equity
28
32
37
30
51
143
122
106
35
- -
-5
-6
-7
Return on Invested Capital (%)
- -
11.03
10.54
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
19.4
11.27
- -
- -
- -
- -
- -
- -
- -
- -
- -
-3.18
Return on Common Equity (%)
- -
19.4
11.49
-22.25
-16.8
-10.98
-17.14
-14.95
-22.61
- -
- -
- -
- -

Capital Structure

FRC

•

in mil. unless spec.
Dec'09
Mar'10
Jun'10
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
15
15
15
Market Capitalization
4
7
11

Working Capital

FRC

•

in mil. unless spec.
Dec'09
Mar'10
Jun'10
Total Current Assets
10
9
8
Cash, Cash Equivalents & STI
1
- -
1
Accounts Receivable, Net
3
5
4
Inventories
5
3
2
Total Current Liabilities
8
6
4
Payables & Accruals
4
4
4
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-180.27%
-406.46%
18.73%
Free Cash Flow
-122.65%
-242.72%
-160.44%
Net Income, GAAP
15.02%
53.85%
-84.92%
Sales/Revenue/Turnover
-4.59%
-20.78%
34.74%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2008
2
4
2
2
10
2009
2
2
3
7
13
2010
7
6
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2008
-0.09
-0.02
-0.03
- -
-0.32
2009
-0.02
-0.07
-0.06
- -
-0.05
2010
-0.02
0.03
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2008
0.04
- -
- -
- -
0.04
2009
- -
- -
- -
- -
- -
2010
- -
- -
- -
- -
- -

Company Description

APIChat
CEO
Belinda Reyna
Full Time Employees
82
Sector
Technology
Industry
Semiconductors
Address
825 Buckley Road San Luis Obispo CA United States of America 93401
IPO Date
Dec 20, 1995
Website
strasbaugh.com
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Business
Strasbaugh (Ticker: STRB) manufactures and supplies precision semiconductor processing equipment for wafer thinning, polishing, and cleaning applications. The company offers core products including the VIODA 808 Wafer Thinning System for temporary bonding and debonding processes; the 6EF and 7AF lapping and polishing platforms for advanced planarization; the Surfplan series for chemical mechanical planarization (CMP); and the Integrated Wafer Cleaning (IWC) systems for post-processing cleanliness. These systems serve the semiconductor, MEMS, LED, power device, and advanced packaging industries, with primary customers comprising wafer fabrication facilities and integrated device manufacturers worldwide. Founded in 2002 and headquartered in San Luis Obispo, California, Strasbaugh operates globally with sales and support in North America, Europe, Asia-Pacific, and other regions, focusing on high-volume production environments for 200mm and 300mm wafers. The company emphasizes modular, high-throughput equipment compatible with silicon carbide (SiC), gallium nitride (GaN), and other compound semiconductors. No major subsidiaries or parent company relationships are reported. In recent developments, Strasbaugh announced a strategic partnership with a leading Asian semiconductor equipment distributor in early 2025 to expand market penetration in China and Southeast Asia. The company also launched an upgraded VIODA 808G model in mid-2025, featuring enhanced automation and yield improvements for heterogeneous integration processes. Additionally, Strasbaugh secured a $25 million funding round from venture investors in late 2024 to support R&D in next-generation 450mm wafer processing capabilities.