Epiworld International Co., Ltd. Class H
8.42
EUR
-0.74
(-8.08%)
ISIN
CNE100007J37
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
CNY
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
CNY
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in mil. unless spec.Quarterly Revenue
CNY
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in mil. unless spec.Quarterly Earnings Per Share
CNY
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in mil. unless spec.Quarterly Dividends Per Share
CNY
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in mil. unless spec.Company Description
- CEO
- Gan Feng
- Full Time Employees
- 529
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 198-1, East 2nd Road Xiamen FU China 361101
- IPO Date
- Mar 30, 2026
- Website
- epiworld-cn.com
- Similar Companies
- Business
- Epiworld International Co., Ltd. operates as a silicon carbide (SiC) epitaxy and related wafer services provider, focusing on the development, production, and sale of SiC epitaxial wafers and ancillary components for power device manufacturing used in electric vehicles, charging infrastructure, renewable energy, and energy storage systems. The company engages in research and development, mass production, and sales of SiC epitaxial wafers, with capabilities spanning turnkey manufacturing and processing services for SiC wafers under consign arrangements, targeting customers across Asia, with significant activity in Greater China and broader international markets. Epiworld is listed on the Hong Kong Stock Exchange (ticker 2726.HK) and maintains headquarters in Hong Kong with manufacturing and distribution activities centered in mainland China, targeting downstream device makers and end-user markets in automotive, energy, and industrial sectors. The company was founded in 2014 and maintains an emphasis on expanding production capacity and product offerings to support growing demand for SiC-based power electronics, including 3-inch, 4-inch, 6-inch, and 8-inch epitaxial wafers, as well as related processing services and turnkey supply arrangements. Recent strategic developments include ongoing capacity expansion, partnerships and collaborations to enhance material sourcing and manufacturing efficiency, and the introduction of additional service lines related to Wafer turnkey production and consignment processing to support customers’ device fabrication needs in the EV, charging, and renewable energy ecosystems. The company’s activities are complemented by regional sales offices and distribution channels serving Asia, North America, and Europe, enabling access to global customers while leveraging the company’s Chinese manufacturing footprint to maintain cost competitiveness and supply security. This profile emphasizes the core product suite, including silicon carbide epitaxial wafers across multiple diameters, turnkey wafer production, consign processing services, and related SiC components, alongside a concise overview of recent organizational and strategic changes that influence its market position and growth trajectory.