HG Semiconductor Limited

HG Semiconductor Limited

HHKEX:6908
0.22
HKD
-0.01
(-4.31%)
260.52MMarket Cap
Apr 01Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.26
0.38
0.45
0.28
0.49
0.58
0.29
0.25
0.15
0.13
0.09
0.11
- -
Basic EPS, GAAP
0.01
0.02
0.02
0.03
0.06
0.04
0.01
-0.89
-0.17
-0.23
-0.2
-0.12
- -
Free Cash Flow per Basic Share
-0.04
0.06
-0.03
-0.06
0.11
-0.07
-0.07
-0.14
-0.28
-0.2
-0.1
-0.08
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
0.1
0.13
0.27
0.3
0.36
0.4
0.41
1.04
0.98
0.87
0.72
0.52
0.4
Tangible Book Value per Share
0.1
0.13
0.27
0.29
0.36
0.4
0.41
0.93
0.86
0.87
0.72
0.52
0.4
Basic Weighted Avg Shares
417
313
313
417
417
417
417
505
592
664
796
925
417
Sales/Revenue/Turnover
110
119
142
117
204
243
122
126
88
89
75
98
- -
Operating Margin (%)
10.59
11.58
9.64
11.43
14.21
9.4
5.63
-57.46
-114.36
-103.37
-197.06
-130.28
- -
Depreciation Expense
2
2
3
4
4
5
7
9
13
19
17
23
- -
Net Income, GAAP
5
8
6
13
24
17
5
-447
-101
-151
-157
-113
- -
Effective Tax Rate (%)
31.25
37.19
54.75
4.9
17.7
25.13
28.64
- -
- -
- -
- -
- -
- -
Profit Margin (%)
4.91
6.52
4.15
10.99
11.73
7.1
3.74
-354.24
-115.73
-170.12
-208.31
-115.48
- -
Working Capital
23
36
96
104
130
136
136
276
189
284
203
181
136
LT Debt
- -
- -
- -
- -
- -
2
1
18
11
5
4
4
1
Total Equity
42
53
115
126
150
168
172
609
610
721
578
505
168
Return on Invested Capital (%)
- -
7.78
6.37
9.95
17.16
10.03
2.58
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
14.35
6.5
10.18
17.33
10.53
2.75
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
16.21
7.02
10.69
17.33
10.87
2.69
-114.35
-16.84
-23.6
-25.61
-21.9
- -

Capital Structure

CNY

•

in mil. unless spec.
Sep'19
Dec'19
Jun'20
ST Debt
- -
15
9
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
2
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
417
417
417
Market Capitalization
298
244
237

Working Capital

CNY

•

in mil. unless spec.
Sep'19
Dec'19
Jun'20
Total Current Assets
- -
212
170
Cash, Cash Equivalents & STI
- -
43
4
Accounts Receivable, Net
- -
132
128
Inventories
- -
23
25
Total Current Liabilities
- -
76
34
Payables & Accruals
- -
- -
- -
ST Debt
- -
15
9
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
39.87%
47.94%
-12.64%
Free Cash Flow
-18.83%
39.94%
-11.35%
Net Income, GAAP
-986.58%
-1,988.97%
-28.01%
Sales/Revenue/Turnover
3.48%
-2.23%
29.86%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
89
2024
- -
- -
75
2025
- -
- -
98

Semi-annual Earnings Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
-0.23
2024
- -
- -
-0.2
2025
- -
- -
-0.12

Semi-annual Dividends Per Share

CNY

•

in mil. unless spec.

Year

H1
H2
FY
2023
- -
- -
- -
2024
- -
- -
- -
2025
- -
- -
- -

Company Description

CEO
Wenguo
Full Time Employees
162
Sector
Electronic technology
Industry
Semiconductors
Address
China Merchants Tower Zhuhai GD China
IPO Date
Dec 30, 2016
Business
HG Semiconductor Limited operates as an investment holding company, primarily involved in the design, development, manufacturing, and distribution of semiconductor products. The company focuses on light-emitting diode (LED) components, including various LED beads and related lighting goods. Concurrently, it has strategically expanded into advanced third-generation semiconductor technologies, particularly Gallium Nitride (GaN)-based components and fast charging solutions. These offerings cater to a diverse array of sectors, spanning consumer electronics, automotive applications, data centers, and renewable energy, alongside traditional customers in LED module and LCD panel manufacturing. The firm also offers subcontracting services within the semiconductor industry. Formerly known as HongGuang Lighting Holdings Company Limited, the entity adopted the name HG Semiconductor Limited in September 2021, reflecting its strategic pivot towards cutting-edge semiconductor materials. Headquartered in Zhuhai, People's Republic of China, the company was established in 2010.