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    Industrial - Machinery
BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V.

BESVF
BE Semiconductor Industries N.V.US flagOther OTC
293.93
USD
- -
- -
23.27BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
3.41
5.05
4.6
4.99
7.94
7.06
4.89
5.98
9.82
9.11
7.47
7.7
7.47
7.59
Basic EPS, GAAP
0.21
0.94
0.65
0.87
2.32
1.83
1.12
1.82
3.7
3.03
2.28
2.31
1.66
2.14
Free Cash Flow per Basic Share
0.14
0.85
1.07
1.22
2.16
2.32
1.47
1.99
3.64
3.43
2.69
2.55
2.25
2.6
Dividend per Share
0.15
0.17
0.75
0.6
0.87
2.34
1.68
1.01
1.7
3.4
2.87
2.17
2.18
- -
Book Value per Share
0.85
1.12
0.99
0.81
2.33
1.7
1.07
1.77
3.43
2.78
2.11
2.17
1.51
0.66
Tangible Book Value per Share
2.48
3.25
3.25
3.48
4.76
3.88
2.89
3.81
6.62
6.32
3.64
4.55
3.37
2.62
Basic Weighted Avg Shares
75
75
76
75
75
74
73
73
76
79
78
79
79
79
Sales/Revenue/Turnover
255
379
349
375
593
525
356
434
749
723
579
607
591
602
Operating Margin (%)
7.4
19.03
16.58
20.02
35.33
32.88
25.81
34.56
42.38
40.69
36.86
32.2
29.27
31.28
Depreciation Expense
9
10
15
15
13
15
20
19
18
23
26
29
34
30
Net Income, GAAP
16
71
49
65
173
136
81
132
282
241
177
182
132
170
Effective Tax Rate (%)
15.79
0.27
14.27
11.23
13.08
12.06
- -
3.81
7.05
12.65
14.74
3.46
14.49
2.68
Profit Margin (%)
6.28
18.71
14.03
17.38
29.18
25.94
22.83
30.5
37.69
33.29
30.59
29.96
22.26
28.17
Working Capital
159
217
231
363
616
503
464
654
749
793
551
831
703
677
LT Debt
3
3
13
123
267
272
285
407
309
337
312
538
518
537
Total Equity
264
329
332
345
434
372
299
371
619
629
421
501
416
357
Return on Invested Capital (%)
5.47
22.89
14.2
15.91
29.92
21.78
- -
20.82
33.75
26.33
20.81
20.71
14.69
23.68
Return on Capital (%)
19.18
76.15
49.12
44.15
54.38
33.81
- -
31.74
52.6
44.18
35.77
33.06
22.57
45.37
Return on Common Equity (%)
26.11
95.92
61.49
95.64
147.29
90.7
79.38
128.16
144.75
99.81
92.28
108.85
90.66
279.49

Capital Structure

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
ST Debt
7
1
3
LT Borrowings
526
525
526
LT Finance Leases
12
12
11
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
79
79
79
Market Capitalization
10,890
8,644
9,591

Working Capital

FRC

•

in mil. unless spec.
Dec'24
Mar'25
Jun'25
Total Current Assets
998
1,006
820
Cash, Cash Equivalents & STI
342
406
330
Accounts Receivable, Net
182
170
179
Inventories
103
104
97
Total Current Liabilities
167
159
143
Payables & Accruals
- -
- -
- -
ST Debt
7
1
3
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
5.74%
7.48%
-16.93%
Free Cash Flow
14.52%
10.4%
-11.41%
Net Income, GAAP
24.69%
9.48%
-27.67%
Sales/Revenue/Turnover
9.52%
10.33%
-2.66%
Total Cash Common Dividend
26.52%
28.95%
0.74%

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
146
151
157
153
607
2025
144
148
166
- -
591
2026
185
- -
- -
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.44
0.53
0.59
0.75
2.31
2025
0.4
0.4
0.54
- -
1.66
2026
0.65
- -
- -
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.17
2025
- -
- -
- -
- -
2.18
2026
- -
- -
- -
- -
- -

Company Description

APIChatGPT
CEO
Richard W. Blickman
Full Time Employees
1,856
Sector
Industrials
Industry
Industrial - Machinery
Address
Ratio 6 Duiven GE Netherlands 6921 RW
IPO Date
Aug 14, 2014
Website
besi.com
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Business
BE Semiconductor Industries N.V. designs, produces, sells, and maintains specialized semiconductor assembly machinery for the worldwide semiconductor and broader electronics sectors. The company's primary offerings encompass sophisticated die attach equipment, featuring solutions for single, multi-chip, and multi-module configurations, along with flip chip, thermal compression bonding, fan-out wafer level packaging, hybrid and embedded bridge die bonding, and precise die sorting systems. Its extensive product range also covers packaging equipment, including conventional, ultra-thin, and advanced wafer level molding, alongside trim and form, and singulation systems. Additionally, it supplies plating equipment for tin, copper, and precious metal applications, as well as systems for solar plating and associated process chemicals, complemented by tooling, conversion kits, spare parts, and ongoing services. Key proprietary brand names associated with its portfolio are Datacon, Esec, Fico, and Meco. The company primarily caters to leading multinational chip producers, assembly subcontractors, and a diverse array of electronics and industrial enterprises. Established in 1995, the firm maintains its corporate headquarters in Duiven, the Netherlands.

Company News

APIChatGPT

  • seekingalpha.com

    BE Semiconductor Industries N.V. (BESIY) Q1 2026 Earnings Call Transcript