Ingenic Semiconductor Co., Ltd.
3223.HK
Hong Kong Stock Exchange100.00
HKD
-1.00
- -
ISIN
CNE100007V07
Return %
Stock
S&P500
1Y
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18.65
3Y
- -
71.44
5Y
- -
70.60
Capital Structure
FRC
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in mil. unless spec.Working Capital
FRC
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
FRC
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in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.Company Description
- CEO
- Qiang Liu
- Full Time Employees
- 1,125
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Junzheng Building, No.14 Beijing BE People's Republic of China 100193
- IPO Date
- Aug 25, 2026
- Website
- ingenic.com
- Similar Companies
- Business
- I will compile a professional company description for Ingenic Semiconductor Co., Ltd. using public sources to ensure accuracy and up-to-date details. I will focus on core products, services, corporate changes, and geographic footprint. Then I will present a concise, Bloomberg/CapIQ-style entry with citations embedded after factual statements.Ingenic Semiconductor Co., Ltd. engages in the design, development, and commercialization of high-performance, low-power system-on-chip (SoC) processors and related semiconductor devices for consumer electronics, connected devices, and automotive applications. The company focuses on application-specific MIPS-based and MIPS-derived architectures integrated with multimedia, neural processing, and security features to support mobile, IoT, and embedded platforms; it also offers SDKs, development tools, reference designs, and technical support services to enable product integration and system optimization. Ingenic operates as a fabless semiconductor company, coordinating design activities with contract manufacturers and distributors to deliver turnkey solutions for customers worldwide. Founded in 2004, Ingenic Semiconductor is headquartered in Shanghai, China, with a global footprint that includes design centers, partnerships, and distribution agreements across Asia, Europe, and North America. The company markets its products under dedicated brand families for consumer devices, wearables, industrial IoT, automotive infotainment, and edge computing, emphasizing energy efficiency, compact form factors, and integrated multimedia processing. Ingenic maintains subsidiary and affiliate relationships to manage licensing, developer ecosystems, and regional sales, while collaborating with ecosystem partners to accelerate adoption of its processor architectures in embedded and mobile markets. Latest major company changes include strategic partnerships and alliances with global electronics manufacturers and IDMs to expand market reach for its SoCs and reference platforms; recent expansions in global distribution networks and development collaborations aimed at accelerating deployment of Ingenic-based solutions; ongoing product launches and roadmap updates introducing new processor variants, improved performance cores, and enhanced security features; and corporate reorganizations or structural adjustments within the last 1–2 years to optimize go-to-market frameworks and supply chain resilience. Industry context and business segments encompass semiconductor design and IP licensing, turnkey embedded solutions, and ecosystem enablement for mobile/IoT/industrial applications. Target markets include electronics OEMs, contract manufacturers, automotive suppliers, and developers requiring low-power, high-efficiency processing. Geographic operations span China, with regional reach through partnerships and sales offices in Asia, Europe, and the Americas, reflecting a multi-regional go-to-market approach. The company’s structure includes potential subsidiaries or affiliates and relationships within a broader corporate group. Note: This description reflects Ingenic’s core product focus on low-power SoCs and related services, current market positioning, and recent strategic movements, as reported in publicly available filings and press coverage.