1. China Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
NSING Technologies Inc. Class A

NSING Technologies Inc. Class A

6.16
HKD
-0.27
(-4.27%)
-0.09EPS
9.03BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.93
0.84
1.04
1.26
1.26
1.07
0.72
0.68
1.81
2.21
1.81
1.98
2.36
2.49
Basic EPS, GAAP
0.01
0.02
0.16
0.18
-0.88
-2.88
0.19
0.02
0.39
-0.06
-1
-0.4
-0.2
-0.08
Free Cash Flow per Basic Share
-0.02
-0.1
-0.23
-0.35
-0.45
0.26
-0.31
-0.04
0.18
-1.37
-0.56
-0.52
-0.37
- -
Dividend per Share
0.06
0.01
0.01
0.05
0.02
0.02
0.05
0.05
0.06
0.06
0.1
0.11
0.1
0.1
Book Value per Share
4.98
4.99
4.99
5.26
4.55
1.95
2.12
2.15
2.6
2.77
1.97
1.7
1.58
2.59
Tangible Book Value per Share
4.61
4.59
4.52
4.8
4.06
1.29
1.8
1.81
2.23
2.28
1.55
1.2
1.04
2.11
Basic Weighted Avg Shares
469
507
538
562
553
561
547
562
561
541
572
588
577
658
Sales/Revenue/Turnover
434
426
561
706
695
602
395
380
1,018
1,195
1,037
1,168
1,360
1,636
Operating Margin (%)
-22.41
-19.84
-4.17
-1.42
-2.75
-8.86
-37.46
-11.38
10.5
-2.21
-25.7
-8.81
-2.18
1.75
Depreciation Expense
48
47
40
32
34
53
40
47
69
93
110
99
139
- -
Net Income, GAAP
5
10
86
101
-487
-1,614
104
11
219
-32
-572
-235
-115
-53
Effective Tax Rate (%)
36.68
0.76
11.81
13.02
- -
- -
67.47
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
1.08
2.38
15.34
14.33
-70.02
-268.12
26.33
2.96
21.52
-2.72
-55.13
-20.16
-8.48
-3.22
Working Capital
2,447
2,449
2,160
2,008
1,937
-356
-53
326
629
915
717
159
-128
783
LT Debt
- -
- -
- -
- -
- -
- -
42
363
334
418
821
729
761
785
Total Equity
2,708
2,714
2,815
2,964
2,578
1,058
1,087
1,089
1,552
1,744
1,246
1,053
935
1,772
Return on Invested Capital (%)
-1.13
-1.72
1.24
2.33
- -
- -
-24.2
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
-1.31
-1.95
2.37
3.5
- -
- -
12.11
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
0.17
0.37
3.11
3.5
-17.61
-88.45
9.17
0.94
15.97
-2.04
-40.53
-21.79
-12.09
-3.86

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,101
1,232
1,359
LT Borrowings
738
762
763
LT Finance Leases
23
21
22
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
583
678
678
Market Capitalization
- -
7,656
7,815

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,582
2,545
2,664
Cash, Cash Equivalents & STI
362
1,330
1,086
Accounts Receivable, Net
344
440
494
Inventories
624
599
608
Total Current Liabilities
1,709
1,821
1,880
Payables & Accruals
- -
- -
- -
ST Debt
1,101
1,232
1,359
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-6.42%
-0.09%
-11.23%
Free Cash Flow
-184.34%
-293.59%
-30.43%
Net Income, GAAP
275.69%
656.77%
-50.96%
Sales/Revenue/Turnover
17.41%
40.27%
16.51%
Total Cash Common Dividend
78.36%
20.48%
-10.07%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
231
284
306
347
1,168
2025
304
328
- -
402
1,360
2026
395
511
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.13
-0.1
-0.03
-0.15
-0.4
2025
-0.04
-0.03
- -
-0.07
-0.2
2026
-0.02
0.03
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.03
0.03
0.03
0.03
0.11
2025
0.03
0.03
- -
0.02
0.1
2026
0.02
0.03
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Ying Tong Sun
Full Time Employees
1,112
Sector
Electronic technology
Industry
Semiconductors
Address
Nations Tower Shenzhen GD China 518057
IPO Date
Apr 30, 2010
Website
nsingtech.com
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Business
Nsing Technologies Inc. (300077.SZ), formerly known as Nationz Technologies Inc., is a China-based fabless semiconductor company principally engaged in the research, development, design, and sales of integrated circuits, with a focus on microcontrollers, security chips, and wireless solutions; its core products include general-purpose and high-performance MCU series such as N32H78x (Arm Cortex-M7/M4 dual-core up to 600MHz), N32H487, N32H474, and N32G457 for consumer electronics, home appliances, industrial applications, automotive electronics, medical devices, and IoT; security chips encompassing multi-purpose security chips, micro authentication chips, trusted computing chips (e.g., NS350 TCM 2.0 series), and smart card chips for applications in digital currency, QR code payments, device authentication, e-banking, tax-control POS, and e-government; power and battery management system (BMS) products like NB401 for pack-side battery applications, inverters, photovoltaics, portable power stations, electric vehicle charging stations, and lithium-ion battery anode materials; as well as Bluetooth wireless RF chips and range-controlled communications (RCC) chips used in Bluetooth keys, voice remotes, smart home lighting, anti-theft devices, and data transmission modules. Founded in 2000 as part of China's national '909' integrated circuit project and listed on the Shenzhen Stock Exchange's Growth Enterprise Market in 2010, the company is headquartered in Shenzhen, Guangdong Province, with branches in Beijing, Shanghai, Wuhan, Xi'an, Chongqing, Hong Kong, Singapore, Austin (U.S.), and Tokyo (Japan), and primarily serves domestic Chinese markets alongside international customers in consumer, industrial, automotive, and new energy sectors. Recent developments include a strategic partnership with wolfSSL announced in April 2025 to integrate security library support for its NS350 trusted cryptographic module, enhancing embedded security solutions; expansion into lithium-ion battery anode materials to form a dual-business model synergizing ICs with new energy storage; participation in high-profile events such as Electronica India 2024 with partner SR Electro to showcase IC products; and plans to pursue a secondary listing on the Hong Kong Stock Exchange, reflecting ongoing strategic shifts toward global expansion, AI-edge intelligence, robotics, and full-stack energy control platforms amid a reported top ranking in China's MCU market with embedded commercial cryptographic modules for 2024 revenues.