Global Unichip Corp.

Global Unichip Corp.

TTWSE:3443
7,585.00
TWD
-415.00
(-5.19%)
649.28BMarket Cap
Global Unichip Corp.
TWSE:3443
(Taiwan Stock Exchange)

Recent

price

7,585.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
TWD
77.47
68.29
67.26
45.86
51.88
57.92
69.33
90.74
100.44
79.92
101.26
112.74
179.39
195.81
186.88
254.76
- -
Revenue per Share
4.56
3.94
4.58
2.15
3.27
3.69
4.11
6.38
7.37
4.73
6.34
10.9
27.69
26.18
25.75
28.13
- -
Basic EPS, GAAP
3.14
9.85
7.99
0.89
8.18
5.3
8.8
11.91
-4.04
-4.88
20.94
28.72
6.83
30.08
40.37
-17.27
- -
Free Cash Flow per Basic Share
1.99
2.99
3
2.98
3
3
3
3.5
5
5
5
5
7
14
14
16
- -
Dividend per Share
23.83
24.63
26.11
25.28
25.62
26.32
27.4
30.2
32.58
32.18
33.48
39.28
60.15
72.24
84.28
96.36
100.48
Book Value per Share
23.83
22.65
24.82
23.47
23.9
25.16
25.42
27.79
30.43
29.11
30.17
36.9
56.11
67.86
81.01
92.04
96.25
Tangible Book Value per Share
133
134
134
135
134
134
134
134
134
134
134
134
134
134
134
134
134
Basic Weighted Avg Shares
10,271
9,147
9,014
6,177
6,952
7,762
9,290
12,161
13,460
10,710
13,569
15,108
24,040
26,241
25,044
34,141
- -
Sales/Revenue/Turnover
5.69
6.34
7.87
5.13
6.83
7.25
6.7
7.65
8.15
6.7
7.1
10.95
17.05
15.12
15.77
12.31
- -
Operating Margin (%)
287
244
234
225
225
225
237
256
413
598
678
672
652
615
623
677
- -
Depreciation Expense
605
527
613
289
439
494
551
855
988
633
850
1,460
3,710
3,508
3,451
3,770
- -
Net Income, GAAP
9
13.82
13.14
16.99
14.63
15.12
13.09
13.53
12.97
19.11
15.13
16.15
14.6
15.58
15.06
15.15
- -
Effective Tax Rate (%)
5.89
5.77
6.8
4.68
6.31
6.37
5.93
7.03
7.34
5.91
6.26
9.66
15.43
13.37
13.78
11.04
- -
Profit Margin (%)
2,463
2,638
2,925
2,826
2,862
2,984
3,070
3,279
2,994
2,978
3,326
4,425
6,959
8,482
9,812
10,704
10,487
Working Capital
59
30
17
- -
- -
- -
- -
- -
- -
200
189
210
215
172
110
190
187
LT Debt
3,183
3,300
3,499
3,387
3,434
3,528
3,672
4,047
4,366
4,313
4,487
5,263
8,061
9,682
11,294
12,913
13,465
Total Equity
17.74
15.02
17.76
7.48
11.75
13.68
14.93
20.54
22.13
12.35
17.28
26.53
47.65
35.03
29.48
29.36
- -
Return on Invested Capital (%)
20.04
16.05
17.93
8.39
12.86
14.2
15.31
22.15
23.49
14.25
18.36
28.53
53.52
38.44
32.26
30.6
- -
Return on Capital (%)
20.28
16.27
18.04
8.4
12.86
14.2
15.31
22.15
23.49
14.6
19.32
29.95
55.69
39.54
32.9
31.14
- -
Return on Common Equity (%)

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
79
89
84
LT Borrowings
- -
- -
- -
LT Finance Leases
190
208
187
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
134
134
134
Market Capitalization
284,773
290,134
649,283

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
25,737
31,639
33,873
Cash, Cash Equivalents & STI
8,984
10,379
10,376
Accounts Receivable, Net
3,417
4,752
3,933
Inventories
10,148
13,740
14,540
Total Current Liabilities
15,033
19,973
23,386
Payables & Accruals
- -
- -
- -
ST Debt
79
89
84
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.66%
24.31%
14.33%
Free Cash Flow
-34.82%
38.6%
-142.77%
Net Income, GAAP
30.85%
45.61%
9.24%
Sales/Revenue/Turnover
17.89%
22.28%
36.32%
Total Cash Common Dividend
- -
- -
14.29%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
5,690
6,720
6,611
6,023
25,044
2025
7,024
6,105
- -
12,400
34,141
2026
11,448
13,897
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
4.94
6.78
7.71
6.32
25.75
2025
7.17
5.84
- -
8.65
28.13
2026
12.28
11.61
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
14
2025
- -
- -
- -
- -
16
2026
- -
- -
- -
- -
- -
Business
Global Unichip Corporation (GUC) specializes in advanced application-specific integrated circuit (ASIC) services, offering comprehensive semiconductor design and manufacturing solutions. Its core products and services include ASIC design, wafer manufacturing, packaging, and testing; embedded memory and logic components; cell libraries; electronic design automation (EDA) tools; and intellectual property (IP) offerings such as high-bandwidth memory (HBM) IPs, multi-die interconnect IPs, and mixed-signal IPs. GUC provides full turnkey services encompassing spec-in and SoC integration, physical implementation, advanced packaging technologies such as 2.5D/3D Multi-die Advanced Packaging platforms (CoWoS, InFO, SoIC, System on Wafer), non-recurring engineering, supply chain management, and product consulting and support. The company operates globally with presence in China, the United States, Taiwan, Japan, Korea, Europe, and Vietnam. Founded in 1998 and headquartered in Hsinchu, Taiwan, GUC has established a global reputation as a leader in ASIC solutions catering to AI, high-performance computing (HPC), networking, and cryptocurrency application sectors. Recent major developments include the successful tape-out of the world’s first HBM4 controller and PHY IP using TSMC’s N3P process and CoWoS-R advanced packaging technology. In 2025, GUC expanded its R&D headcount and invested in advanced node design, packaging technologies, and IP development to sustain innovation and growth. The company also opened a new office in Yokohama, Japan, and entered a strategic partnership with Ayar Labs to advance co-packaged optics for hyperscale datacenter applications. These moves demonstrate GUC’s focus on cutting-edge semiconductor IPs, advanced packaging solutions, and strategic alliances to capture new market opportunities. GUC’s business segments include ASIC/wafer services delivering customized wafer production and testing, non-recurring engineering offering circuit design and mask making, multi-project wafer services enabling cost-effective prototype validation, and a strong IP portfolio supporting advanced semiconductor design. Its client base spans data centers, AI computing, cryptocurrency, and telecommunications industries. The firm reported robust revenue growth in 2025 driven by increasing AI design service demand and cryptocurrency-related turnkey solutions, reflecting its operational strength amid evolving industry trends and export control challenges. Overall, Global Unichip Corporation provides an integrated suite of advanced ASIC design, manufacturing, packaging, and IP solutions with a global footprint centered in Taiwan, driving innovation in emerging technology markets through its expanded R&D investment and strategic partnerships. Its comprehensive product offerings and recent advancements position it prominently within the semiconductor industry ecosystem.