Lam Research Corporation

Lam Research Corporation

204.90
EUR
-29.10
(-12.44%)
5.04EPS
75.28P/E
477.30BMarket Cap
Jan 27Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
2.8
3.29
3.7
4.94
6.85
6.33
6.94
10.18
12.31
12.87
11.34
14.33
18.51
18.51
Basic EPS, GAAP
0.38
0.41
0.58
1.05
1.47
1.44
1.55
2.72
3.29
3.33
2.91
4.17
5.79
5.79
Free Cash Flow per Basic Share
0.44
0.49
0.85
1.25
1.64
2.08
1.47
2.5
2.22
3.82
3.54
4.8
4.67
4.67
Dividend per Share
- -
0.07
0.12
0.15
0.19
0.44
0.45
0.51
0.58
0.67
0.78
0.89
1.01
1.01
Book Value per Share
3.21
3.37
3.81
4.32
4.19
3.27
3.57
4.23
4.58
6.16
6.55
7.77
9.97
9.97
Tangible Book Value per Share
1.76
2.04
2.59
3.21
3.04
2.09
2.43
3.09
3.4
4.82
5.2
6.35
8.45
8.45
Basic Weighted Avg Shares
1,647
1,596
1,589
1,622
1,616
1,525
1,448
1,436
1,399
1,355
1,314
1,286
1,255
1,255
Sales/Revenue/Turnover
4,607
5,259
5,886
8,014
11,077
9,654
10,045
14,626
17,227
17,429
14,905
18,436
23,233
23,233
Operating Margin (%)
14.71
16.49
18.25
23.74
29.01
25.53
26.62
30.64
31.24
29.93
28.73
32.01
35.29
35.29
Depreciation Expense
292
278
291
307
326
309
269
307
334
342
360
386
442
442
Net Income, GAAP
632
656
914
1,698
2,381
2,191
2,252
3,908
4,605
4,511
3,828
5,358
7,265
7,265
Effective Tax Rate (%)
12.59
11.51
4.8
6.29
24.47
10.43
12.55
10.58
11.32
11.71
12.21
10.07
12.07
12.07
Profit Margin (%)
13.72
12.47
15.53
21.19
21.49
22.7
22.42
26.72
26.73
25.88
25.68
29.06
31.27
31.27
Working Capital
3,202
3,639
6,795
6,192
6,000
6,189
7,691
8,125
7,720
9,043
8,545
7,949
9,673
9,673
LT Debt
817
1,001
3,378
1,785
1,807
3,823
4,971
4,984
4,998
5,003
4,479
3,730
3,730
3,730
Total Equity
5,213
5,345
6,102
6,987
6,580
4,723
5,183
6,027
6,278
8,210
8,539
9,862
12,471
12,471
Return on Invested Capital (%)
9.36
9.69
11.2
17.57
25.62
23.95
22.85
35.52
41.3
35.95
27.34
37.13
46.01
46.01
Return on Capital (%)
10.95
10.11
11.5
17.98
26.28
25.22
23.82
37.2
42.76
38.16
29.84
39.6
48.46
48.46
Return on Common Equity (%)
12.79
12.42
15.97
25.94
35.09
38.77
45.46
69.73
74.85
62.27
45.71
58.24
65.07
65.07

Capital Structure

USD

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
ST Debt
754
4
4
LT Borrowings
3,730
3,730
3,722
LT Finance Leases
- -
- -
9
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,251
1,251
1,251
Market Capitalization
218,306
267,310
545,299

Working Capital

USD

•

in mil. unless spec.
Dec'26
Mar'26
Jun'26
Total Current Assets
14,018
13,297
15,611
Cash, Cash Equivalents & STI
6,180
4,751
5,579
Accounts Receivable, Net
3,492
4,133
5,340
Inventories
4,038
4,000
4,276
Total Current Liabilities
6,213
5,242
5,937
Payables & Accruals
1,571
1,586
1,891
ST Debt
754
4
4
Deferred Revenue
2,165
2,091
2,279

Growth Rates

USD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
8.74%
16.18%
26.46%
Free Cash Flow
20.73%
14.18%
-5.11%
Net Income, GAAP
27.05%
15.24%
35.59%
Sales/Revenue/Turnover
16.54%
10.83%
26.02%
Total Cash Common Dividend
24.13%
11.82%
10.53%

Quarterly Revenue

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3,482
3,758
3,794
3,872
14,905
2025
4,168
4,376
4,720
5,171
18,436
2026
5,324
5,345
5,841
6,722
23,233

Quarterly Earnings Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.67
0.72
0.74
0.78
2.91
2025
0.86
0.93
1.04
1.35
4.17
2026
1.24
1.27
1.46
1.82
5.79

Quarterly Dividends Per Share

USD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.17
0.2
0.2
0.2
0.78
2025
0.2
0.23
0.23
0.23
0.89
2026
0.23
0.26
0.26
0.26
1.01

Company Description

CEO
Timothy M. Archer
Full Time Employees
23,300
Sector
Producer manufacturing
Industry
Industrial machinery
Address
4650 Cushing Parkway Fremont CA United States 94538
IPO Date
May 11, 1984
Business
Lam Research Corporation (Nasdaq: LRCX) designs, manufactures, markets, refurbishes and services semiconductor processing equipment used in the fabrication of integrated circuits worldwide. The company supplies wafer fabrication equipment and related services primarily for front-end wafer processing steps that create active components such as transistors and capacitors, along with interconnects; its core product portfolio encompasses market-leading solutions for thin film deposition, including atomic layer deposition; plasma etch, featuring platforms like Sense.i and Transformer Coupled Plasma technology; photoresist strip; and wafer cleaning processes, which support advanced memory, packaging structures, microelectromechanical systems (MEMS), light-emitting diodes (LEDs), sensors, transducers, analog and mixed signal devices, discretes, power devices, optoelectronics and photonics. Lam Research also offers high-precision mass metrology systems for advanced process monitoring and control, as well as ValuePoint Optimized Productivity Services to optimize customer equipment sets throughout product cycles; these technologies enable chipmakers to produce smaller, higher-performance devices for artificial intelligence, high-performance computing and other applications. Founded in 1980 by David K. Lam and headquartered in Fremont, California, the company operates globally with offices, manufacturing facilities and customer support across North America, Asia, Europe and other regions, serving leading semiconductor manufacturers including logic, memory producers and foundries. In September 2025, Lam Research entered into a non-exclusive cross-licensing and collaboration agreement with JSR Corporation and its subsidiary Inpria Corporation to accelerate next-generation patterning technologies, including dry resist for extreme ultraviolet (EUV) lithography via its Aether platform, metal oxide resists, high NA EUV patterning for advanced nodes, and new materials for atomic layer etching and deposition; this partnership builds on prior acquisitions like Novellus Systems in 2012 to expand etch, deposition and advanced packaging capabilities. In November 2025, the company deepened its investment in the Silicon Forest region to bolster semiconductor industry leadership amid the AI era, reflecting ongoing strategic expansions in operations and technology innovation.

Company News

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