Shenzhen Longsys Electronics Co., Ltd.
9976.HK
Hong Kong Stock Exchange191.10
HKD
-2.40
- -
ISIN
CNE100007X96
Return %
Stock
S&P500
1Y
-18.19
16.05
3Y
-18.19
77.49
5Y
-18.19
72.82
Capital Structure
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FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.Company Description
- CEO
- Hua Bo Cai
- Full Time Employees
- 4,040
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Units 2001, 2201, 2301, B Tower Shenzhen GD People's Republic of China 518052
- IPO Date
- Sep 8, 2026
- Website
- longsys.com
- Similar Companies
- Business
- Shenzhen Longsys Electronics Co., Ltd. is a semiconductor memory company that researches, designs, packages, tests, manufactures and sells memory application products, serving consumer, industrial, automotive and enterprise customers from its headquarters in Shenzhen, China, where it was founded in 1999. Its core portfolio includes embedded storage products; solid-state drives; mobile storage products such as USB flash drives, memory cards and portable SSDs; memory modules; and related services including storage chip design, controller chip design, firmware algorithm development, packaging and testing, and software and hardware application solutions. The company markets products under the FORESEE, Lexar and Zilia brands, with applications in smartphones, tablets, computers, wearables, smart home devices, communication equipment, industrial control, security monitoring, in-vehicle systems and artificial intelligence. Longsys operates globally, with R&D, packaging and testing, and manufacturing facilities across China’s Greater Bay Area and Yangtze River Delta, as well as operations in the Americas and Europe. In recent developments, Longsys has expanded its manufacturing footprint through the acquisition of a 70% stake in Powertech Technology (Suzhou), which was rebranded as Longforce (Suzhou) and placed under direct control of the group’s newly formed Chinese subsidiary. The company also reports that it has successfully commercialized self-designed controller chips for UFS 4.1 products, launched mSSD products, and developed memory solutions for edge AI devices, including SPU controller chips, iSA and HLC technologies. These moves reflect a strategic shift toward higher-value, vertically integrated memory solutions spanning traditional consumer storage and newer edge AI and automotive applications.