Hua Hong Grace Semiconductor Limited Class A
7.65
EUR
-0.76
(-9.02%)
ISIN
HK0000218211
Return %
Stock
S&P 500
1Y
-7.82
14.20
3Y
232.65
81.12
5Y
72.32
68.34
Capital Structure
USD
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in mil. unless spec.Working Capital
USD
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in mil. unless spec.Growth Rates
USD
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in mil. unless spec.Quarterly Revenue
USD
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in mil. unless spec.Quarterly Earnings Per Share
USD
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in mil. unless spec.Quarterly Dividends Per Share
USD
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in mil. unless spec.Company Description
- CEO
- Yu Cheng Wang
- Full Time Employees
- 7,628
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- 288 Halei Road Shanghai SH China 201203
- IPO Date
- Oct 15, 2014
- Website
- huahonggrace.com
- Similar Companies
- Business
- Hua Hong Semiconductor Limited conducts wafer foundry manufacturing and related services, focusing on diversified specialty process platforms including embedded/standalone non-volatile memory, logic and mixed-signal, radio frequency, power management, and automotive solutions; it also provides design services such as IP development, full-custom layout design, and customer-specific integrated solutions, along with tape-out and production-support services; in addition, the company engages in related backend testing and mass production activities, multi-project wafer services, and mask marking services. The company operates a foundry services business with capacity expansion and process development across advanced nodes; it markets to consumer electronics, industrial and automotive electronics, communications, and computer end markets, with applications spanning embedded memory, power management, analog and RF, as well as digital logic. Hua Hong Semiconductor Limited is headquartered in Shanghai, China, and is listed on public markets; it maintains manufacturing and service operations in mainland China and internationally, serving clients globally. The company was founded in 2001 and maintains strategic manufacturing footprints intended to support scalable capacity and technology leadership; it also pursues partnerships and collaborations to advance process technology platforms such as 12-inch diffusion processes and related device platforms. Recent major developments include capacity expansions and advancements in 12-inch wafer technology, enhancements to MOSFET and IGBT platforms, and collaborations or strategic alignments aimed at reinforcing its position as a leading foundry for specialty processes in the Asia-Pacific region. Hua Hong Semiconductor Limited’s comprehensive suite of products and services encompasses wafer fabrication, mature and advanced process technologies, foundry services, IP and design support, tape-out and turnkey solutions, backend testing, packaging assistance, and related engineering services, all targeted at diversified end-markets across consumer, industrial, automotive, telecom, and computing sectors.
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