GLOBALFOUNDRIES Inc.
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ROIC.AI
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- GLOBALFOUNDRIES Inc. (GFS) operates as a leading multinational semiconductor foundry, providing specialized wafer fabrication services and process technologies for integrated circuits used in smart mobile devices, automotive systems, aerospace and defense applications, consumer IoT devices, data centers, and communications infrastructure. The company offers a broad portfolio of mainstream and differentiated manufacturing solutions, including microprocessors, mobile application processors, baseband processors, network processors, radio frequency modems, microcontrollers, power management units, embedded magnetoresistive non-volatile memory (eMRAM), fully depleted silicon-on-insulator (FD-SOI) platforms such as 22FDX, FinFET processes like 14LPP and 12LP, RF-SOI technologies, gallium nitride (GaN) on silicon devices, silicon photonics, and high-voltage BCD processes across nodes from 600nm to 12nm; these are produced on 200mm and 300mm wafers at fabrication facilities in Malta and Essex Junction, New York (United States), Dresden (Germany), and Woodlands and Tampines (Singapore). Founded in 2009 through the divestiture of Advanced Micro Devices' manufacturing operations and headquartered in Malta, New York—with Mubadala Investment Company retaining majority ownership following its 2021 Nasdaq IPO—GLOBALFOUNDRIES serves over 200 global customers across automotive, industrial, communications, and government sectors through a network of R&D, design enablement, and support in the United States, Europe, Asia, and beyond; it holds Trusted Foundry status with the U.S. Department of Defense, Singapore, and Germany. In recent developments, GLOBALFOUNDRIES completed the acquisition of MIPS Technologies in August 2025 to enhance its AI and processor IP portfolio for edge computing and high-growth markets; acquired Advanced Micro Foundry in November 2025, establishing a silicon photonics center of excellence in Singapore with A*STAR collaboration to advance 400Gbps data transfer technologies; acquired InfiniLink in November 2025 for optical-connectivity solutions in AI data centers; entered a GaN technology licensing agreement with TSMC in November 2025; acquired Tagore Technology's GaN IP in 2024; announced a $16 billion U.S. investment in June 2025, including $3 billion for expansions in New York and Vermont focused on packaging, silicon photonics, and GaN for automotive and AI applications; and revealed a €1.1 billion Dresden expansion in October 2025 under the European Chips Act to exceed one million wafers annually by 2028.
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