CerTone Heat Solution Co Ltd
TTPEX:7929368.00
TWD
-17.00
(-4.42%)
ISIN
TW0007929002
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- Hsinchu County Taiwan
- Website
- certone.com.tw
- Similar Companies
- Business
- CerTone Heat Solution Co Ltd is a Taiwan-based thermal management engineering and manufacturing company that designs, develops, and produces advanced heat dissipation components and cooling systems for high-performance computing, artificial intelligence servers, cloud data centers, telecommunications infrastructure, industrial electronics, and automotive applications. Founded and headquartered in Taiwan, the company offers a comprehensive suite of thermal products and integrated engineering services, which are categorized into two-phase cooling devices, including ultra-thin vapor chambers, 3D vapor chambers, and sintered copper heat pipes; liquid cooling systems and components, comprising direct-to-chip (D2C) liquid cold plates, coolant distribution units (CDUs), fluid manifold assemblies, leak-detection modules, and quick-disconnect couplings; air cooling assemblies, including skived-fin heat sinks, stamped and folded fin modules, extruded copper and aluminum thermal sinks, and fan-heatsink combinations; and customized engineering solutions, such as computational fluid dynamics (CFD) thermal simulations, rapid prototyping, thermal interface material (TIM) application, and environmental reliability testing. The company serves global original design manufacturers (ODMs), electronic manufacturing service (EMS) providers, and brand-name technology enterprises across Asia, North America, and Europe. In recent operational developments, CerTone Heat Solution Co Ltd listed on the Taipei Exchange (TPEx) Emerging Stock Board under ticker 7929 to accelerate business growth and capital investment. In response to increasing power densities in generative artificial intelligence and high-density server racks, the company has scaled its direct-to-chip liquid cooling manufacturing capacity, implemented automated production lines for liquid cold plates and manifolds, and formed strategic alliances with server platform vendors to co-develop next-generation hybrid liquid-to-air and immersion cooling solutions.