Giga Device Semiconductor Inc. Class A

Giga Device Semiconductor Inc. Class A

320.20
HKD
-27.40
(-7.88%)
811.92BMarket Cap
Oct 29Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.97
2.36
2.96
3.35
3.8
4.18
5.57
7.13
13.24
12.61
8.81
11.37
14.22
- -
Basic EPS, GAAP
0.17
0.25
0.39
0.4
0.74
0.75
1.06
1.4
3.63
3.18
0.25
1.7
2.55
- -
Free Cash Flow per Basic Share
0.18
0.19
0.44
0.01
-0.07
0.6
1.2
1.11
2.55
0.62
1.28
2.37
1.67
- -
Dividend per Share
- -
0.02
0.04
- -
0.1
0.17
0.16
0.2
0.42
1.11
0.64
0.02
0.38
0.78
Book Value per Share
0.83
1.05
1.43
2.39
3.24
3.5
8.53
16.63
20.74
23.38
23.4
25.51
29.22
54.55
Tangible Book Value per Share
0.83
1.05
1.42
2.38
3.18
3.41
5.98
14.27
18.57
21.54
22.15
23.81
27.28
52.39
Basic Weighted Avg Shares
400
400
402
445
534
537
575
631
643
645
654
647
647
672
Sales/Revenue/Turnover
789
947
1,189
1,489
2,030
2,246
3,203
4,497
8,510
8,130
5,761
7,356
9,203
- -
Operating Margin (%)
9.74
9.56
13.19
10.16
22.97
20.65
20.52
18.98
29.87
27.73
7.02
11.32
16.85
- -
Depreciation Expense
15
17
20
25
31
50
93
167
240
321
400
418
431
- -
Net Income, GAAP
67
98
158
176
397
405
607
881
2,337
2,053
161
1,103
1,648
- -
Effective Tax Rate (%)
10.25
13.01
13.94
5.96
11.48
7.36
5.97
6.25
7.39
9.26
- -
2.03
1.7
- -
Profit Margin (%)
8.54
10.36
13.27
11.85
19.58
18.03
18.95
19.58
27.46
25.25
2.8
14.99
17.91
- -
Working Capital
315
393
552
1,119
877
1,147
2,191
7,942
9,426
10,218
10,617
10,104
11,478
19,235
LT Debt
- -
- -
- -
- -
184
213
82
53
108
90
74
48
43
36
Total Equity
331
420
571
1,279
1,757
1,900
5,226
10,694
13,483
15,187
15,200
16,679
19,223
37,543
Return on Invested Capital (%)
19.04
20.76
27.75
16.3
23.46
18.33
16.48
10.93
17.42
13.87
- -
6.62
9.03
- -
Return on Capital (%)
22.51
26.08
28.76
16.76
24.37
19.82
16.4
11.02
19.21
14.24
- -
6.81
8.82
- -
Return on Common Equity (%)
22.51
26.12
31.84
19.08
26.19
22.15
17.04
11.06
19.33
14.32
1.06
6.96
9.28
- -

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
255
55
45
LT Borrowings
- -
- -
- -
LT Finance Leases
43
41
36
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
650
683
683
Market Capitalization
- -
206,092
702,490

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
13,425
19,382
22,762
Cash, Cash Equivalents & STI
9,288
15,108
17,437
Accounts Receivable, Net
193
287
436
Inventories
3,066
3,401
4,184
Total Current Liabilities
1,947
2,006
3,527
Payables & Accruals
- -
- -
- -
ST Debt
255
55
45
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
51.32%
12.76%
15.25%
Free Cash Flow
-156.93%
44.54%
-29.56%
Net Income, GAAP
92.87%
138.94%
49.47%
Sales/Revenue/Turnover
26.37%
21.69%
25.12%
Total Cash Common Dividend
- -
327.27%
1,496.08%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,627
1,982
2,041
1,706
7,356
2025
1,909
2,241
- -
2,372
9,203
2026
4,188
7,378
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.32
0.47
0.48
0.41
1.7
2025
0.36
0.52
- -
0.85
2.55
2026
2.25
7.69
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.01
0.01
0.01
0.02
2025
0.01
0.32
- -
- -
0.38
2026
- -
0.75
- -
- -
- -

Company Description

CEO
Wei He
Full Time Employees
2,333
Sector
Electronic technology
Industry
Semiconductors
Address
Building No. 8, IC Park Beijing BE China 100094
IPO Date
Aug 18, 2016
Business
GigaDevice Semiconductor (Beijing) Inc. is a leading semiconductor company specializing in the design, manufacture, and sale of Flash memory products, 32-bit microcontrollers (MCUs), sensors, and analog products. The company’s core product portfolio includes NOR Flash memory; SPI NAND Flash; high-performance GD32 series 32-bit MCUs based on Arm Cortex-M and RISC-V architectures; intelligent Human-Machine Interface (HMI) sensors; and a broad range of analog semiconductor products. GigaDevice serves diverse markets including consumer electronics, IoT, automotive, industrial control, and communications, operating primarily in China with expanding international presence across North America, Europe, and Asia. Founded in 2005 and headquartered in Beijing, China, GigaDevice has established a global distribution network and strategic partnerships to enhance market reach. Recent major company developments include the launch of the GD25NX series, a new generation of dual-voltage xSPI NOR Flash products designed for low power consumption and cost efficiency, targeting 1.2V system-on-chip applications. The company also introduced the GD32F503/505 high-performance general-purpose MCU series and advanced RISC-V based wireless MCU modules with Wi-Fi 6 and Bluetooth 5.2 connectivity integrated with the Matter smart home ecosystem. In 2024-2025, GigaDevice intensively invested in research and development, allocating 18% of revenue to innovation, which led to over 15 new product launches including energy-efficient MCUs and AI-driven sensor solutions. GigaDevice further forged strategic alliances, notably with Navitas Semiconductor to combine power control technologies for high-frequency, high-efficiency applications, accelerating the adoption of GaN and SiC semiconductors in power markets. The company also completed a significant equity buyback in 2024 to optimize capital structure. As a vertically integrated semiconductor entity, GigaDevice focuses on continuous product diversification and high-performance semiconductor solutions spanning Flash memory; 32-bit MCUs; sensor technologies; and analog and mixed-signal integrated circuits. Its product innovations address expanding segments such as automotive body control, energy storage systems, AI-enabled recognition systems, and secure smart home connectivity. This comprehensive product offering combined with targeted strategic growth and international expansion underscores GigaDevice Semiconductor’s positioning as a key player in the global semiconductor industry.