Global Unichip Corp.
TTWSE:34437,585.00
TWD
-415.00
(-5.19%)
ISIN
TW0003443008
Return %
Stock
S&P 500
1Y
355.56
14.20
3Y
377.04
81.12
5Y
1,226.05
68.34
Capital Structure
TWD
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in mil. unless spec.Working Capital
TWD
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in mil. unless spec.Growth Rates
TWD
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in mil. unless spec.Quarterly Revenue
TWD
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
TWD
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in mil. unless spec.Company Description
- CEO
- Shang Yi Dai
- Full Time Employees
- 1,189
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 10, Li-Hsin 6th Road Hsinchu TP Taiwan 300096
- IPO Date
- Dec 24, 2004
- Website
- guc-asic.com
- Similar Companies
- Business
- Global Unichip Corporation (GUC) specializes in advanced application-specific integrated circuit (ASIC) services, offering comprehensive semiconductor design and manufacturing solutions. Its core products and services include ASIC design, wafer manufacturing, packaging, and testing; embedded memory and logic components; cell libraries; electronic design automation (EDA) tools; and intellectual property (IP) offerings such as high-bandwidth memory (HBM) IPs, multi-die interconnect IPs, and mixed-signal IPs. GUC provides full turnkey services encompassing spec-in and SoC integration, physical implementation, advanced packaging technologies such as 2.5D/3D Multi-die Advanced Packaging platforms (CoWoS, InFO, SoIC, System on Wafer), non-recurring engineering, supply chain management, and product consulting and support. The company operates globally with presence in China, the United States, Taiwan, Japan, Korea, Europe, and Vietnam. Founded in 1998 and headquartered in Hsinchu, Taiwan, GUC has established a global reputation as a leader in ASIC solutions catering to AI, high-performance computing (HPC), networking, and cryptocurrency application sectors. Recent major developments include the successful tape-out of the world’s first HBM4 controller and PHY IP using TSMC’s N3P process and CoWoS-R advanced packaging technology. In 2025, GUC expanded its R&D headcount and invested in advanced node design, packaging technologies, and IP development to sustain innovation and growth. The company also opened a new office in Yokohama, Japan, and entered a strategic partnership with Ayar Labs to advance co-packaged optics for hyperscale datacenter applications. These moves demonstrate GUC’s focus on cutting-edge semiconductor IPs, advanced packaging solutions, and strategic alliances to capture new market opportunities. GUC’s business segments include ASIC/wafer services delivering customized wafer production and testing, non-recurring engineering offering circuit design and mask making, multi-project wafer services enabling cost-effective prototype validation, and a strong IP portfolio supporting advanced semiconductor design. Its client base spans data centers, AI computing, cryptocurrency, and telecommunications industries. The firm reported robust revenue growth in 2025 driven by increasing AI design service demand and cryptocurrency-related turnkey solutions, reflecting its operational strength amid evolving industry trends and export control challenges. Overall, Global Unichip Corporation provides an integrated suite of advanced ASIC design, manufacturing, packaging, and IP solutions with a global footprint centered in Taiwan, driving innovation in emerging technology markets through its expanded R&D investment and strategic partnerships. Its comprehensive product offerings and recent advancements position it prominently within the semiconductor industry ecosystem.