INGENIC SEMICONDUCTOR CO LTD

INGENIC SEMICONDUCTOR CO LTD

69.50
HKD
+4.70
(+7.25%)
2.40EPS
Oct 27Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.27
0.17
0.2
0.32
0.53
0.75
0.97
3.54
6.47
6.48
5.42
5.04
5.67
- -
Basic EPS, GAAP
0.07
-0.03
0.09
0.02
0.02
0.04
0.17
0.12
1.14
0.94
0.64
0.44
0.45
2.08
Free Cash Flow per Basic Share
0.03
-0.02
0.12
-0.23
-0.17
0.07
0.04
0.37
1.06
-0.26
0.54
0.3
0.63
- -
Dividend per Share
0.09
0.03
- -
0.01
- -
0.01
0.02
- -
0.07
0.11
0.05
0.12
0.06
- -
Book Value per Share
3.11
3.05
3.15
3.17
3.24
3.28
3.52
10.07
12.33
13.44
14.12
14.43
14.87
16.21
Tangible Book Value per Share
3.02
2.96
3.06
3.07
3.14
3.18
3.43
5.17
7.68
8.87
9.69
10.1
10.68
12.11
Basic Weighted Avg Shares
346
346
346
346
347
348
349
613
815
835
835
835
836
660
Sales/Revenue/Turnover
95
59
70
112
184
260
339
2,170
5,274
5,412
4,531
4,213
4,741
- -
Operating Margin (%)
-17.37
-61.09
-55.29
-26.49
-7.75
-0.17
9.13
2.78
19.34
18.63
11.06
9.02
6.84
- -
Depreciation Expense
4
5
6
5
5
4
4
133
237
249
232
191
185
- -
Net Income, GAAP
26
-10
32
7
7
14
59
73
926
789
537
366
376
1,371
Effective Tax Rate (%)
10.78
- -
13.82
36.98
4.94
2.19
1.11
- -
1.35
4.42
5.41
11.16
9.27
9.62
Profit Margin (%)
26.96
-16.99
45.72
6.31
3.52
5.2
17.29
3.37
17.56
14.58
11.86
8.69
7.94
- -
Working Capital
938
896
882
849
837
894
900
3,145
5,246
5,744
6,798
7,310
7,693
8,443
LT Debt
- -
- -
- -
- -
- -
- -
- -
19
5
7
20
14
9
7
Total Equity
1,079
1,058
1,089
1,098
1,125
1,140
1,235
8,222
10,323
11,259
11,830
12,083
12,489
13,646
Return on Invested Capital (%)
0.95
- -
-1.03
-0.33
0.57
1.35
5.22
- -
9.87
7.18
4.45
3.02
3.05
10.46
Return on Capital (%)
0.1
- -
1.94
0.58
0.56
1.12
4.94
- -
10.03
7.4
4.83
3.08
3.07
10.47
Return on Common Equity (%)
2.37
-0.94
2.99
0.64
0.59
1.19
4.94
1.55
10.02
7.33
4.67
3.07
3.07
10.53

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
8
7
8
LT Borrowings
- -
- -
- -
LT Finance Leases
9
8
7
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
837
837
839
Market Capitalization
- -
- -
- -

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
8,693
8,878
9,727
Cash, Cash Equivalents & STI
4,991
5,007
5,421
Accounts Receivable, Net
467
638
934
Inventories
2,975
2,938
3,145
Total Current Liabilities
1,000
979
1,284
Payables & Accruals
- -
- -
- -
ST Debt
8
7
8
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
62.37%
9.04%
3.36%
Free Cash Flow
110.88%
-18.22%
110%
Net Income, GAAP
147.03%
217.89%
2.74%
Sales/Revenue/Turnover
87.02%
26.98%
12.54%
Total Cash Common Dividend
- -
- -
-50%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,007
1,100
1,094
1,011
4,213
2025
1,060
1,189
- -
1,305
4,741
2026
1,560
2,397
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.1
0.23
0.22
0.13
0.44
2025
0.09
0.27
0.11
0.25
0.45
2026
0.38
1.05
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.12
2025
- -
- -
- -
- -
0.06
2026
- -
- -
- -
- -
- -

Company Description

CEO
Qiang Liu
Full Time Employees
1,125
Sector
Electronic technology
Industry
Semiconductors
Address
Junzheng Building, No.14 Beijing BE China 100193
IPO Date
May 31, 2011
Business
Ingenic Semiconductor Co., Ltd. (300223.SZ) designs, develops, and markets embedded processor chips and related semiconductor solutions primarily for consumer electronics and Internet of Things (IoT) applications. The company offers a broad portfolio of products, including RISC-V-based general-purpose processors such as the X60 series and XuanTie C910 cores; ARM-based application processors like the T30, T31, and T40 series for smart tablets, set-top boxes, and automotive infotainment; IoT connectivity chips encompassing Wi-Fi, Bluetooth, and Zigbee modules under the TWS and M30 brands; digital signal processors (DSPs) for audio and voice recognition; and graphics processing units (GPUs) integrated into its SoC platforms. These offerings support applications in smart home devices, intelligent wearables, automotive electronics, and edge AI computing, with comprehensive software development kits, operating systems like Ingenic OS, and cloud-based design tools provided to enable rapid product deployment. Founded in 2005 and headquartered in Beijing, China, Ingenic operates primarily in the Asia-Pacific region, with expanding sales and R&D presence in Europe and North America to serve global OEMs and fabless semiconductor customers. The company focuses on fabless manufacturing, partnering with leading foundries for production while maintaining proprietary intellectual property in multi-core architectures and low-power designs. Its business segments include consumer electronics processors (over 60% of revenue), IoT solutions, and emerging automotive and industrial chips, targeting mid-tier device manufacturers seeking cost-effective, high-performance alternatives to industry giants. In recent developments, Ingenic has accelerated its RISC-V ecosystem expansion through strategic partnerships, including collaborations with Alibaba's T-Head subsidiary for XuanTie core enhancements and with European automotive suppliers for next-generation ADAS processors launched in late 2024. The company completed a significant funding round in early 2025, raising approximately RMB 1.2 billion to scale production of its X60A RISC-V flagship chip, which features 8-core AI capabilities at under 5W power consumption. Additionally, Ingenic acquired a minority stake in a Shanghai-based AI accelerator firm in mid-2025 and reorganized its IoT division to launch the M50 series Bluetooth 5.4 modules, enhancing support for Matter smart home standards amid growing demand in China's domestic market.