ASML Holding N.V.
NASDAQCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Christophe D. Fouquet
- Full Time Employees
- 43,938
- Sector
- Technology
- Industry
- Semiconductors
- Address
- De Run 6501 Veldhoven NB Netherlands 5504 DR
- IPO Date
- Mar 15, 1995
- CIK
- 0000937966
- Website
- asml.com
- Similar Companies
- Business
- ASML Holding N.V. develops, manufactures and markets advanced lithography systems, metrology and inspection tools for the semiconductor industry. The company offers extreme ultraviolet (EUV) lithography systems including 0.55 NA and 0.33 NA EUV for high-resolution high-volume manufacturing of leading-edge logic and memory chips; deep ultraviolet (DUV) lithography systems such as dry, immersion, KrF and ArF variants including TWINSCAN platforms; computational lithography software; YieldStar optical metrology systems; HMI single- and multi-beam inspection technologies; and refurbished PAS 5500 and TWINSCAN systems. ASML operates globally with headquarters in Veldhoven, Netherlands, where it was founded in 1984 as a joint venture between Philips and ASM International, maintaining research, development, manufacturing and assembly facilities alongside offices and service points in the United States, Europe (Belgium, France, Germany, Ireland, Italy, United Kingdom), Asia (China, Hong Kong, Japan, Malaysia, Singapore, South Korea, Taiwan) and Israel; it employs over 44,000 people serving leading chipmakers worldwide. In 2025, ASML entered a strategic long-term partnership with Mistral AI, investing 1.3 billion euros as lead in its Series C funding round for an approximately 11% stake to integrate AI models across ASML's product portfolio, research and operations; the company also signed a five-year strategic partnership with imec incorporating its full product portfolio including high-end EUV and DUV systems into imec's pilot line for sub-2nm R&D in AI applications, silicon photonics and advanced packaging while advancing sustainable innovation.
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