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  2. •

    Electronic technology

  3. •

    Semiconductors
Taiwan Ic Packaging Corporation

Taiwan Ic Packaging Corporation

TTPEX:3372
15.05
TWD
-0.15
(-0.99%)
3.68BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
16.89
14.99
10.38
9.8
7.9
7.1
6.59
6.75
10.85
6.82
4.78
4.97
6.02
- -
Basic EPS, GAAP
-3.04
0.42
-0.62
-1.54
-4.81
-3.17
-0.26
-0.06
2.3
0.47
-0.98
-1.02
-1.17
- -
Free Cash Flow per Basic Share
1.1
-0.03
-1.09
-2.48
-2.87
-1.02
-0.27
-0.83
1.48
1.55
-0.35
-0.47
-1.05
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.98
0.49
- -
- -
- -
Book Value per Share
18.39
20.09
19.28
17.92
13.25
10.12
9.84
9.78
11.9
11.64
10.29
9.39
8.22
8.12
Tangible Book Value per Share
18.39
20.09
19.28
17.92
13.25
10.12
9.84
9.78
11.9
11.64
10.29
9.39
8.22
8.12
Basic Weighted Avg Shares
133
148
177
178
178
179
179
179
179
179
180
182
183
183
Sales/Revenue/Turnover
2,250
2,218
1,841
1,742
1,409
1,271
1,181
1,210
1,945
1,223
862
904
1,099
- -
Operating Margin (%)
-18.54
0.36
-9.57
-14.74
-58.22
-47.31
-5.24
-0.71
21.32
1.25
-22.85
-26.79
-19.57
- -
Depreciation Expense
438
279
255
227
203
152
95
120
139
158
172
177
176
- -
Net Income, GAAP
-406
62
-110
-274
-858
-568
-47
-11
412
84
-177
-185
-214
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-18.03
2.78
-5.95
-15.72
-60.88
-44.71
-4.02
-0.91
21.16
6.88
-20.54
-20.5
-19.44
- -
Working Capital
1,196
2,157
1,809
1,313
858
762
664
615
1,034
1,050
823
659
509
537
LT Debt
- -
- -
- -
- -
- -
- -
84
81
79
67
65
64
62
64
Total Equity
2,547
3,563
3,478
3,221
2,378
1,814
1,763
1,754
2,170
2,127
1,879
1,714
1,502
1,484
Return on Invested Capital (%)
- -
0.26
- -
- -
- -
- -
- -
- -
20.27
0.68
- -
- -
- -
- -
Return on Capital (%)
- -
2.01
- -
- -
- -
- -
- -
- -
20.18
3.82
- -
- -
- -
- -
Return on Common Equity (%)
-14.78
2.02
-3.11
-8.17
-30.64
-27.1
-2.65
-0.63
20.98
3.92
-8.84
-10.32
-13.29
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2
2
2
LT Borrowings
- -
- -
- -
LT Finance Leases
62
65
64
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
183
183
183
Market Capitalization
3,778
3,243
3,680

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
783
782
823
Cash, Cash Equivalents & STI
287
259
224
Accounts Receivable, Net
243
229
254
Inventories
183
219
265
Total Current Liabilities
273
249
287
Payables & Accruals
- -
- -
- -
ST Debt
2
2
2
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-7.17%
-2.21%
-12.37%
Free Cash Flow
-2.66%
-47.44%
125.14%
Net Income, GAAP
-403.75%
-839.72%
15.27%
Sales/Revenue/Turnover
-1.83%
4.11%
21.56%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
217
246
223
218
904
2025
228
283
- -
298
1,099
2026
310
338
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.16
-0.16
-0.39
-0.31
-1.02
2025
-0.34
-0.44
- -
-0.15
-1.17
2026
-0.03
-0.07
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Chung Ho Tseng
Full Time Employees
488
Sector
Electronic technology
Industry
Semiconductors
Address
No. 1, South 2nd Road Kaohsiung City KHH Taiwan
IPO Date
Aug 3, 2004
Website
ticp.com.tw
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Business
Taiwan IC Packaging Corporation specializes in advancing optical and exceptionally thin integrated circuit packaging solutions. The company delivers a diverse portfolio of products, encompassing conventional lead-frame designs like thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, and various quad flat packages, alongside thermal enhanced and image sensor packages. Additionally, they provide sophisticated substrate-based offerings such as LGA, VLGA, BGA, and memory card formats including micro-SD and SD cards. Established in 1998 and based in Kaohsiung, Taiwan, the firm also furnishes extensive semiconductor packaging and testing services, delivering turnkey solutions for memory, analog, and mixed-signal ICs, as well as chip probing and final testing. Their innovations are integral to consumer electronics, computer peripherals, power management, mobile communications, and portable electronic devices.