Amkor Technology, Inc.
NASDAQ Global SelectCapital Structure
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in mil. unless spec.Working Capital
•
in mil. unless spec.Growth Rates
•
in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Kevin K. Engel
- Full Time Employees
- 30,800
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 2045 East Innovation Circle Tempe AZ United States of America 85284
- IPO Date
- May 1, 1998
- CIK
- 0001047127
- Website
- amkor.com
- Similar Companies
- Business
- Amkor Technology, Inc. (Nasdaq: AMKR) provides outsourced semiconductor assembly and test (OSAT) services to leading semiconductor companies, foundries, and electronics original equipment manufacturers worldwide. Founded in 1968 in South Korea by Hyang-Soo Kim as the predecessor ANAM Industrial Co. Ltd. and headquartered in Tempe, Arizona, the company pioneered the OSAT industry and operates production facilities, development centers, and support offices across Asia, Europe, the Middle East, Africa, and the United States. Amkor offers a comprehensive portfolio of advanced packaging solutions including over 1,000 package formats and sizes such as leadframe ICs for through-hole and surface mounting; chip scale packages (CSP) and ball grid array (BGA) solutions; flip chip packaging with copper pillar bumps; RF-antenna designs integrated into chips; CMOS imaging sensors; wire bonding; wafer bumping, probing, back-grind, and system-level testing; drop shipment services; and specialized technologies like Edge Protection to prevent packaging cracks. The company serves diverse markets including smartphones, data centers, artificial intelligence, high-performance computing, automotive, electric vehicles, wearables, communications, computing, industrial, and consumer electronics through turnkey manufacturing that enables customers to focus on design and wafer fabrication. In recent developments, Amkor broke ground in October 2025 on a new advanced packaging and test campus in Peoria, Arizona, expanding total investment to $7 billion across two phases with over 750,000 square feet of cleanroom space and up to 3,000 jobs, supported by CHIPS Act funding, tax credits, and state incentives; the first facility targets production start in early 2028 to serve customers like Apple and NVIDIA. In September 2025, Amkor issued $500 million in senior notes due 2033 to refinance existing debt and for general corporate purposes. The company expanded its strategic partnership with TSMC in 2024 for advanced packaging and test services at the Arizona facility, enhancing high-volume manufacturing for AI and high-performance computing applications. Amkor plans $950 million in 2025 capital expenditures primarily for the Arizona expansion while pursuing growth in automotive, industrial, and 5G sectors through industry collaborations.
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