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Taiwan Ic Packaging Corporation

Taiwan Ic Packaging Corporation

TTPEX:3372
15.05
TWD
-0.15
(-0.99%)
3.68BMarket Cap
Taiwan Ic Packaging Corporation
TPEX:3372
(Taipei Exchange)

Recent

price

15.05

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
26.1
20.92
20.65
16.89
14.99
10.38
9.8
7.9
7.1
6.59
6.75
10.85
6.82
4.78
4.97
6.02
- -
Revenue per Share
0.02
-2.25
-1.5
-3.04
0.42
-0.62
-1.54
-4.81
-3.17
-0.26
-0.06
2.3
0.47
-0.98
-1.02
-1.17
- -
Basic EPS, GAAP
1.44
1.1
1.04
1.1
-0.03
-1.09
-2.48
-2.87
-1.02
-0.27
-0.83
1.48
1.55
-0.35
-0.47
-1.05
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.98
0.49
- -
- -
- -
Dividend per Share
25.03
22.78
21.26
18.39
20.09
19.28
17.92
13.25
10.12
9.84
9.78
11.9
11.64
10.29
9.39
8.22
8.12
Book Value per Share
25.03
22.78
21.26
18.39
20.09
19.28
17.92
13.25
10.12
9.84
9.78
11.9
11.64
10.29
9.39
8.22
8.12
Tangible Book Value per Share
138
138
138
133
148
177
178
178
179
179
179
179
179
180
182
183
183
Basic Weighted Avg Shares
3,612
2,896
2,857
2,250
2,218
1,841
1,742
1,409
1,271
1,181
1,210
1,945
1,223
862
904
1,099
- -
Sales/Revenue/Turnover
1.12
-9.81
-7.38
-18.54
0.36
-9.57
-14.74
-58.22
-47.31
-5.24
-0.71
21.32
1.25
-22.85
-26.79
-19.57
- -
Operating Margin (%)
516
520
532
438
279
255
227
203
152
95
120
139
158
172
177
176
- -
Depreciation Expense
3
-312
-208
-406
62
-110
-274
-858
-568
-47
-11
412
84
-177
-185
-214
- -
Net Income, GAAP
87.42
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
0.09
-10.76
-7.27
-18.03
2.78
-5.95
-15.72
-60.88
-44.71
-4.02
-0.91
21.16
6.88
-20.54
-20.5
-19.44
- -
Profit Margin (%)
1,162
1,109
1,148
1,196
2,157
1,809
1,313
858
762
664
615
1,034
1,050
823
659
509
537
Working Capital
206
113
23
- -
- -
- -
- -
- -
- -
84
81
79
67
65
64
62
64
LT Debt
3,463
3,152
2,943
2,547
3,563
3,478
3,221
2,378
1,814
1,763
1,754
2,170
2,127
1,879
1,714
1,502
1,484
Total Equity
0.12
- -
- -
- -
0.26
- -
- -
- -
- -
- -
- -
20.27
0.68
- -
- -
- -
- -
Return on Invested Capital (%)
0.11
- -
- -
- -
2.01
- -
- -
- -
- -
- -
- -
20.18
3.82
- -
- -
- -
- -
Return on Capital (%)
0.1
-9.42
-6.82
-14.78
2.02
-3.11
-8.17
-30.64
-27.1
-2.65
-0.63
20.98
3.92
-8.84
-10.32
-13.29
- -
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2
2
2
LT Borrowings
- -
- -
- -
LT Finance Leases
62
65
64
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
183
183
183
Market Capitalization
3,778
3,243
3,680

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
783
782
823
Cash, Cash Equivalents & STI
287
259
224
Accounts Receivable, Net
243
229
254
Inventories
183
219
265
Total Current Liabilities
273
249
287
Payables & Accruals
- -
- -
- -
ST Debt
2
2
2
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-7.17%
-2.21%
-12.37%
Free Cash Flow
-2.66%
-47.44%
125.14%
Net Income, GAAP
-403.75%
-839.72%
15.27%
Sales/Revenue/Turnover
-1.83%
4.11%
21.56%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
217
246
223
218
904
2025
228
283
- -
298
1,099
2026
310
338
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.16
-0.16
-0.39
-0.31
-1.02
2025
-0.34
-0.44
- -
-0.15
-1.17
2026
-0.03
-0.07
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Taiwan IC Packaging Corporation specializes in advancing optical and exceptionally thin integrated circuit packaging solutions. The company delivers a diverse portfolio of products, encompassing conventional lead-frame designs like thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, and various quad flat packages, alongside thermal enhanced and image sensor packages. Additionally, they provide sophisticated substrate-based offerings such as LGA, VLGA, BGA, and memory card formats including micro-SD and SD cards. Established in 1998 and based in Kaohsiung, Taiwan, the firm also furnishes extensive semiconductor packaging and testing services, delivering turnkey solutions for memory, analog, and mixed-signal ICs, as well as chip probing and final testing. Their innovations are integral to consumer electronics, computer peripherals, power management, mobile communications, and portable electronic devices.