1. Taiwan Stocks

  2. •

    Non-energy minerals

  3. •

    Other metals/Minerals
CO-TECH DEVELOPMENT CORP.

CO-TECH DEVELOPMENT CORP.

TTPEX:8358
438.50
TWD
-43.50
(-9.02%)
6.37EPS
94.13P/E
151.49BMarket Cap
Nov 06Next Earn
CO-TECH DEVELOPMENT CORP.
TPEX:8358
(Taipei Exchange)

Recent

price

438.50

P/E

ratio

94.13

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
27.67
21.78
21.8
18.63
18.17
19.67
24.88
29.74
24.7
20.67
23.9
35.29
29.33
24.43
27.01
31.21
37.65
Revenue per Share
2.34
-0.67
-0.45
-0.62
-1.38
-0.93
2.96
5.02
2.93
1.57
2.14
6.03
3.83
2.11
3.65
4.21
6.37
Basic EPS, GAAP
1.31
0.29
0.79
0.52
-1.73
-0.97
2.05
6.99
2.87
2.06
2.63
3.48
-0.24
-0.06
2.01
-0.55
0.14
Free Cash Flow per Basic Share
0.48
1.36
- -
- -
- -
- -
- -
- -
3
2.2
2
2
4.2
2.5
1.5
1.5
- -
Dividend per Share
12.85
10.73
10.26
9.61
8.22
7.24
10.2
21.04
20.95
20.29
20.41
24.42
24.09
23.69
25.86
29.75
36.84
Book Value per Share
12.85
10.72
10.25
9.61
8.22
7.23
10.18
21.03
20.94
20.28
20.41
24.42
24.08
23.68
25.85
29.73
36.82
Tangible Book Value per Share
209
218
217
217
217
217
217
223
253
253
253
253
253
253
253
253
252
Basic Weighted Avg Shares
5,791
4,747
4,729
4,040
3,940
4,265
5,396
6,618
6,240
5,221
6,037
8,915
7,407
6,170
6,822
7,880
9,503
Sales/Revenue/Turnover
9.26
-1.56
-0.88
-2.19
-6.86
-3.21
13.67
20.79
15.89
11.2
12.24
21.4
15.56
11.19
16.75
18.37
22.5
Operating Margin (%)
344
332
316
318
316
333
302
293
240
252
242
201
173
123
96
90
92
Depreciation Expense
490
-146
-98
-135
-299
-202
643
1,117
741
397
542
1,523
967
533
922
1,063
1,609
Net Income, GAAP
0.46
- -
- -
- -
- -
- -
8.28
16.05
22.59
26.52
19.39
20.04
18.37
20
19.75
20.75
20.85
Effective Tax Rate (%)
8.46
-3.08
-2.07
-3.34
-7.58
-4.72
11.91
16.87
11.88
7.6
8.97
17.09
13.06
8.64
13.51
13.48
16.93
Profit Margin (%)
801
126
668
298
-743
111
931
2,933
3,300
3,363
3,495
3,738
2,606
2,013
2,312
2,232
2,579
Working Capital
1,253
1,327
1,712
791
603
1,452
1,408
27
340
277
168
57
2
1
- -
4
3
LT Debt
2,801
2,337
2,225
2,084
1,860
1,610
2,206
5,325
5,297
5,124
5,156
6,169
6,085
5,983
6,531
7,511
9,301
Total Equity
11.81
- -
- -
- -
- -
- -
13.98
18.66
11.06
6.85
9.81
23.01
13.54
7.97
12
13.65
18.7
Return on Invested Capital (%)
11.61
- -
- -
- -
- -
- -
15.33
19.57
11.58
6.79
9.16
23.86
14.35
7.93
12.65
13.07
18.47
Return on Capital (%)
19.7
-5.7
-4.29
-6.26
-15.45
-12.02
34.01
29.68
13.98
7.62
10.54
26.9
15.79
8.83
14.73
15.13
19.99
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
996
1,150
1,271
LT Borrowings
- -
- -
- -
LT Finance Leases
4
4
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
252
252
252
Market Capitalization
69,940
59,714
151,495

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
4,153
5,120
5,634
Cash, Cash Equivalents & STI
745
976
1,216
Accounts Receivable, Net
2,388
2,720
2,985
Inventories
941
1,294
1,323
Total Current Liabilities
1,921
2,501
3,055
Payables & Accruals
- -
- -
- -
ST Debt
996
1,150
1,271
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
21.6%
8.15%
15.01%
Free Cash Flow
-378.41%
-733.73%
-127.6%
Net Income, GAAP
-20.08%
37.62%
15.27%
Sales/Revenue/Turnover
8.29%
8.03%
15.52%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,505
1,817
1,793
1,707
6,822
2025
1,728
2,002
- -
2,164
7,880
2026
2,532
2,805
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.84
1.15
0.88
0.77
3.65
2025
1.05
0.66
- -
1.49
4.21
2026
2.06
2.16
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1.5
2025
- -
- -
- -
- -
1.5
2026
- -
- -
- -
- -
- -
Similar Companies
MP Materials Corp. (NYSE:MP)
Energy Fuels Inc (AMEX:UUUU)
Freeport-McMoRan, Inc. (NYSE:FCX)
Hindalco Industries Limited (NSE:HINDALCO)
Cameco Corporation (NYSE:CCJ)
Uranium Energy Corp. (AMEX:UEC)
Business
Co-Tech Development Corporation engages in the production and sale of electrolytic copper foils primarily used in printed circuit boards (PCBs) for information electronics, communication products, computers, consumer electronics, automotive electronics, and industrial control products. The company's core products include copper foil substrates, flexible copper clad laminates (FCCL), flexible PCBs, BGA carrier boards, chip on film (COF), and related materials such as fiberglass cloth, epoxy resin, and polyimide (PI). Co-Tech caters to markets in Taiwan, China, the rest of Asia, and the Americas. Founded in 1998 and headquartered in Taipei, Taiwan, Co-Tech was formerly known as Co-Tech Copper Foil Corporation until its name change in June 2014. Recently, Co-Tech Development accelerated expansion of its high-value, low-profile (HVLP) copper foil production capacity, aiming to increase monthly output to 150 tonnes starting in 2026 and targeting over 1,000 tonnes monthly production by late 2027. This capacity boost is driven by growing demand for PCBs related to artificial intelligence servers and 5G communication applications, which is expected to improve the company’s gross margin to about 40%. The company is establishing new factories to support this growth and has reported substantial revenue increases, with 2024 revenues reaching NT$6.82 billion (approximately US$200 million) and significant share price appreciation in 2025. Co-Tech continues to invest in research and development to support product innovation in AIoT, cloud computing, automotive electronics, wearables, and home appliance markets. The company operates under a technology sector classification with approximately 278 employees and key management including GM and Chairman Shih-Shen Lee. Its subsidiaries and investment activities complement its operations focused on copper foil and related copper-based electronic components. Co-Tech remains a strategic player in the electronic components supply chain, emphasizing advanced materials critical for next-generation electronics and communication systems in regional and global markets.