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Enablence Technologies Inc.

Enablence Technologies Inc.

ENA.V
Enablence Technologies Inc.CA flagToronto Stock Exchange Ventures
8.34
CAD
-0.25
- -
175.74MMarket Cap
Enablence Technologies Inc.
ENA.V
(Toronto Stock Exchange Ventures)

Recent

price

8.34

P/E

ratio

- -

div

yld

- -

ROIC.AI

2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
TTM
FRC
207.52
- -
68.88
24.41
4.09
1.35
0.49
0.76
0.65
0.27
0.21
0.47
0.15
0.11
0.08
0.31
0.37
Revenue per Share
-288.29
- -
-31.01
-50.7
-14.13
-7
-2.7
-1.91
-2
-2.06
-1.79
-0.94
0.91
-0.46
-0.75
-0.95
-1.12
Basic EPS, GAAP
-205.91
- -
-75.9
-30.4
-8.04
-4.36
-2.58
-2.19
-1.69
-1.18
-0.88
-0.45
-0.4
-0.33
-0.48
-0.93
-0.97
Free Cash Flow per Basic Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
385.49
50.94
-4.64
-12.93
0.54
-3.05
-0.63
-0.85
-2.73
-4.5
-5.96
-7.43
-0.53
-0.69
-1.38
-1.79
-2.72
Book Value per Share
335.54
19.41
-6.37
-13.2
0.52
-3.05
-0.63
-0.85
-2.73
-4.5
-5.96
-7.43
-0.53
-0.69
-1.38
-1.79
-2.72
Tangible Book Value per Share
- -
- -
- -
- -
1
2
3
5
5
5
5
5
13
19
19
19
20
Basic Weighted Avg Shares
23
- -
13
7
5
2
2
3
3
1
1
3
2
2
2
6
7
Sales/Revenue/Turnover
-49.65
- -
-76.08
-127.85
-263.76
-501.32
-519.47
-256.89
-274.53
-679.56
-656.77
-201.55
-331.14
-439.11
-684.38
-203.8
-186
Operating Margin (%)
4
- -
2
2
2
1
1
1
1
- -
- -
- -
- -
- -
1
1
1
Depreciation Expense
-32
- -
-6
-16
-16
-11
-9
-9
-10
-11
-10
-5
12
-9
-14
-18
-22
Net Income, GAAP
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Effective Tax Rate (%)
-138.92
- -
-45.01
-207.72
-345.22
-518.47
-547.94
-250.39
-306.29
-771
-868.03
-199.96
591.15
-438.81
-881.2
-305.55
-303.38
Profit Margin (%)
31
1
-10
-12
-2
-7
-2
- -
-15
-24
-31
-40
-5
-1
-6
- -
-23
Working Capital
4
8
3
2
- -
- -
2
6
- -
- -
1
- -
5
12
22
45
38
LT Debt
53
10
-1
-6
1
-6
-3
-4
-14
-24
-32
-40
-10
-13
-26
-38
-52
Total Equity
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
-68.4
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)

Capital Structure

FRC

•

in mil. unless spec.
Sep'26
Dec'26
Mar'26
ST Debt
1
13
23
LT Borrowings
48
41
36
LT Finance Leases
- -
- -
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
21
21
19
Market Capitalization
18
26
47

Working Capital

FRC

•

in mil. unless spec.
Sep'26
Dec'26
Mar'26
Total Current Assets
8
7
10
Cash, Cash Equivalents & STI
3
1
2
Accounts Receivable, Net
1
2
3
Inventories
3
3
4
Total Current Liabilities
10
23
33
Payables & Accruals
8
9
10
ST Debt
1
13
23
Deferred Revenue
1
- -
- -

Growth Rates

FRC

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
46.25%
25.46%
43.33%
Free Cash Flow
20.85%
45.67%
95.48%
Net Income, GAAP
-46.63%
-92.04%
28.67%
Sales/Revenue/Turnover
36.86%
71.86%
271.08%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
1
2
2025
1
1
1
2
6
2026
1
2
2
- -
- -

Quarterly Earnings Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.13
-0.2
-0.16
- -
-0.75
2025
-0.21
-0.21
-0.23
- -
-0.95
2026
-0.3
-0.33
-0.2
- -
- -

Quarterly Dividends Per Share

FRC

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -
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Business
Enablence Technologies Inc. designs, manufactures, markets and sells photonic semiconductor chips, optical components and subsystems, principally planar lightwave circuit (PLC) devices fabricated on silicon-based platforms, for data communications, telecommunications, artificial intelligence, automotive, advanced-vision, industrial-automation and sensing applications. The Company’s offerings include wavelength-management optical chips and components, including coarse wavelength-division multiplexing (CWDM) multiplexer and demultiplexer devices; LAN wavelength-division multiplexing (LWDM) MUX and DEMUX chips, including proprietary Vortex-design products; dense wavelength-division multiplexing (DWDM) devices; FR4 wavelength-management products for high-speed data-center applications; arrayed waveguide grating-based components; long optical delay lines for distance calibration, laser locking, short-pulse lasers and decoherence applications; and customized optical-chip designs. Enablence also provides photonic-semiconductor design, wafer fabrication, testing, packaging, optical assembly and customized foundry services, including manufacture of third-party-designed chips in select strategic circumstances. Its products are supplied to transceiver manufacturers, network-equipment and service-provider customers, hyperscale data-center operators and customers in automotive LiDAR, robotics, industrial, medical-device, augmented- and virtual-reality, maritime and manufacturing markets. The Company operates through Canadian, U.S. and Chinese operations, including Enablence USA Components Inc. and Suzhou Enablence Photonic Technologies Co., Ltd., and maintains a proprietary non-captive fabrication facility in Fremont, California; its head office is in Ottawa, Ontario, Canada. Incorporated in 2006, Enablence is listed on the TSX Venture Exchange under the symbol ENA. Recent developments include the August 2026 launch of volume-production readiness and sample availability at an advanced optical manufacturing facility in Vietnam with OSAT partner ShunYun Technology, intended to support advanced packaging and optical assembly for 800G and 1.6T AI-data-center optics; a March 2026 collaboration with Sivers Semiconductors and O-Net on co-packaged-optics technology; and a September 2026 agreement with Collingwood Investments Incorporated for a C$25 million strategic equity investment to fund capacity expansion at its Silicon Valley and Vietnam fabrication operations, working capital and general corporate purposes.

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