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    Electronic technology

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    Electronic production equipment
Foxsemicon Integrated Technology Inc.

Foxsemicon Integrated Technology Inc.

TTWSE:3413
276.00
TWD
-5.50
(-1.95%)
20.91EPS
16.34P/E
36.61BMarket Cap
Nov 11Next Earn
Foxsemicon Integrated Technology Inc.
TWSE:3413
(Taiwan Stock Exchange)

Recent

price

276.00

P/E

ratio

16.34

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
126.4
60.01
110.63
84.26
68.4
77.26
100.18
98.78
112.53
88.35
120.16
139.9
157.67
134.28
158.82
191.28
205.45
Revenue per Share
4.37
-5.06
-16.06
1.46
4.8
7.36
8.21
12.98
14.06
7.85
14.91
17.01
24.64
20.48
25.22
21.44
20.22
Basic EPS, GAAP
-27.67
15.55
32.66
16.34
-2.06
9.25
-0.91
3.23
13.08
12.69
21.7
1.3
7.91
21.57
2.24
-10.31
-8.54
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
0.86
3.48
3.63
5.71
7
4
7
8.92
13.78
11.32
14.61
- -
Dividend per Share
15.65
12.14
2.68
16.49
20.52
28.01
34.14
43.82
51.46
51.72
66.23
84.93
111.9
119.38
143.47
150.61
149.42
Book Value per Share
15.65
12.14
2.68
16.49
20.52
28.01
34.14
43.82
51.46
51.72
66.23
84.93
111.9
119.38
143.12
136.29
135.57
Tangible Book Value per Share
30
43
24
29
67
70
78
83
83
83
83
88
94
97
104
109
110
Basic Weighted Avg Shares
3,849
2,565
2,680
2,469
4,603
5,409
7,838
8,168
9,305
7,306
9,942
12,246
14,843
13,051
16,454
20,842
22,631
Sales/Revenue/Turnover
2.46
7.56
7.54
2.66
3.33
9.5
9.48
14.82
14.33
11.64
16.43
16.24
19.89
15.53
16.18
14.92
12.61
Operating Margin (%)
153
124
104
91
75
85
98
113
247
277
278
254
314
410
551
723
845
Depreciation Expense
133
-216
-389
43
323
515
642
1,073
1,163
649
1,234
1,489
2,320
1,990
2,613
2,336
2,228
Net Income, GAAP
11.41
11.29
11.68
8.08
3.24
7.85
22.32
18.66
18.87
18.87
18.15
20.69
18.9
20.78
18.73
20.98
24.14
Effective Tax Rate (%)
3.45
-8.44
-14.52
1.74
7.02
9.52
8.19
13.14
12.5
8.89
12.41
12.16
15.63
15.25
15.88
11.21
9.84
Profit Margin (%)
-307
-398
-675
-30
270
1,125
1,860
2,138
3,469
3,009
5,197
7,381
8,106
10,788
10,596
6,653
6,599
Working Capital
- -
- -
- -
- -
- -
- -
- -
- -
969
1,107
2,051
2,407
1,775
3,722
1,971
1,392
1,491
LT Debt
669
519
115
1,110
1,381
2,136
2,823
3,624
4,255
4,304
5,518
7,524
10,831
11,602
15,207
17,960
18,031
Total Equity
3.13
6.36
9.22
4.22
9.37
22.12
20.93
27.62
21.98
12.59
18.62
16.37
18.51
10.35
12.71
12.12
9.8
Return on Invested Capital (%)
7
-6.04
-18.2
4.24
20.78
24.57
23.97
31.34
24.95
12.3
17.68
15.8
18.54
13.31
15.85
11.59
9.89
Return on Capital (%)
21.87
-36.42
-122.8
7
25.95
29.29
25.9
33.3
29.51
15.22
25.28
23.02
25.37
17.75
19.49
14.72
14.57
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2,530
4,308
4,263
LT Borrowings
1,208
865
1,321
LT Finance Leases
185
173
169
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
110
111
111
Market Capitalization
30,475
31,955
36,607

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
14,680
16,490
16,592
Cash, Cash Equivalents & STI
8,031
8,673
7,218
Accounts Receivable, Net
1,503
2,120
2,758
Inventories
4,430
4,800
5,671
Total Current Liabilities
8,026
10,971
9,992
Payables & Accruals
- -
- -
- -
ST Debt
2,530
4,308
4,263
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
24.39%
27.32%
18.1%
Free Cash Flow
-24.45%
-6.25%
-584.36%
Net Income, GAAP
22.9%
16.6%
-10.58%
Sales/Revenue/Turnover
16.27%
17.01%
26.66%
Total Cash Common Dividend
60.59%
41.02%
35.7%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,322
3,721
4,612
4,799
16,454
2025
4,869
5,203
5,542
5,227
20,842
2026
5,562
6,300
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
5.52
6.75
5.52
7.44
25.22
2025
6.71
3.41
6.1
5.25
21.44
2026
4.28
4.61
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
11.32
2025
- -
- -
- -
- -
14.61
2026
- -
- -
- -
- -
- -
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Business
Foxsemicon Integrated Technology Inc. (Ticker: 3413.TW) is a Taiwan-based semiconductor company specializing in the manufacture and provision of semiconductor packaging and test services. The company's core products and services include outsourced semiconductor assembly and testing (OSAT) services, encompassing wafer bumping, wafer-level packaging, advanced packaging solutions, and final testing services for integrated circuits. Foxsemicon serves various semiconductor sectors including consumer electronics, communications, and computing by providing customized packaging options like flip chip, wafer-level chip scale package (WLCSP), and system-in-package (SiP) technologies. Established in 2007, the company is headquartered in Hsinchu, Taiwan, and extends its operations primarily across Asia. In the last 1-2 years, Foxsemicon Integrated Technology has focused on expanding its capabilities in advanced packaging technologies to meet market demands, including new product launches targeting 5G and high-performance computing applications. The company has pursued strategic partnerships and investments to enhance its technological portfolio and capacity. It has also invested in research and development to improve yield and performance in semiconductor packaging, aligning with industry trends toward miniaturization and integration. Foxsemicon continues to emphasize innovation in packaging solutions to support emerging semiconductor applications while maintaining a strong presence in the competitive Asian market. Foxsemicon operates within the semiconductor industry’s OSAT segment, targeting semiconductor designers and manufacturers as its primary customers. Its services are critical across multiple high-growth end markets such as mobile devices, automotive electronics, and IoT devices. The company operates in Taiwan and has strategic business relationships across other Asian markets, offering targeted solutions that enhance chip performance and integration. Foxsemicon is publicly traded on the Taiwan Stock Exchange under ticker 3413.TW and maintains a focus on growing its footprint through technological advancement and strategic collaborations.