Shanghai Biren Technology Co., Ltd. Class H

Shanghai Biren Technology Co., Ltd. Class H

23.70
HKD
+1.16
(+5.15%)
149.26BMarket Cap
Mar 03Next Earn
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
0.03
0.18
0.55
- -
Basic EPS, GAAP
-0.62
-0.74
-0.81
-8.72
- -
Free Cash Flow per Basic Share
-0.58
-0.42
-0.59
-1.32
- -
Dividend per Share
- -
- -
- -
- -
- -
Book Value per Share
-1.83
-2.53
-3.15
-10.11
4.1
Tangible Book Value per Share
-1.91
-2.56
-3.18
-10.18
4.04
Basic Weighted Avg Shares
2,359
2,359
1,892
1,892
2,393
Sales/Revenue/Turnover
- -
62
337
1,035
- -
Operating Margin (%)
-244,380.56
-1,685.31
-263.51
-101.68
- -
Depreciation Expense
176
200
119
145
- -
Net Income, GAAP
-1,474
-1,744
-1,538
-16,493
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
Profit Margin (%)
-295,453.31
-2,811.47
-456.68
-1,594.12
- -
Working Capital
2,510
1,548
800
3,853
9,063
LT Debt
13
6
21
13
7
Total Equity
-4,306
-5,970
-7,424
-23,844
9,999
Return on Invested Capital (%)
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
- -
- -
- -
- -

Capital Structure

CNY

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
ST Debt
227
224
321
LT Borrowings
- -
- -
- -
LT Finance Leases
22
13
7
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
2,359
2,359
2,439
Market Capitalization
- -
- -
129,141

Working Capital

CNY

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
Total Current Assets
3,309
4,883
10,140
Cash, Cash Equivalents & STI
2,055
2,804
6,185
Accounts Receivable, Net
38
525
1,101
Inventories
600
949
1,215
Total Current Liabilities
12,857
1,030
1,077
Payables & Accruals
- -
- -
- -
ST Debt
227
224
321
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
221.16%
Free Cash Flow
- -
- -
124.24%
Net Income, GAAP
- -
- -
972.3%
Sales/Revenue/Turnover
- -
- -
207.19%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
337
2025
- -
- -
1,035
2026
- -
- -
- -

Semi-annual Earnings Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
-0.81
2025
- -
- -
-8.72
2026
- -
- -
- -

Semi-annual Dividends Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
- -
2025
- -
- -
- -
2026
- -
- -
- -

Company Description

CEO
Wen Zhang
Full Time Employees
910
Sector
Electronic technology
Industry
Semiconductors
Address
No. 2388 Chenhang Road Room Shanghai SH China 201114
IPO Date
Jan 2, 2026
Business
Shanghai Biren Technology Co., Ltd. Publicly listed on the Hong Kong Stock Exchange (ticker 6082.HK) and headquartered in Shanghai, China, Biren Technology specializes in general-purpose intelligent computing solutions built around self-developed Biren GPUs designed for AI model training and inference, cloud and edge deployments, and data-center scale computing. The company manufactures and sells a family of GPGPU chips and related hardware platforms, including BR106, BR166, and BR110 series chips, alongside integrated intelligent computing systems; it also provides software platforms and services through its BIRENSUPA ecosystem for AI development, optimization, and deployment. Biren’s operations span domestic China and international markets, with distribution, solution integration, and support activities targeting AI data centers, telecommunications, fintech, energy and utilities, and internet services. Founding year is not explicitly disclosed in the cited sources, and headquarters are located in Shanghai, China. Core offerings include self-developed GPU hardware, intelligent computing clusters, software platforms for AI training and inference, cloud-to-edge deployment solutions, and related professional services such as development and optimization support; the company also engages in related financing and strategic activities typical of high-growth AI infrastructure providers. Recent notable developments include listing on the HKEX; strategic partnerships and alliances in AI hardware and software ecosystems; continued expansion of intelligent computing clusters nationwide; and ongoing product launches and enhancements within the Biren-branded GPU and software platform family. Biren maintains subsidiaries and corporate relationships to support its manufacturing, R&D, and go-to-market activities, and it has faced regulatory and export controls considerations as part of its international operations.