Disco Corporation

Disco Corporation

DISPF
Disco CorporationUS flagOther OTC
417.90
USD
+13.91
- -
45.33BMarket Cap
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
1,034.41
1,214.61
1,192.17
1,249.15
1,554.37
1,368.63
1,308.72
1,692.51
7,034.04
2,623.87
2,839.01
3,629.47
4,029.19
1,673.18
Basic EPS, GAAP
119.18
193.56
215.37
225.28
345.22
267.45
256.52
361.82
1,835.03
765.46
777.29
1,143.26
1,249.84
475.27
Free Cash Flow per Basic Share
20.27
139.42
194.14
209.82
363.38
118.73
58.78
329.47
1,109.29
623.63
750.22
493.09
906.71
- -
Dividend per Share
22
36.74
57.62
104.23
143.88
120.63
99.64
154.14
759.47
296.93
287.22
354.97
417.86
- -
Book Value per Share
1,022.58
1,216.48
1,336.32
1,457.81
1,658.45
1,803.83
1,874.1
2,083.52
7,319.58
2,907.88
3,398.19
4,187.71
5,019.63
3,660.64
Tangible Book Value per Share
1,208.53
1,460.1
1,562.13
1,682.19
1,901.61
2,038.63
2,101.71
2,333.12
8,136.4
3,211.87
3,750.49
4,544.34
5,421.64
4,026.4
Basic Weighted Avg Shares
101
104
107
107
108
108
108
108
36
108
108
108
108
108
Sales/Revenue/Turnover
104,920
125,920
127,850
134,204
167,364
147,500
141,083
182,857
253,781
284,135
307,554
393,313
436,889
181,294
Operating Margin (%)
16.54
21.25
23.73
23.35
30.47
26.2
25.84
29.04
36.06
38.86
39.5
42.42
42.34
42.19
Depreciation Expense
5,995
6,067
6,545
5,987
6,053
6,095
6,612
6,815
8,551
10,371
11,031
12,198
14,821
- -
Net Income, GAAP
12,088
20,067
23,096
24,203
37,171
28,824
27,653
39,091
66,206
82,891
84,205
123,891
135,521
51,497
Effective Tax Rate (%)
29.81
26.94
24.56
20.69
26.62
24.55
27.62
26.74
28.18
26.48
26.5
26.21
26.23
24.6
Profit Margin (%)
11.52
15.94
18.06
18.03
22.21
19.54
19.6
21.38
26.09
29.17
27.38
31.5
31.02
28.41
Working Capital
61,574
90,630
108,087
110,917
124,367
132,179
123,085
132,181
135,082
185,144
238,230
264,110
340,114
267,106
LT Debt
8,858
9,416
8,583
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Total Equity
123,455
151,917
168,033
181,316
205,263
220,107
226,888
252,351
293,809
348,040
406,557
492,700
588,124
436,525
Return on Invested Capital (%)
8.77
12.48
13.06
13.21
18.29
13.33
11.67
15.71
22.72
23.93
22.59
25.95
24.08
13.94
Return on Capital (%)
10.16
15.4
15.9
15.16
21.57
15.43
13.92
18.26
27.02
28.6
24.64
30.08
27.12
14.26
Return on Common Equity (%)
12.24
17.46
17.14
16.14
22.18
15.46
13.95
18.3
27.07
28.63
24.66
30.15
27.16
14.28

Capital Structure

FRC

in mil. unless spec.
Mar'24
Jun'25
Sep'25
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
108
- -
108
Market Capitalization
5,924,898
6,981,357
4,534,867

Working Capital

FRC

in mil. unless spec.
Mar'24
Jun'25
Sep'25
Total Current Assets
386,945
- -
420,812
Cash, Cash Equivalents & STI
215,486
- -
243,571
Accounts Receivable, Net
46,807
- -
40,586
Inventories
114,991
- -
130,277
Total Current Liabilities
148,715
- -
153,706
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
13.49%
18.45%
19.37%
Free Cash Flow
57.71%
30.25%
84%
Net Income, GAAP
22.59%
30.53%
9.39%
Sales/Revenue/Turnover
14.1%
19.59%
11.08%
Total Cash Common Dividend
26.12%
24.02%
17.79%

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
53,961
72,299
76,995
104,299
307,554
2025
- -
- -
- -
- -
393,313
2026
- -
- -
- -
- -
436,889

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
117.09
- -
- -
- -
777.29
2025
- -
- -
- -
- -
1,143.26
2026
- -
- -
- -
- -
1,249.84

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
287.22
2025
- -
- -
- -
- -
354.97
2026
- -
- -
- -
- -
417.86

Company Description

APIChatGPT
CEO
Kazuma Sekiya
Full Time Employees
5,547
Sector
Technology
Industry
Semiconductors
Address
13-11 Omori-Kita 2-chome Tokyo TY Japan 143-8580
IPO Date
Sep 16, 2009
Business
Disco Corporation (TSE: 6146; OTC: DISPF) manufactures and sells precision cutting, grinding, and polishing machines and tools for semiconductor wafers and electronic components. The company offers dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws; precision processing tools including dicing blades, grinding wheels, and dry polishing wheels; and accessory equipment such as frames, cassettes, and cutting water additives. It also provides maintenance, disassembly, recycling, and training services for its equipment; leases precision machines; buys and sells used machines; and offers chargeable processing services and precision diamond abrasive tools. Disco operates worldwide with key facilities in Japan, the United States, China, Korea, Taiwan, Europe, and Singapore, targeting semiconductor manufacturers, integrated device makers, and electronics producers. Founded in 1937 as Dai-Ichi Seitosho in Kure City, Hiroshima Prefecture, the company is headquartered at 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo, Japan. In March 2025, Disco acquired land and buildings in Ota-ku, Tokyo, for approximately JPY 50 billion to expand R&D capabilities amid rising semiconductor demand; it continues to innovate in areas like laser slicing technology including the KABRA process for large-diameter diamond wafers.

Company News

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