Enablence Technologies Inc.
ENA.V
Toronto Stock Exchange Ventures8.34
CAD
-0.25
- -
ISIN
CA2924833023
CUSIP
292483302
Return %
Stock
S&P500
1Y
612.82
15.01
3Y
456.00
82.56
5Y
247.50
79.55
Capital Structure
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Todd Haugen
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 390 March Road Ottawa ON Canada K2K 0G7
- IPO Date
- Oct 25, 2007
- Website
- enablence.com
- Similar Companies
- Business
- Enablence Technologies Inc. designs, manufactures, markets and sells photonic semiconductor chips, optical components and subsystems, principally planar lightwave circuit (PLC) devices fabricated on silicon-based platforms, for data communications, telecommunications, artificial intelligence, automotive, advanced-vision, industrial-automation and sensing applications. The Company’s offerings include wavelength-management optical chips and components, including coarse wavelength-division multiplexing (CWDM) multiplexer and demultiplexer devices; LAN wavelength-division multiplexing (LWDM) MUX and DEMUX chips, including proprietary Vortex-design products; dense wavelength-division multiplexing (DWDM) devices; FR4 wavelength-management products for high-speed data-center applications; arrayed waveguide grating-based components; long optical delay lines for distance calibration, laser locking, short-pulse lasers and decoherence applications; and customized optical-chip designs. Enablence also provides photonic-semiconductor design, wafer fabrication, testing, packaging, optical assembly and customized foundry services, including manufacture of third-party-designed chips in select strategic circumstances. Its products are supplied to transceiver manufacturers, network-equipment and service-provider customers, hyperscale data-center operators and customers in automotive LiDAR, robotics, industrial, medical-device, augmented- and virtual-reality, maritime and manufacturing markets. The Company operates through Canadian, U.S. and Chinese operations, including Enablence USA Components Inc. and Suzhou Enablence Photonic Technologies Co., Ltd., and maintains a proprietary non-captive fabrication facility in Fremont, California; its head office is in Ottawa, Ontario, Canada. Incorporated in 2006, Enablence is listed on the TSX Venture Exchange under the symbol ENA. Recent developments include the August 2026 launch of volume-production readiness and sample availability at an advanced optical manufacturing facility in Vietnam with OSAT partner ShunYun Technology, intended to support advanced packaging and optical assembly for 800G and 1.6T AI-data-center optics; a March 2026 collaboration with Sivers Semiconductors and O-Net on co-packaged-optics technology; and a September 2026 agreement with Collingwood Investments Incorporated for a C$25 million strategic equity investment to fund capacity expansion at its Silicon Valley and Vietnam fabrication operations, working capital and general corporate purposes.
Company News
Enablence Technologies Inc. Closes C$25 Million Strategic Investment