Amkor Technology, Inc.

Amkor Technology, Inc.

AMKR
Amkor Technology, Inc.US flagNASDAQ Global Select
52.69
USD
-0.63
- -
13.09BMarket Cap
Amkor Technology, Inc.
AMKR
(NASDAQ Global Select)

Recent

price

52.69

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
16.04
14.55
17.24
15.81
13.56
12.18
16.54
17.61
18.04
16.91
20.91
25.17
28.98
26.48
25.65
27.15
30.14
Revenue per Share
1.26
0.48
0.26
0.58
0.56
0.22
0.74
1.1
0.53
0.5
1.4
2.64
3.13
1.46
1.44
1.51
2.24
Basic EPS, GAAP
0.53
0.26
-0.9
-0.05
-0.29
0.2
0.33
0.28
0.49
0.38
0.9
1.4
0.78
2.12
1.4
0.77
-0.7
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
0.21
0.23
0.3
0.73
0.33
0.33
Dividend per Share
3.43
4.11
4.32
4.4
4.72
5.06
5.8
7.09
7.65
8.15
9.58
12.04
14.97
16.11
16.82
18.08
18.75
Book Value per Share
3.36
3.94
4.16
4.28
4.6
4.85
5.58
6.88
7.43
8.05
9.46
11.94
14.88
16.03
16.75
18.01
18.68
Tangible Book Value per Share
183
191
160
187
231
237
237
239
239
240
242
244
245
246
246
247
247
Basic Weighted Avg Shares
2,939
2,776
2,760
2,956
3,129
2,885
3,928
4,207
4,316
4,053
5,051
6,138
7,092
6,503
6,318
6,708
7,458
Sales/Revenue/Turnover
12.72
6.98
5.53
7.85
7.08
5.71
7.86
7.07
5.98
5.75
9.05
12.44
12.65
7.23
6.94
6.97
8.64
Operating Margin (%)
324
336
370
410
465
494
555
582
572
524
510
564
613
632
595
642
680
Depreciation Expense
232
92
42
109
130
51
176
264
127
121
338
643
766
360
354
374
555
Net Income, GAAP
7.57
7.65
31.42
18.26
24.87
41.28
22.22
12.94
30.27
23.27
11.94
9.71
10.49
18.41
17.51
15.41
12.13
Effective Tax Rate (%)
7.89
3.31
1.52
3.7
4.15
1.77
4.47
6.26
2.94
2.98
6.7
10.48
10.8
5.53
5.6
5.57
7.45
Profit Margin (%)
290
355
439
541
497
299
404
326
513
942
817
1,177
1,639
1,811
1,618
2,173
2,486
Working Capital
1,214
1,287
1,545
1,591
1,526
1,510
1,440
1,241
1,218
1,397
1,090
1,069
1,164
1,129
981
1,331
2,374
LT Debt
637
701
667
965
1,131
1,218
1,403
1,720
1,856
1,990
2,354
2,973
3,700
3,995
4,183
4,506
4,687
Total Equity
18
8.81
4.91
7.83
6.25
3.51
8.38
8.57
5.65
5.24
11.07
17.21
16.88
7.27
6.64
6.81
8.49
Return on Invested Capital (%)
16.99
8.42
5.08
8.01
7.91
3.62
8.38
11.2
5.72
5.14
10.84
17.29
17.34
7.74
7.5
7.54
9.39
Return on Capital (%)
45.7
13.83
6.16
13.48
12.5
4.41
13.59
17.11
7.21
6.37
15.77
24.41
23.17
9.43
8.73
8.67
12.56
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
230
222
213
LT Borrowings
1,283
1,257
2,335
LT Finance Leases
49
44
39
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
247
248
248
Market Capitalization
9,764
11,160
21,384

Working Capital

FRC

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,885
3,752
4,609
Cash, Cash Equivalents & STI
1,991
1,848
2,512
Accounts Receivable, Net
1,355
1,288
1,420
Inventories
438
495
561
Total Current Liabilities
1,712
1,867
2,123
Payables & Accruals
1,406
1,557
1,810
ST Debt
230
222
213
Deferred Revenue
70
82
93

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.24%
14.23%
7.72%
Free Cash Flow
35.05%
21.62%
-44.65%
Net Income, GAAP
47.7%
12.05%
5.62%
Sales/Revenue/Turnover
9.65%
6.42%
6.18%
Total Cash Common Dividend
- -
-17,354.71%
-54.12%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,366
1,461
1,862
1,629
6,318
2025
1,322
1,511
1,987
1,888
6,708
2026
1,685
1,898
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.24
0.27
0.5
0.43
1.44
2025
0.09
0.22
0.51
0.69
1.51
2026
0.34
0.7
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.08
0.08
0.08
0.49
0.73
2025
- -
0.17
0.08
0.08
0.33
2026
0.08
0.08
- -
- -
- -
Business
Amkor Technology, Inc. (Nasdaq: AMKR) provides outsourced semiconductor assembly and test (OSAT) services to leading semiconductor companies, foundries, and electronics original equipment manufacturers worldwide. Founded in 1968 in South Korea by Hyang-Soo Kim as the predecessor ANAM Industrial Co. Ltd. and headquartered in Tempe, Arizona, the company pioneered the OSAT industry and operates production facilities, development centers, and support offices across Asia, Europe, the Middle East, Africa, and the United States. Amkor offers a comprehensive portfolio of advanced packaging solutions including over 1,000 package formats and sizes such as leadframe ICs for through-hole and surface mounting; chip scale packages (CSP) and ball grid array (BGA) solutions; flip chip packaging with copper pillar bumps; RF-antenna designs integrated into chips; CMOS imaging sensors; wire bonding; wafer bumping, probing, back-grind, and system-level testing; drop shipment services; and specialized technologies like Edge Protection to prevent packaging cracks. The company serves diverse markets including smartphones, data centers, artificial intelligence, high-performance computing, automotive, electric vehicles, wearables, communications, computing, industrial, and consumer electronics through turnkey manufacturing that enables customers to focus on design and wafer fabrication. In recent developments, Amkor broke ground in October 2025 on a new advanced packaging and test campus in Peoria, Arizona, expanding total investment to $7 billion across two phases with over 750,000 square feet of cleanroom space and up to 3,000 jobs, supported by CHIPS Act funding, tax credits, and state incentives; the first facility targets production start in early 2028 to serve customers like Apple and NVIDIA. In September 2025, Amkor issued $500 million in senior notes due 2033 to refinance existing debt and for general corporate purposes. The company expanded its strategic partnership with TSMC in 2024 for advanced packaging and test services at the Arizona facility, enhancing high-volume manufacturing for AI and high-performance computing applications. Amkor plans $950 million in 2025 capital expenditures primarily for the Arizona expansion while pursuing growth in automotive, industrial, and 5G sectors through industry collaborations.

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